JPH01172182A - Bonding metal wire winding member - Google Patents

Bonding metal wire winding member

Info

Publication number
JPH01172182A
JPH01172182A JP62330591A JP33059187A JPH01172182A JP H01172182 A JPH01172182 A JP H01172182A JP 62330591 A JP62330591 A JP 62330591A JP 33059187 A JP33059187 A JP 33059187A JP H01172182 A JPH01172182 A JP H01172182A
Authority
JP
Japan
Prior art keywords
metal wire
spool
bonding
winding
fixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62330591A
Other languages
Japanese (ja)
Inventor
Hisao Masuda
桝田　久雄
Eizo Ito
伊藤　栄三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62330591A priority Critical patent/JPH01172182A/en
Publication of JPH01172182A publication Critical patent/JPH01172182A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/30—Handled filamentary material
    • B65H2701/36—Wires
    • B65H2701/361—Semiconductor bonding wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Filamentary Materials, Packages, And Safety Devices Therefor (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To facilitate the attachment of a spool onto a bonding device and the connection of the leading end of a metal wire to a terminal of an electric circuit by paying out the leading end of at least one of two ends of the metal wire on a winding member by more than 1cm from a metal wire fixing section and by securing the same. CONSTITUTION:Both end parts of a metal wire 3 to be wound on a spool 1 are secured to an edge part 1a of the spool by means of fixing tapes 2a, 2b. The length of wind-up initiation part 4 of the metal wire 3 fixed by the fixing tape 2b is such that the taps is cut more than 1cm before the stationary tape 2b. Accordingly, it is possible to eliminate the necessity of such a process that the wind-up initiation part is loosened and is then attached to the spool attaching section in a bonding device, and thereby it is possible to facilitate the attachment thereof. Further, the wind-up initiation section 4 can be connected to a terminal of an electronic circuit without the fixing tape 2 being peeled off.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、ボンディング用金属線の巻回体に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wound body of metal wire for bonding.

〔従来の技術〕[Conventional technology]

第２図は、スプールに金属線を巻いた従来のを同体を示
す図であり、図において、１はスプール、１ａはその縁
部、２ａ、　　２ｂは金属線固定テープ、３は金属線、
４は金属線の巻初め部分、５は金属線の巻終り部分であ
る。FIG. 2 is a diagram showing a conventional spool with a metal wire wound around it. In the figure, 1 is the spool, 1a is its edge, 2a and 2b are metal wire fixing tapes, 3 is a metal wire,
4 is the beginning of winding of the metal wire, and 5 is the end of winding of the metal wire.

第３図はスプールをボンディング装置のスプール取付部
に取付た図で、図において、１はスプール、３は金属線
、４は金属線の巻初め部分、６はボンディング装置のス
プール取付部、７は電気回路の端子である。Figure 3 is a diagram showing the spool attached to the spool attachment part of the bonding device. In the figure, 1 is the spool, 3 is the metal wire, 4 is the beginning of winding of the metal wire, 6 is the spool attachment part of the bonding device, and 7 is the spool attachment part of the bonding machine. It is a terminal of an electric circuit.

第２図、第３図に示すように、従来のボンディング用金
属線巻回体では金属線の巻初め部分（使用時には使用終
了部分になる）４は金属線固定テープ２ｂで止められて
おり、このテープ２ｂから金属線先端が殆んど出ていな
い。このため、スプールをボンディング装置に装着し、
金属線に電気信号を流して金属線の繰出し状況を検知す
る場合、即ち、金属線がたるんで図示しない電気回路端
子と接触し、該端子と端子７との間で電流が流れれば繰
出しが不充分と判定してモータで金属線を引出すような
場合には、テープ２ｂをはがして、巻初め部分４をほど
いてからスプール１をボンディング装置のスプール取付
部６に取付け、さらに金属線の巻初め部分４を電気回路
の端子７に接続する必要があった。As shown in FIGS. 2 and 3, in the conventional metal wire winding body for bonding, the beginning part 4 of the metal wire (which becomes the end part when used) is fixed with a metal wire fixing tape 2b. The tip of the metal wire is hardly protruding from this tape 2b. For this reason, attach the spool to the bonding device,
When detecting the feeding status of a metal wire by sending an electric signal to the metal wire, in other words, if the metal wire becomes slack and comes into contact with an electrical circuit terminal (not shown), and a current flows between the terminal and the terminal 7, the feeding is detected. If it is determined that the wire is insufficient and the metal wire is to be pulled out by the motor, remove the tape 2b, unwind the beginning portion 4, attach the spool 1 to the spool attachment part 6 of the bonding device, and then unwind the metal wire. It was necessary to connect the first part 4 to the terminal 7 of the electrical circuit.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

従来のボンディング用金属線巻回体の金属線の巻き方で
は、スプールのボンディング装置への取付は時に金属線
固定テープ２ｂをはがすという手間がかかるうえに、金
属線をほどき過ぎたり、金属線に触れて汚染してしまう
等の作業ミスが発生しやすいという問題点があった。In the conventional way of winding the metal wire of the metal wire winding body for bonding, attaching the spool to the bonding device sometimes takes time and effort to peel off the metal wire fixing tape 2b, and also causes the metal wire to unravel too much or There was a problem in that it was easy for work errors to occur, such as touching the surface and contaminating it.

