JPS63125169A - Taping device for electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a taping device for electronic components.

``Prior art'' Conventionally, when an assembly of electronic components taped together is wound around a reel, when the electronic components are pulled out during use, the external shape changes due to the entanglement of the electronic components, and furthermore, automatic failure occurs due to the inability to pull out the electronic components. Electrons are wrapped in layers to prevent the loading machine from stopping.

Interlayer materials such as paper were inserted between the parts.

FIG. 4 is a side view of an example of a conventional taping device for electronic components.

In FIG. 4, 1 is a reel rotatably supported on a reel shaft 2, 3 is an electronic component for automatic loading, 4 is a tape mount to which the electrode leads of the electronic component 3 are adhered, and 5 is an interlayer material.

Usually, the thickness of the tape mount 4 used is about 0.55 mm, whereas the thickness of the electronic component 3 is as thick as 2 to 5 mm, although it varies depending on the type of electronic component.

FIG. 5 is a perspective view of the interlayer material of FIG. 4.

When using an interlayer material 5 having a thickness similar to that shown in FIG. reel 1
When the electrode lead is wrapped around the outer periphery of the tape, the electrode lead becomes bent due to the difference in thickness between the electronic component 3 and the tape mount 4.

If it is transported and stored in this state, the adhesion to the tape mount may become uncertain or the electrode lead may become bent.

[Problem that the invention seeks to solve]

In the conventional electronic component taping device described above, the thickness of the interlayer material is uniform, so the difference in thickness between the tape mount and the electronic component can lead to uncertain adhesion of the electrode lead or bending of the electrode lead. It has the disadvantage of being

[Means for solving problems]

The electronic component taping device of the present invention includes a reel rotatably supported on a shaft, a tape mount to which electrode leads of the electronic component are adhered, and a tape mount inserted under the tape mount and the electronic component. and an electronic component assembly wound around the outer periphery of the reel.

〔Example〕

FIG. 1 is a side view of the first embodiment of the present invention, and FIG. 2 is a side view of the first embodiment of the present invention.
FIG. 3 is a perspective view of the interlayer material shown in FIG.

The difference between the first embodiment shown in FIG. 1 and the conventional example shown in FIG. .

As shown in FIGS. 1 and 2, in the first embodiment, the thickness of the interlayer material 6 such as paper is made thicker in the portion contacting the tape mount 4 than in the portion contacting the electronic component 3.

By changing the thickness of the interlayer material 6 in this way, it is possible to prevent the electrode leads of the electronic component 3 from bending as in the conventional case.

FIG. 3 is a side view of a second embodiment of the invention.

As shown in FIG. 3, in the second embodiment, the thickness of the interlayer material 7 is increased not only on the side that contacts the tape mount 4 but also on the opposite side. As a result, the electrode leads of the electronic component 3 are sandwiched from above and below when the electronic component 3 is wound around the reel 1, and the adhesion of the electrode leads to the tape mount 4 is further ensured.

〔Effect of the invention〕

As explained above, the taping device for electronic components of the present invention is designed to increase the thickness of the interlayer material at least in the part that contacts the tape mount, thereby reducing the amount of electronic components caused by the difference in thickness between the electronic component and the tape mount. Since it is possible to prevent the electrode leads of the parts from peeling off or bending, it is possible to prevent the automatic loading machine from stopping.

[Brief explanation of the drawing]

FIG. 1 is a side view of the first embodiment of the present invention, and FIG. 2 is a side view of the first embodiment of the present invention.
3 is a side view of the second embodiment of the present invention, FIG. 4 is a side view of an example of a conventional taping device for electronic components, and FIG. 5 is a perspective view of the interlayer material shown in FIG. 4. It is a perspective view of the material. DESCRIPTION OF SYMBOLS 1... Reel, 2... Reel shaft, 3... Electronic component, 4... Tape mount, 5, 6.7... Interlayer material.

Claims (1)

[Claims] a reel rotatably supported on a shaft; a tape mount to which electrode leads of an electronic component are adhered; and an interlayer between the tape mount and the interlayer, which is inserted under the electrical component and is thick at least at a portion that contacts the tape mount. and an electronic component assembly wound around the outer periphery of the reel.