JPH05310283A - Structure for taping electronic parts - Google Patents
Structure for taping electronic partsInfo
- Publication number
- JPH05310283A JPH05310283A JP11094292A JP11094292A JPH05310283A JP H05310283 A JPH05310283 A JP H05310283A JP 11094292 A JP11094292 A JP 11094292A JP 11094292 A JP11094292 A JP 11094292A JP H05310283 A JPH05310283 A JP H05310283A
- Authority
- JP
- Japan
- Prior art keywords
- tape member
- tape
- taping
- electronic components
- electronic parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packages (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、部品本体から同一方向
に複数のリード線を導出した複数のラジアルリード型電
子部品を、定ピッチで並列に並べた状態で各リード線先
端部をテーピングしたテーピング構体に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention According to the present invention, a plurality of radial lead type electronic components, in which a plurality of lead wires are led out in the same direction from a component body, are arranged in parallel at a constant pitch, and the leading ends of the respective lead wires are taped. Regarding taping structure.
【０００２】[0002]
【従来の技術】一般に、タンタルコンデンサなどの小形
のラジアルリード型電子部品は、多数個が長尺なテープ
部材でテーピングされた状態で保管、運搬され、実装機
でプリント基板などに自動実装される。2. Description of the Related Art Generally, many small radial lead type electronic parts such as tantalum capacitors are stored and transported in a state of being taped with a long tape member, and are automatically mounted on a printed circuit board or the like by a mounting machine. ..
【０００３】かかる電子部品のテーピング構体の一例を
図３及び図４に示す。同図のテーピング構体（10）は、
複数のラジアルリード型電子部品（11）をテープ部材
（12）で並列に連結している。An example of such a taping structure for electronic parts is shown in FIGS. The taping structure (10) in the figure is
A plurality of radial lead type electronic components (11) are connected in parallel by a tape member (12).
【０００４】電子部品（11）は、樹脂モールドなどされ
た部品本体（13）から同一方向に２本のリード線（14）
を平行に導出する。テープ部材（12）は、長尺な幅広の
帯板状の台紙（15）の片面に幅狭の粘着テープ（16）を
貼着した構造で、その長手方向に定ピッチＰ1でテープ
送り用ガイド穴（17）が穿設される。The electronic component (11) has two lead wires (14) extending in the same direction from the component body (13) which is molded by resin.
Are derived in parallel. The tape member (12) has a structure in which a narrow adhesive tape (16) is attached to one side of a long wide strip-shaped mount (15), and for tape feeding at a constant pitch P 1 in the longitudinal direction. A guide hole (17) is drilled.
【０００５】図示しないテーピング機で台紙（15）に粘
着テープ（16）を順に貼着していくときに、台紙（15）
と粘着テープ（16）の間に電子部品（11）の各リード線
（14）の先端部が挿入されて、リード線（14）の先端部
が台紙（15）と粘着テープ（16）で粘着支持される。複
数の電子部品（11）は、テープ部材（12）の片側に定ピ
ッチＰ2で平行に支持される。When the adhesive tape (16) is sequentially attached to the mount (15) with a taping machine (not shown), the mount (15)
The tip of each lead wire (14) of the electronic component (11) is inserted between the adhesive tape (16) and the tip of the lead wire (14) with the mount (15) and the adhesive tape (16). Supported. The plurality of electronic components (11) are supported in parallel on one side of the tape member (12) at a constant pitch P 2 .
【０００６】粘着テープ（16）で粘着されるリード線
（14）の先端部の長さは、粘着テープ（16）の粘着力に
もよるが、粘着テープ（16）の幅の約半分程度である。
リード線（14）がテープ部材（12）の長手方向に横ずれ
しない程度の粘着力で、リード線（14）は粘着テープ
（16）で台紙（15）に貼着される。The length of the tip of the lead wire (14) adhered by the adhesive tape (16) depends on the adhesive force of the adhesive tape (16), but is about half the width of the adhesive tape (16). is there.