この発明は、上記のような従来のものの問題点を解消す
るためになされたもので、スプールのボンディング装置
への取付けをスムーズにし、また作業ミスを減らすこと
のできるボンディング用金属線巻回体を得ることを目的
としている。This invention was made in order to solve the problems of the conventional ones as described above, and provides a metal wire wound body for bonding that can smoothly attach a spool to a bonding device and reduce work errors. The purpose is to obtain.

〔問題点を解決するための手段〕[Means for solving problems]

この発明に係るボンディング用金属線巻回体は、金属線
をスプールに巻く際に巻初めまたは巻終りのいずれか一
方の金属線先端部分を金属線固定部から１ｃｍ以上出す
ようにしたものである。The metal wire winding body for bonding according to the present invention is such that when winding the metal wire onto a spool, the tip of the metal wire at either the beginning or the end of the winding protrudes by 1 cm or more from the metal wire fixing part. .

〔作用〕[Effect]

この発明においては、ボンディング用金属線は、巻初め
または巻終りのいずれか一方の金属線先端部分を金属線
固定部から１ｃｍ以上出すようにしているので、金属線
先端を電気回路に接続するときスプールのボンディング
装置への取付けがスムーズにしかもミスを少なくできる
。In this invention, the metal wire for bonding is designed so that the tip of either the beginning or the end of the winding protrudes from the metal wire fixing part by 1 cm or more, so when the metal wire tip is connected to an electric circuit. The spool can be attached to the bonding device smoothly and mistakes can be reduced.

〔実施例〕〔Example〕

以下、この発明の実施例を図について説明する。 Embodiments of the present invention will be described below with reference to the drawings.

第１図は本発明の一実施例によるボンディング用金属線
巻回体を示し、図において、１はスプール、ｌａは縁部
、２ａ、２ｂは金属線固定テープ、３は金属線、４は金
属線の巻初め部分、５は金属線の巻終り部分である。ま
た金属線の巻初め部分は先端が金属線固定テープ２ｂか
ら１ｃｍ以上出ている。FIG. 1 shows a metal wire wound body for bonding according to an embodiment of the present invention, in which 1 is a spool, la is an edge, 2a and 2b are metal wire fixing tapes, 3 is a metal wire, and 4 is a metal wire. The starting part of the wire and 5 are the ending part of the metal wire. Further, the tip of the beginning of the winding of the metal wire protrudes from the metal wire fixing tape 2b by 1 cm or more.

この金属線の巻初め部分は、金属線をスプールに巻付け
る際に、巻初め部分を固定テープ２ｂで固定し、スプー
ル１に巻き付けたのち固定テープ２ｂより１ｃｍ以上手
前で金属線を切断することにより、容易に繰出すことが
できる。また巻終り部分を繰出す場合も同様の処理によ
り容易に繰出すことができる。When winding the metal wire around the spool, fix the beginning part of the metal wire with the fixing tape 2b, and after winding it around the spool 1, cut the metal wire at least 1 cm before the fixing tape 2b. This makes it easy to pay out. Furthermore, when the end portion of the roll is to be unrolled, it can be easily unrolled by the same process.

次に作用、効果について説明する。Next, the action and effect will be explained.

第１図中の金属線巻初め部分４（使用時には使用路り部
分になる）は金属線固定テープ２ｂから先端が１ｃｍ以
上出ている。このことにより、第３図のように金属線に
電気信号を流して金属線の繰出し状況を検知する場合で
も、従来のもののように金属線固定テープ２ｂをはがし
、金属線をほど（必要がなく、そのままの状態で取付け
、電気回路端子７に接続できるようになった。In FIG. 1, the beginning part 4 of the metal wire winding (which becomes the used part when in use) has a tip protruding from the metal wire fixing tape 2b by 1 cm or more. As a result, even when detecting the feeding status of the metal wire by sending an electric signal to the metal wire as shown in Fig. 3, there is no need to peel off the metal wire fixing tape 2b and unwind the metal wire as in the conventional method. , it is now possible to install it as is and connect it to the electric circuit terminal 7.

なお、金属線を介して電気信号を出す必要のあるときに
は、上記実施例のように電気信号により金属線の繰出し
状況を検知する場合以外のものであっても適用できるこ
とはいうまでもない。It goes without saying that when it is necessary to output an electric signal through the metal wire, the present invention can be applied to a method other than the case where the feeding status of the metal wire is detected by the electric signal as in the above embodiment.

また、金属線固定テープのスプールへの付着位置は金属
線が電気回路端子へ取付は易い所にするとさらによい。Further, it is better to attach the metal wire fixing tape to the spool at a location where the metal wire can be easily attached to the electric circuit terminal.

