JPH05201479A - Electronic component carrier - Google Patents

Abstract

PURPOSE:To provide an electronic component carrier tape which can well reduce deformation of an electronic component housing hole even if torsional moment is applied, well prevent deformation and damage of the carried electronic component and carry the electronic component safely. CONSTITUTION:A plastic tape body 1 equipped with electronic component housing holes 3 with constant intervals is characterized by thinning of portions 5 between the electronic component housing holes. The thinning may include grooving, notch machining, hole making, etc., to be used.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier for electronic parts used when carrying electronic parts such as ICs to a mounting machine.

[0002]

2. Description of the Related Art When an electronic component such as an IC is mounted on a circuit board, a tape carrier system is usually used to convey the electronic component to a mounting machine. That is, a carrier tape having electronic component accommodating portions at regular intervals and a feed hole formed in one side
An electronic component is accommodated in the electronic component accommodating portion of the base, the electronic component-carrying carrier tape is wound around a reel, and the electronic component-carrying carrier tape is fed from the reel by a feeding roll. The pin of the reel and the feed hole of the carrier tape are engaged with each other, and the carrier tape thus carried is carried into the electronic component mounter.

Various types of electronic component carrier tapes have been proposed, but an electronic component housing hole is punched at a constant interval in a plastic tape and is fed to one side of the tape. It is advantageous that the hole is punched, the electronic component is accommodated in the electronic component accommodating hole, and the non-adhesive cover tape is lightly fused on both surfaces of the tape because the machining is easy.

In the electronic component carrier tape, bending moment is received during winding on the reel, pulling out from the reel, and passing through the roll during transportation. Therefore, the polar radius such as the reel diameter is limited so that the electronic component is not adversely affected by bending strain.

[0005]

By the way, during the traveling of the above-mentioned carrier tape, the traveling direction of the tape must be changed not only in the thickness direction of the tape but also in the width direction of the tape. However, in this case, the action of the torsional movement is unavoidable in addition to the bending moment described above.

However, in the above-mentioned punching-type electronic component carrier tape, the electronic component accommodating portion is formed by a hole, and the torsional rigidity of the electronic component accommodating portion has a straight portion between the electronic component accommodating holes. Since the torsional rigidity is significantly lower than that of No. 1, when the torsional moment acts, the electronic component accommodating hole is significantly deformed, and the inner shape of the hole becomes a rhombus.
Under such deformation, the lead conductor of the electronic component (which has been packaged) is bent, the lead conductor interval is changed, and the mounting accuracy may be deteriorated.

Further, when it is used for transporting an unpackaged electronic component, the electronic component element may be damaged.

The object of the present invention is to reduce deformation of the electronic component housing hole well even when a torsion moment acts, and prevent deformation and damage of the carried electronic component satisfactorily. It is to provide an electronic component carrier tape that can be transported.

[0009]

According to the present invention, there is provided a carrier for electronic parts, which is a plastic tape body having holes for holding electronic parts at regular intervals, in which a portion between the holes for receiving electronic parts is thinned. This is a characteristic configuration, and groove reduction processing, notch processing, drilling processing, etc. can be used for the thickness reduction processing.

[0010]

Even if the torsional moment acts, the thinned portion between the electronic component accommodating holes is twisted and deformed, and the torsional moment transmitted to the electronic component accommodating hole can be reduced by that much.
The deformation of the electronic component housing hole can be sufficiently prevented.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1A is a plan view showing an embodiment of the present invention,
1B is a cross-sectional view taken along line A-B of FIG. 1, and FIG. 1C is a cross-sectional view taken along line A-B of FIG.

In FIGS. 1 (a) to 1 (c), 1 is a plastic tape body, and a conductive plastic compounded with conductive particles such as carbon is used to prevent the generation of frictional static electricity. You can also do it. Reference numerals 2 and 2 are non-sticky heat-fusible adhesive layers applied to both surfaces of the plastic tape 1. Denoted by 3 ... are electronic component accommodating holes formed in the plastic tape body 1 at regular intervals, and 4, ... , These holes 3, ... And 4, ... Are simultaneously processed by punching. 5, electronic component housing holes 3,
It is a groove as a reduced-thickness portion processed in the portion between 3.

