JP3263745B2 - Peeling method, peeling device and semiconductor manufacturing method for peeling protective sheet from flexible substrate - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for separating a protective sheet from a flexible substrate, and more particularly to a method for removing (cutting out) a flexible substrate without disturbing the protective sheet. A method of peeling a protective sheet from a flexible substrate, a peeling device used for the same, and a flexible semiconductor device.
The present invention relates to a method for manufacturing a semiconductor including a step of fixing a shibble substrate .

[0002]

2. Description of the Related Art As shown in FIG. 3, a flexible substrate 1 called an FPC or the like is often adhered on a base sheet 2 and its surface is protected by a protective sheet 3 to form a film 4. Then, it is stored in a state wound on the reel 5 and shipped. Reference numeral 6 denotes an anisotropic conductive film formed on the surface of the flexible substrate 1.

Therefore, when the flexible substrate 1 is used, it is necessary to peel off the protective sheet from the film wound on the reel 5 and then take out (cut out) the flexible substrate from the base sheet.

[0004] Conventionally, the peeling of the protective sheet has been performed using a peeling device as shown in FIG. 4, reference numeral 7 denotes a take-up reel for winding the protective sheet 3;
Reference numeral 17 denotes a roller, and reference numeral 18 denotes a removal unit for taking out the flexible substrate 1. Conventionally, the film 4 wound on the supply reel 5 is guided to the vicinity of the removal portion 18 by rollers 8 to 12, where the protective sheet 3 is peeled off from the film 4 by the roller 13, and the protective sheet 3 is further rolled by rollers 14 to 17 To take up on the protective sheet take-up reel 7.

[0005]

According to the conventional peeling technique, a flexible substrate 1 is provided on a base sheet 2.
The film 4 protected by the protective sheet 3 is adhered to the flexible substrate removing portion 18 by the rollers 8 to 12 as it is.
Since it leads to the vicinity, on the way to it, the protective sheet 3,
In many cases, 3a and 2a were generated on the base sheet 2, and the film 4 could not be smoothly conveyed.

The present invention has been made to solve such a problem, and an object of the present invention is to prevent a situation in which a protective sheet cannot be smoothly separated from a flexible substrate due to a film being twisted.

[0007]

According to a first aspect of the present invention, there is provided a method for peeling a sheet.
When the film is pulled out from the supply reel or immediately thereafter, the protective sheet is peeled off from the base sheet, and then the base sheet is fed, and then the flexible substrate is removed from the base sheet. 3. A supply reel for winding a film in which a flexible substrate bonded to a base sheet and a protective sheet for protecting the flexible substrate are integrated, and the film wound on the supply reel. And a protection sheet pull-out path for directly pulling out the protection sheet from the film wound on the supply reel.

According to a third aspect of the present invention, there is provided the peeling device according to the second aspect, wherein each of the rollers forming the base sheet withdrawal path is not in contact with the flexible substrate on the surface of the base sheet. A peeling device according to a fourth aspect of the present invention is the peeling device according to the third aspect, wherein at least each of the rollers that form the base sheet withdrawing path and that comes into contact with the base sheet on the flexible substrate side has a smaller diameter at the intermediate portion than at both ends. It has a stepped structure for escaping the substrate.

According to a fifth aspect of the present invention, in the peeling device of the fourth aspect, the width of the intermediate portion of the stepped structure roller which escapes the flexible substrate is wider than the width of the flexible substrate, and the depth is greater than the thickness of the flexible substrate. It is characterized by being enlarged. A semiconductor manufacturing method according to claim 6, wherein
The flexible substrate and the flexible substrate
A protective sheet that protects the board is integrated and wound around the supply reel.
When pulling out the film from the supply reel
Or immediately afterwards, peel off the protective sheet from the base sheet
And then feed the base sheet
Remove the flexible substrate from the sheet,
The semiconductor substrate is fixed to the semiconductor device.

[0010]

According to the first aspect of the present invention, since the protective sheet is immediately separated from the base sheet for the film fed from the supply reel, the film is distorted between the base sheet and the protective sheet. Can be prevented, and smooth peeling and removal of the flexible substrate can be performed. According to the peeling device of the second aspect, since the protective sheet is peeled from the base sheet immediately on the film fed from the supply reel, it is possible to prevent the film from being twisted between the base sheet and the protective sheet. It is possible to prevent the peeling and smooth removal of the flexible substrate.

According to the third aspect of the present invention, since each roller forming the base sheet pull-out path does not come into contact with the flexible substrate, the film on the surface of the flexible substrate adheres to the roller and becomes dirty. There is no danger of soiling the surface. According to the peeling device of the fourth aspect, since each roller in contact with the surface of the base sheet on the flexible substrate has a stepped structure in which the flexible substrate escapes, the film on the surface of the flexible substrate adheres to the roller and becomes dirty. However, there is no fear that the surface of the flexible substrate is contaminated.