The lead wire (14) is attached to the mount (15) with an adhesive tape (16) with an adhesive force such that the lead wire (14) does not laterally shift in the longitudinal direction of the tape member (12).
【０００７】また、電子部品（11）は、後述する理由に
よりテープ部材（12）の隣接するガイド穴（17）の中間
に１個ずつが配置される。電子部品（11）の中心間の配
列ピッチＰ2と、テープ部材（12）のガイド穴（17）の
中心間の配列ピッチＰ1は同一である。The electronic parts (11) are arranged one by one in the middle of the adjacent guide holes (17) of the tape member (12) for the reason described later. The arrangement pitch P 2 between the centers of the electronic parts (11) and the arrangement pitch P 1 between the centers of the guide holes (17) of the tape member (12) are the same.
【０００８】上記テーピング構体（10）は、テープ部材
（12）を所定長さ毎に折り曲げた状態で保管され、運搬
され、各種の実装機に送られる。実装機は、テーピング
構体（10）をテープ部材（12）のガイド穴（17）を利用
して定ピッチ送りし、テープ部材（12）から電子部品
（11）を順に分離して、電子部品（11）をプリント基板
などに自動実装する。テープ部材（12）からの電子部品
（11）の分離は、リード線（14）を切断するか、リード
線（14）をテープ部材（12）から引き抜くかして行われ
る。The taping structure (10) is stored, transported, and sent to various mounting machines in a state where the tape member (12) is bent into a predetermined length. The mounting machine feeds the taping structure (10) at a constant pitch using the guide hole (17) of the tape member (12), separates the electronic component (11) from the tape member (12) in order, and the electronic component ( 11) is automatically mounted on a printed circuit board. The electronic component (11) is separated from the tape member (12) by cutting the lead wire (14) or pulling out the lead wire (14) from the tape member (12).
【０００９】[0009]
【発明が解決しようとする課題】電子部品（11）の２本
のリード線（14）の中心間ピッチＰ3は、プリント基板
への自動実装の設計上、５．０８ｍｍ〔または２．５４
ｍｍ〕などと標準化されている。また、このような電子
部品（11）をテーピングするテープ部材（12）のガイド
穴（17）の中心間ピッチＰ1は、実装機でテープ部材（1
2）を定ピッチ送りする設計上、１２．７ｍｍとＪＩＳ
〔日本工業規格〕で標準化されている場合が多い。The pitch P 3 between the centers of the two lead wires (14) of the electronic component (11) is 5.08 mm [or 2.54 mm] due to the design of automatic mounting on a printed circuit board.
mm] and the like. In addition, the pitch P 1 between the centers of the guide holes (17) of the tape member (12) for taping the electronic component (11) is determined by the mounting machine.
2) is designed to feed a fixed pitch of 12.7 mm and JIS
It is often standardized by [Japanese Industrial Standards].
【００１０】また、ガイド穴（17）の中心間ピッチＰ1
が１２．７ｍｍのテープ部材（12）で電子部品（11）を
テーピングする場合、隣接するガイド穴（17）の中間に
１個の電子部品（11）を配置することが、ＪＩＳで決め
られている。Further, the center-to-center pitch P 1 of the guide holes (17)
When taping an electronic component (11) with a tape member (12) having a diameter of 12.7 mm, it is decided by JIS that one electronic component (11) should be placed in the middle of the adjacent guide hole (17). There is.
【００１１】図３に示される電子部品（11）のリード線
（14）の中心間ピッチＰ3は５．０８ｍｍであり、テー
プ部材（12）のガイド穴（17）の中心間ピッチＰ1は１
２．７ｍｍである。このテープ部材（12）でテーピング
された電子部品（11）の隣接する２つの間に同一種類の
電子部品を追加配置することは、上記寸法関係からスペ
ース的余裕がなくてできない。換言すると、図３のテー
ピング構体（10）の場合は、テープ部材（12）が比較的
有効に利用されて、後述するような問題は無い。The center pitch P 3 of the lead wires (14) of the electronic component (11) shown in FIG. 3 is 5.08 mm, and the center pitch P 1 of the guide holes (17) of the tape member (12) is 1
It is 2.7 mm. Due to the above dimensional relationship, it is not possible to additionally arrange the electronic components of the same type between two adjacent electronic components (11) taped by the tape member (12). In other words, in the case of the taping structure (10) of FIG. 3, the tape member (12) is used relatively effectively, and there is no problem as described later.