FIG. 2A is a vertical sectional view showing the use state of the electronic component carrier, and FIG. 2B is a sectional view taken along the line of FIG. 2A showing the same state. The electronic component A is accommodated in the electronic component accommodating hole 3, and the non-adhesive cover films 6 and 6 are lightly adhered to both surfaces by heat fusion.

In FIG. 2, when the twisting moment M acts on the carrier for electronic parts, the thinning part 5 between the electronic part accommodating holes 3 and 3 is twisted due to the notch effect due to the thinning.
Ment acts intensively and the notched portion can be largely twisted and deformed in a concentrated manner, so that the transmission of the twisting moment to the electronic component housing hole 3 can be well suppressed, and the electronic component housing hole 3 is deformed. Can be reduced that much. Therefore, the deformation of the inner shape of the electronic component housing hole 3 can be well prevented.

Further, also for the bending moment, the bending moment acts intensively on the thinned portion 5 between the electronic component accommodating holes 3, 3 due to the notch effect due to the thinning, The notch can be intensively bent and deformed,
Since the bending strain in the electronic component housing hole 3, and hence the bending strain received by the electronic component A, can be reduced, the allowable polar radius of the carrier tape can be reduced, and the reel can be downsized.

In the above, the groove 5 as the thinned portion is shown in FIG.
As shown in FIG. 2, a plurality of plastic tape bodies 1 may be provided on each surface. In FIG. 3, 2 indicates a non-adhesive heat-meltable adhesive layer, and 3 indicates an electronic component housing hole. The groove 5 as the thinned portion may be provided only on one surface of the plastic tape body 1.

FIG. 4A is a plan view showing another embodiment of the present invention, in which the portion between the electronic component accommodating holes 3 and 3 of the plastic tape body 1 is notched at both edges of the tape. The thickness is reduced by the process of 5.

FIG. 4B is a plan view showing another embodiment of the present invention, in which a portion of the plastic tape body 1 between the electronic component receiving holes 3 and 3 is opened. The thickness has been reduced by processing (indicated by reference numeral 5).

In FIGS. 4A and 4B, 4,
... indicates a feed hole.

In the present invention, the thinning processing between the electronic component accommodating holes can be performed by a combination of grooving processing, notching processing, and punching processing.

[0021]

The carrier for electronic parts of the present invention is constructed as described above, and even if the twisting moment acts on the twisting moment in the electronic parts carrier tape formed by punching. The deformation of the electronic component housing hole can be well suppressed, and during the transfer of the package electronic component, the spacing fluctuation between the lead conductors due to the bending deformation of the lead conductor of the electronic component is prevented, and the mounting reliability is improved. It can be maintained, and in the transportation of unpackaged electronic components, it can be safely transported without damaging the elements of the electronic components.

[Brief description of drawings]

1A is a plan view showing an embodiment of the present invention, FIG.
1B is a cross-sectional view taken along line A-B of FIG. 1, and FIG. 1C is a cross-sectional view taken along line A-B of FIG.

2 (a) is a longitudinal sectional view showing a usage state of a carrier for electronic parts according to the present invention, and FIG. 2 (b) is a roll of FIG. 2 (a) showing the usage state. It is drawing which shows a cross section.

FIG. 3 is a sectional view showing another embodiment of the present invention.

FIG. 4 is a plan view showing another different embodiment of the present invention.

[Explanation of symbols]

 1 Plastic tape body 3 Electronic component accommodation hole 5 Thinned portion

Claims (4)

[Claims] 1. A carrier for electronic parts, characterized in that, in a plastic tape body provided with electronic part housing holes at regular intervals, a portion between the electronic part housing holes is thinned. 2. The carrier for electronic parts according to claim 1, wherein the thinning process is a grooving process. 3. The carrier for electronic parts according to claim 1, wherein the thinning processing is notching processing. 4. The carrier for electronic parts according to claim 1, wherein the thinning processing is punching processing.