According to the fifth aspect of the present invention, since the width of the intermediate portion of the roller that escapes the flexible substrate is wider than the width of the flexible substrate and the depth is greater than the thickness of the flexible substrate, the roller comes into contact with the flexible substrate. The fear can be completely eliminated. A method of manufacturing the semiconductor according to claim 6.
According to the method, the film wound on the supply reel is supplied to the supply reel.
When pulling out from the supply reel or immediately after
Remove the protective sheet from the sheet, and then
Remove the flexible board from the feed sheet and
Is fixed to the semiconductor device.
To prevent twisting between the protective sheet and the protective sheet.
Smooth peeling and flexible substrate removal
It can be removed, and semiconductors can be manufactured smoothly.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A peeling method and a peeling device for peeling a protective sheet from a flexible substrate according to the present invention will be described in detail with reference to the illustrated embodiments. FIG. 1 is a schematic configuration diagram of a peeling device showing one embodiment of the present invention. In FIG. 1, reference numeral 5 denotes bonding a flexible substrate 1 (there is a large number, but only one flexible substrate 1 is shown in the figure) to the surface of the protective sheet 2, and bonding a protective sheet 3 for protecting the flexible substrate 1 to the protective sheet 2. The supply reel (see FIG. 3), on which the film 4 is wound, is attached to the base sheet 2 on which the flexible substrate 1 is adhered from the film 4 wound on the supply reel 5. These are rollers that form a base sheet pull-out path 19 that is pulled out in a state where the sheet is drawn.

The flexible board 1 adhered to the base sheet 2 is removed (cut out) from the base sheet 2 at a flexible board removing section 18 that has passed the base sheet drawing path 19. Base sheet withdrawal path 19
Among the rollers 8, 9, 10 and 11 forming the rollers, at least the rollers 8, 9 and 11 which are in contact with the surface of the base sheet 2 on the flexible substrate 1 side have a stepped shape as shown in FIG. That is, the diameter of the intermediate portion 20 is smaller than that of both ends.

The reason why the rollers 8, 9 and 11 have a stepped shape is that the flexible substrate 1 on the surface of the base sheet 2, especially the anisotropic conductive film 6 on the surface thereof does not contact the surfaces of the rollers 8, 9 and 11. The intermediate portion 20 serves as an escape portion of the semiconductor device. The width of the escape portion 20 is wider than the width of the flexible substrate 1 bonded to the base sheet 2,
It is smaller than the width of the base sheet 2. The depth of the escape portion 20 is deeper than the thickness of the flexible substrate 1.

Reference numerals 12, 15, 16 and 17 denote rollers for forming a base sheet drawing path 21 for drawing the base sheet 3 protecting the flexible substrate 1 from the film 4 wound on the supply reel 5. The protective sheet 3 drawn out by the winding reel 7 is wound up by a winding reel 7.

In the present peeling method and peeling apparatus, the base sheet 2 is directly transferred from the film 4 wound on the supply reel 5.
And the protective sheet 3 are separated and pulled out, so that there is no possibility of occurrence of skewing as in the conventional case of drawing out without separating. Therefore, the flexible substrate can be taken out (cut out) without any trouble.

Each of the rollers 8, 9, 10, 11 forming the base sheet pull-out path 19 is
Therefore, there is no danger that the film on the surface of the flexible substrate adheres to the roller and becomes dirty, and the dirt contaminates the surface of the flexible substrate. In the above-described peeling method, the protective sheet 3 was peeled from the base sheet 2 when the film 4 was pulled out.
The base sheet 2 and the protective sheet 3 may be peeled off immediately after drawing out.

[0019]

According to a first aspect of the present invention, there is provided a method for peeling a protective sheet from a flexible substrate, wherein the protective sheet is peeled from the base sheet when the film is pulled out from the supply reel or immediately thereafter, and then the base sheet is fed. The flexible substrate is taken out (cut out) from the base sheet. Therefore, according to the peeling method of the first aspect, since the protective sheet is peeled from the base sheet immediately with respect to the film fed from the supply reel, a warp occurs between the base sheet and the protective sheet of the film. Can be prevented, and smooth peeling and removal of the flexible substrate can be performed.

According to a second aspect of the present invention, there is provided a peeling device for peeling a protective sheet from a flexible substrate, comprising: a supply reel for winding a film in which a flexible substrate bonded to a base sheet and a protective sheet for protecting the flexible substrate are integrated; A base sheet drawing path for directly drawing a base sheet from the film wound on the supply reel, and a protection sheet drawing path for directly drawing a protection sheet from the film wound on the supply reel. Is what you do. Therefore, according to the peeling device of the second aspect, since the protective sheet is immediately peeled from the base sheet for the film fed from the supply reel, the film may be twisted between the base sheet and the protective sheet. Can be prevented, and smooth peeling and removal of the flexible substrate can be performed.