【００１２】ところで、最近の傾向として、図５に示す
電子部品（11'）のように、２本のリード線（14）の中
心間ピッチＰ4を２．５４ｍｍと小形化した種類のもの
が増 えている。このような狭いピッチＰ4のリード線（1
4）を有する小形電子部品（11'）を、規格化された上記
テープ部材（12）でテーピングした場合、ガイド穴（1
7）と同じ１２．７ｍｍピッチで並ぶ電子部品（11）の
間が広く開き過ぎとなる。By the way, a recent trend is shown in FIG.
Inside the two lead wires (14), like the electronic parts (11 ')
Center pitch PFourWith a small size of 2.54 mm
Is increasing I am. Such a narrow pitch PFourLead wire (1
4) Small electronic component (11 ') having standardized above
When taping with the tape member (12), the guide hole (1
Of electronic components (11) lined up at the same 12.7 mm pitch as 7)
The space is too wide and too wide.
【００１３】そのため、図５のテーピング構体（10'）
においては、テープ部材（12）の有効利用率が悪くて無
駄が多くなり、その分、テーピング構体（10）の資材費
が高く付く問題があった。また、図５のテーピング構体
（10'）においては、隣接する電子部品（11'）の間が広
く、この間が無駄な空間となって、保管や運搬時のテー
ピング構体（10'）の収納・在庫スペースの縮小化が難
しく、保管費や運搬費が割高となる問題があった。Therefore, the taping structure (10 ') of FIG.
In the above, there was a problem that the effective utilization rate of the tape member (12) was poor and wasteful, and the material cost of the taping structure (10) was correspondingly high. Further, in the taping structure (10 ′) of FIG. 5, the space between the adjacent electronic components (11 ′) is large, and this space becomes a waste space, so that the taping structure (10 ′) can be stored and stored during storage or transportation. There was a problem that it was difficult to reduce the inventory space and storage costs and transportation costs were high.
【００１４】[0014]
【課題を解決するための手段】本発明者は、上記問題点
の解決策を種々検討したところ、電子部品のリード線の
先端部をテープ部材に直接に支持する粘着テープに、粘
着力の大きなものを使用すれば、テープ部材のガイド穴
の近傍にも電子部品のリード線を十分な粘着力で支持で
きて、上記問題点が解決されることを知見し、次なるテ
ーピング構体を発明した。The present inventor has studied various solutions to the above-mentioned problems, and found that an adhesive tape for directly supporting a tip end portion of a lead wire of an electronic component with a tape member has a large adhesive force. The inventors have found that the lead wire of the electronic component can be supported with sufficient adhesive force even in the vicinity of the guide hole of the tape member, and the above-mentioned problems can be solved by using such a tape member, and invented the next taping structure.
【００１５】即ち、本発明は、部品本体から同一方向に
複数のリード線を導出した複数の電子部品の各リード線
先端部を、電子部品を定ピッチで並列に並べた状態で、
帯板状の台紙と粘着テープで挾んで粘着支持したテーピ
ング構体であって、台紙と粘着テープからなるテープ部
材は、その長手方向に定ピッチでテープ送り用ガイド穴
を有し、複数の電子部品の各リード線先端部は、テープ
部材のガイド穴からテープ部材幅方向の穴横部分と、テ
ープ部材の隣接するガイド穴の中間部分で粘着支持され
ていることを特徴とする電子部品テーピング構体であ
る。That is, according to the present invention, the leading end portions of the lead wires of a plurality of electronic components in which a plurality of lead wires are led out in the same direction from the component body are arranged in parallel at a constant pitch.