また、金属線先端部を固定テープから出すＩＤはスプー
ル取付部と電気回路端子との距離にあわせて適当にとる
とよい。Further, the ID of the tip of the metal wire from the fixing tape should be set appropriately depending on the distance between the spool attachment part and the electric circuit terminal.

また、金属線を電気回路端子に接続する必要のない場合
でも、このまま使用できることはいうまでもない。Furthermore, it goes without saying that even if there is no need to connect the metal wire to the electric circuit terminal, it can be used as is.

また、上記実施例では、スプールが両側に縁部を有する
場合についてのみ示したが、片側にのみ縁部を有するも
のであってもよく、上記実施例と同様の効果を奏する。Further, in the above embodiment, only the case where the spool has edges on both sides is shown, but the spool may have edges only on one side, and the same effects as in the above embodiment can be obtained.

〔発明の効果〕〔Effect of the invention〕

以上のように、この発明に係るボンディング用金属線巻
同体によれば、金属線のスプールへの巻初め部分の先端
を固定テープから１ｃｍ以上出す　　−ように構成した
ので、スプールのボンディング装置への取付け、金属線
巻初め部分先端の電気回路端子への接続が容易になり、
作業ミスも減少できる。As described above, according to the metal wire winding assembly for bonding according to the present invention, the tip of the beginning of the winding of the metal wire onto the spool is protruded by 1 cm or more from the fixing tape. Easy to install and connect to the electrical circuit terminal at the beginning of the metal wire winding.
Work errors can also be reduced.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの発明の一実施例によるボンディング用金属
線巻回体を示す図、第２図は従来の金属線をスプールに
巻いた図、第３図はスプールをボンディング装置に取付
けた装置の一例を示す図である。 図において、１はスプール、ｌａは縁部、２ａ。 ２ｂは金属線固定テープ、３は金属線、４は金属線の巻
初め部分、５は金属線の巻終り部分、６はボンディング
装置のスプール取付は部、７は電気回路の端子を示す。FIG. 1 is a diagram showing a metal wire winding body for bonding according to an embodiment of the present invention, FIG. 2 is a diagram showing a conventional metal wire wound around a spool, and FIG. 3 is a diagram showing a device in which the spool is attached to a bonding device. It is a figure showing an example. In the figure, 1 is the spool, la is the edge, and 2a. 2b is a metal wire fixing tape, 3 is a metal wire, 4 is a winding start portion of the metal wire, 5 is a winding end portion of the metal wire, 6 is a spool attachment portion of a bonding device, and 7 is a terminal of an electric circuit.

Claims (1)

【特許請求の範囲】[Claims] （１）少なくとも一端にほどけどめの縁部を有する円筒
状のスプールと、 該スプールの外周に巻き付けられており、一端から順次
巻きほどいてボンディング作業に用いるボンディング用
金属線とを備えたボンディング用金属線巻回体において
、 上記金属線の二端のうちの少なくとも一方の先端を金属
線固定部分から１ｃｍ以上繰出して固定したことを特徴
とするボンディング用金属線巻回体。(1) For bonding, comprising a cylindrical spool with an uncoiled edge at least at one end, and a bonding metal wire that is wound around the outer periphery of the spool and is used for bonding work by unwinding it sequentially from one end. A metal wire wound body for bonding, characterized in that at least one tip of the two ends of the metal wire is extended by 1 cm or more from a metal wire fixing portion and fixed.
JP62330591A 1987-12-25 1987-12-25 Bonding metal wire winding member Pending JPH01172182A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62330591A JPH01172182A (en) 1987-12-25 1987-12-25 Bonding metal wire winding member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62330591A JPH01172182A (en) 1987-12-25 1987-12-25 Bonding metal wire winding member

Publications (1)

Publication Number Publication Date
JPH01172182A true JPH01172182A (en) 1989-07-07

Family

ID=18234365

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62330591A Pending JPH01172182A (en) 1987-12-25 1987-12-25 Bonding metal wire winding member

Country Status (1)

Country Link
JP (1) JPH01172182A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03279785A (en) * 1990-03-28 1991-12-10 Kurosaki Refract Co Ltd Method of thermal spray repairing of cokes furnace carbonization wall through-pass hole
JPH04130271U (en) * 1991-05-20 1992-11-30 住友電気工業株式会社 Continuous wire winding device
JP2007099461A (en) * 2005-10-05 2007-04-19 Sumitomo Metal Mining Co Ltd Wire automatic winding device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03279785A (en) * 1990-03-28 1991-12-10 Kurosaki Refract Co Ltd Method of thermal spray repairing of cokes furnace carbonization wall through-pass hole
JPH04130271U (en) * 1991-05-20 1992-11-30 住友電気工業株式会社 Continuous wire winding device
JP2007099461A (en) * 2005-10-05 2007-04-19 Sumitomo Metal Mining Co Ltd Wire automatic winding device
JP4524660B2 (en) * 2005-10-05 2010-08-18 住友金属鉱山株式会社 Automatic wire winding device

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