According to a third aspect of the present invention, there is provided a peeling device for peeling a protective sheet from a flexible substrate, wherein each roller forming a base sheet drawing-out path is not in contact with the flexible substrate on the surface of the base sheet. . Therefore, according to the peeling device of the third aspect, since each roller forming the base sheet pull-out path does not contact the flexible substrate, the film on the surface of the flexible substrate adheres to the roller and becomes dirty. There is no risk of soiling.

According to a fourth aspect of the present invention, there is provided a peeling device for peeling a protective sheet from a flexible substrate, wherein at least each of rollers forming a base sheet pull-out path, which is in contact with a surface of the base sheet on the flexible substrate side, has a diameter smaller than both ends. And a stepped structure for escaping the flexible substrate at the portion. Therefore, according to the peeling device of the fourth aspect, each roller contacting the base sheet and the flexible substrate side has a stepped structure in which the flexible substrate escapes at an intermediate portion having a smaller diameter than both end portions. There is no fear that the film adheres to the roller and becomes dirty, and that the soil conversely stains the surface of the flexible substrate.

According to a fifth aspect of the present invention, in the peeling device for peeling the protective sheet from the flexible substrate, the width of the intermediate portion of the stepped structure roller which escapes the flexible substrate is wider than the width of the flexible substrate, and the depth is greater than the thickness of the flexible substrate. It is characterized by being enlarged. Therefore, according to the peeling device of the fifth aspect, the width of the intermediate portion of the roller that escapes the flexible substrate is wider than the width of the flexible substrate, and the depth is greater than the thickness of the flexible substrate. Can be completely eliminated. The method of manufacturing a semiconductor according to claim 6 is the method of
The bonded flexible substrate and the flexible substrate
The protective sheet to protect
When pulling out the film from the supply reel
Immediately after removing the protective sheet from the base sheet,
After feeding the base sheet,
From the flexible substrate,
Is fixed to the semiconductor device. Therefore,
According to the semiconductor manufacturing method of claim 6, the semiconductor device is wound on a supply reel.
When pulling out the taken film from the supply reel
Immediately remove the protective sheet from the base sheet
Then remove the base sheet from the feed sheet
Remove the shibble substrate and fix it to the semiconductor device.
Between the base sheet and the protective sheet of the film
Can be prevented and smooth peeling and
And the flexible substrate can be removed, and the semiconductor
Can be manufactured.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a peeling device showing one embodiment of the present invention.

FIG. 2 is an enlarged front view of the roller of the embodiment.

FIG. 3 is a side view showing a supply reel and a film.

FIG. 4 is a schematic configuration diagram of a peeling device showing a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Flexible board 2 Base sheet 3 Protective sheet 4 Film 5 Supply reel 8 (9, 11) Roller of paragraph structure 18 Flexible board take-out part 19 Base sheet draw-out path 20 Intermediate part which escapes flexible board 21 Protective sheet draw-out path

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) B65H 41/00 B65H 75/14 H05K 13/02

Claims (6)

(57) [Claims] 1. The method according to claim 1, wherein the flexible substrate bonded to the base sheet and a protection sheet for protecting the flexible substrate are integrated with each other when the film wound on the supply reel is pulled out from the supply reel or immediately thereafter. A method of peeling a protective sheet from a flexible substrate, comprising: removing the protective sheet from the sheet; thereafter, feeding the base sheet and then removing the flexible substrate from the base sheet. 2. A supply reel for winding a film in which a flexible substrate bonded to a base sheet and a protection sheet for protecting the flexible substrate are integrated, and a base directly from the film wound on the supply reel. A peeling apparatus for peeling a protective sheet from a flexible substrate, comprising: a base sheet pulling path for drawing a sheet; and a protective sheet pulling path for directly drawing a protective sheet from the film wound on the supply reel. 3. The peeling device for peeling a protective sheet from a flexible substrate according to claim 2, wherein each roller forming the base sheet pull-out path is not in contact with the flexible substrate on the surface of the base sheet. 4. A roller having a stepped structure in which at least a roller in contact with the base sheet on the flexible substrate side among the rollers forming the base sheet pull-out path has a smaller diameter than the both ends to escape the flexible substrate having a smaller diameter. The peeling device for peeling a protective sheet from a flexible substrate according to claim 3. 5. The flexible printed circuit according to claim 4, wherein the width of the intermediate portion of the stepped structure roller which escapes the flexible substrate is wider than the width of the flexible substrate, and the depth is larger than the thickness of the flexible substrate. Peeling device for peeling protective sheet from flexible substrate 6. A flexible substrate is fixed to a semiconductor device.
A flexible substrate bonded on a base and the flexible substrate.
The protection sheet that protects the
Pull out the film wound on the supply reel from the supply reel
At or immediately after the base sheet
And then feed the base sheet , and then
Remove the flexible substrate from preparative, characterized in that securing the flexible substrate in a semiconductor device
Semiconductor manufacturing method