It is a taping structure which is sandwiched and supported by a strip-shaped mount and an adhesive tape, and the tape member including the mount and the adhesive tape has a tape feed guide hole at a constant pitch in the longitudinal direction, and has a plurality of electronic components. In the electronic component taping structure, each lead wire end portion is adhesively supported by a hole lateral portion in the tape member width direction from the guide hole of the tape member and an intermediate portion between adjacent guide holes of the tape member. is there.
【００１６】[0016]
【作用】テープ部材の隣接するガイド穴の中間部分に電
子部品を配置することで、ＪＩＳの規格を満足し、さら
にガイド穴の横部分に電子部品を配置することで、規格
化されたテープ部材に従来の２倍の数の電子部品がテー
ピングされる。この２倍の数の電子部品のテーピング
で、テーピングされた電子部品の収納・在庫スペースや
資材費が半減される。By arranging the electronic component in the middle portion of the adjacent guide hole of the tape member, the JIS standard is satisfied, and by arranging the electronic component in the lateral portion of the guide hole, the standardized tape member is obtained. In addition, twice as many electronic components as the conventional one are taped. By doubling the number of taping electronic components, the storage / stock space and material costs for taped electronic components can be cut in half.
【００１７】[0017]
【実施例】図１及び図２に示す一実施例のテーピング構
体（1）は、テープ部材（5）で複数の電子部品（4）を
連結している。EXAMPLE A taping structure (1) according to an example shown in FIGS. 1 and 2 has a plurality of electronic components (4) connected by a tape member (5).
【００１８】電子部品（4）は、図５の電子部品（11'）
と同一種類で、部品本体（2）から同一方向に２本のリ
ード線（3）（3）を導出する。２本のリード線（3）の
中心間ピッチＰ4は、２．５４ｍｍである。The electronic component (4) is the electronic component (11 ') of FIG.
Two lead wires (3) and (3) of the same type as the above are derived from the component body (2) in the same direction. The center-to-center pitch P 4 of the two lead wires (3) is 2.54 mm.
【００１９】テープ部材（5）は、帯板状の台紙（6）の
片面に粘着テープ（7）を貼着したもので、台紙（6）と
粘着テープ（7）の間に電子部品（4）のリード線（3）
の先端部が挟まれて支持される。テープ部材（5）は、
その長手方向に１２．７ｍｍの定ピッチＰ1でガイド穴
（8）が穿設される。テープ部材（5）で複数の電子部品
（4）は、定ピッチＰ5で並列に支持される。The tape member (5) is obtained by sticking an adhesive tape (7) on one surface of a strip-shaped mount (6), and an electronic component (4) is placed between the mount (6) and the adhesive tape (7). ) Lead wire (3)
Is supported by being sandwiched. The tape member (5)
Guide holes (8) are formed in the longitudinal direction at a constant pitch P 1 of 12.7 mm. A plurality of electronic components (4) are supported by the tape member (5) in parallel at a constant pitch P 5 .
【００２０】本発明においては、テープ部材（5）の隣
接するガイド穴（8）の中間部分と、ガイド穴（8）のテ
ープ部材幅方向の穴横部分で電子部品（4）を支持する
ことを特徴とする。したがって、電子部品（4）の中心
間ピッチＰ5は、ガイド穴（8）の中心間ピッチＰ1の半
分であり、テープ部材（5）に電子部品（4）は、従来の
２倍の数がテーピングされる。In the present invention, the electronic component (4) is supported by the intermediate portion of the adjacent guide holes (8) of the tape member (5) and the lateral portion of the guide hole (8) in the tape member width direction. Is characterized by. Therefore, the center-to-center pitch P 5 of the electronic component (4) is half the center-to-center pitch P 1 of the guide hole (8), and the number of the electronic component (4) on the tape member (5) is twice as large as that of the conventional one. Is taped.
【００２１】このようなテーピング構体（1）において
は、テープ部材（5）の穴横部分に支持される電子部品
（4）のリード線（3）がガイド穴（8）に突出しないよ
うにする必要がある。そこで、粘着テープ（7）で粘着
されるリード線（3）の先端部の長さＬを、リード線
（3）の先端がガイド穴（8）近くに達する程度に短く設
定する。In such a taping structure (1), the lead wire (3) of the electronic component (4) supported by the hole lateral portion of the tape member (5) is prevented from protruding into the guide hole (8). There is a need. Therefore, the length L of the tip portion of the lead wire (3) adhered by the adhesive tape (7) is set so short that the tip of the lead wire (3) reaches near the guide hole (8).
【００２２】このように粘着テープ（7）で粘着される
リード線（3）の先端部の長さＬを短くすると、短くし
た分だけテープ部材（5）によるリード線（3）の粘着支
持力が弱まる。そこで、粘着テープ（7）を粘着力の大
きなものに仕様変更して、粘着テープ（7）で粘着され
るリード線（3）先端部の長さＬが短くても、リード線
（3）を十分な力で粘着支持させるようにして、リード
線（3）が横ずれしないようにする。When the length L of the tip portion of the lead wire (3) adhered by the adhesive tape (7) is shortened as described above, the adhesive supporting force of the lead wire (3) by the tape member (5) is reduced by the shortened length. Weakens. Therefore, by changing the specification of the adhesive tape (7) to one with a large adhesive force, even if the length L of the tip of the lead wire (3) adhered by the adhesive tape (7) is short, the lead wire (3) Make sure that the lead wire (3) is not laterally displaced so that it can be adhesively supported with sufficient force.
【００２３】なお、上記実施例は、テープ部材の片側に
だけ電子部品を配置したもので説明したが、本発明は長
尺なテープ部材の両側に定ピッチで電子部品を配置した
テーピング構体においても有効に適用できる。このテー
プ部材の両側に電子部品を配置したテーピング構体にお
いては、片側の電子部品の配列ピッチと反対側の電子部
品の配列ピッチが相違してもよく、また、片側の電子部
品と反対側の電子部品の種類が相違してもよい。In the above embodiment, the electronic parts are arranged only on one side of the tape member, but the present invention is also applicable to a taping structure in which electronic parts are arranged on both sides of a long tape member at a constant pitch. It can be applied effectively. In the taping structure in which the electronic components are arranged on both sides of the tape member, the arrangement pitch of the electronic components on one side may be different from the arrangement pitch of the electronic components on the opposite side, and the electronic components on the opposite side to the electronic components on the one side may be different. The types of parts may be different.
【００２４】[0024]
【発明の効果】本発明によれば、テープ部材に電子部品
が従来の２倍の数でテーピングされるので、電子部品の
収納・在庫スペースが半減され、電子部品の在庫管理の
簡略化、在庫設備の縮小化、運搬費の低減化が図れる効
果がある。また、テープ部材の有効利用率が良くなり、
資材費の低減化も図れる効果がある。According to the present invention, the number of electronic components taped on the tape member is twice as large as that of the conventional one, so that the storage / inventory space of electronic components is halved, the inventory management of electronic components is simplified, and the inventory is reduced. This has the effect of making it possible to reduce equipment and transportation costs. Moreover, the effective utilization rate of the tape member is improved,
It also has the effect of reducing material costs.
【図１】本発明の一実施例であるテーピング構体の部分
正面図FIG. 1 is a partial front view of a taping structure according to an embodiment of the present invention.
【図２】図１のＡ−Ａ線に沿う拡大断面図FIG. 2 is an enlarged sectional view taken along the line AA of FIG.
【図３】従来の電子部品テーピング構体の部分正面図FIG. 3 is a partial front view of a conventional electronic component taping structure.
【図４】（ａ）は図３のＢ−Ｂ線に沿う拡大断面図、
（ｂ）は図３のＣ−Ｃ線に沿う拡大断面図4A is an enlarged cross-sectional view taken along the line BB of FIG.
(B) is an enlarged sectional view taken along the line CC of FIG.
【図５】他の従来の電子部品テーピング構体の部分正面
図FIG. 5 is a partial front view of another conventional electronic component taping structure.
1 テーピング構体 2 部品本体 3 リード線 4 電子部品 5 テープ部材 6 台紙 7 粘着テープ 8 ガイド穴 1 Taping structure 2 Component body 3 Lead wire 4 Electronic component 5 Tape member 6 Mount 7 Adhesive tape 8 Guide hole
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 13/02 Ｂ 8509−4Ｅ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H05K 13/02 B 8509-4E
Claims (2)
を導出した複数の電子部品の各リード線先端部を、電子
部品を定ピッチで並列に並べた状態で、帯板状の台紙と
粘着テープで挾んで粘着支持したテーピング構体であっ
て、 台紙と粘着テープからなるテープ部材は、その長手方向
に定ピッチでテープ送り用ガイド穴を有し、 複数の電子部品の各リード線先端部は、テープ部材のガ
イド穴からテープ部材幅方向の穴横部分と、テープ部材
の隣接するガイド穴の中間部分で粘着支持されているこ
とを特徴とする電子部品テーピング構体。1. Adhesion to a strip board-shaped backing sheet with electronic components arranged in parallel at a constant pitch, with the leading end portions of the lead wires of a plurality of electronic components that lead out a plurality of lead wires in the same direction from the component body. It is a taping structure that is adhesively supported by sandwiching it with a tape, and the tape member consisting of the mount and the adhesive tape has tape feed guide holes at a constant pitch in the longitudinal direction, and the lead wire tips of multiple electronic components are An electronic component taping structure, which is adhesively supported by a lateral portion of the tape member in the width direction of the tape member and an intermediate portion of adjacent guide holes of the tape member.
て、複数の電子部品を、テープ部材の長手方向に対して
略直角な方向に、両側に配置したことを特徴とする電子
部品テーピング構体。2. The taping structure according to claim 1, wherein a plurality of electronic components are arranged on both sides in a direction substantially perpendicular to the longitudinal direction of the tape member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11094292A JPH05310283A (en) | 1992-04-30 | 1992-04-30 | Structure for taping electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11094292A JPH05310283A (en) | 1992-04-30 | 1992-04-30 | Structure for taping electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05310283A true JPH05310283A (en) | 1993-11-22 |
Family
ID=14548471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11094292A Pending JPH05310283A (en) | 1992-04-30 | 1992-04-30 | Structure for taping electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05310283A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4849798A (en) * | 1984-05-16 | 1989-07-18 | Sharp Kabushiki Kaisha | Field effect transistor type sensor with an auxiliary electrode |
| CN108725867A (en) * | 2018-07-17 | 2018-11-02 | 珠海格力电器股份有限公司 | Ceramic chip capacitor braid assembly and processing method thereof |
| CN108820549A (en) * | 2018-07-17 | 2018-11-16 | 珠海格力电器股份有限公司 | capacitor braid structure and manufacturing method thereof |
| CN108987130A (en) * | 2018-07-17 | 2018-12-11 | 珠海格力电器股份有限公司 | Capacitor assembly for suppressing electromagnetic interference and processing method thereof |
-
1992
- 1992-04-30 JP JP11094292A patent/JPH05310283A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4849798A (en) * | 1984-05-16 | 1989-07-18 | Sharp Kabushiki Kaisha | Field effect transistor type sensor with an auxiliary electrode |
| CN108725867A (en) * | 2018-07-17 | 2018-11-02 | 珠海格力电器股份有限公司 | Ceramic chip capacitor braid assembly and processing method thereof |
| CN108820549A (en) * | 2018-07-17 | 2018-11-16 | 珠海格力电器股份有限公司 | capacitor braid structure and manufacturing method thereof |
| CN108987130A (en) * | 2018-07-17 | 2018-12-11 | 珠海格力电器股份有限公司 | Capacitor assembly for suppressing electromagnetic interference and processing method thereof |
| CN108820549B (en) * | 2018-07-17 | 2024-02-27 | 珠海格力电器股份有限公司 | Capacitor braid structure and manufacturing method thereof |
| CN108725867B (en) * | 2018-07-17 | 2024-04-16 | 珠海格力电器股份有限公司 | Ceramic chip capacitor braid assembly and processing method thereof |
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