JPH0124959Y2 - - Google Patents

Info

Publication number
JPH0124959Y2
JPH0124959Y2 JP1981169716U JP16971681U JPH0124959Y2 JP H0124959 Y2 JPH0124959 Y2 JP H0124959Y2 JP 1981169716 U JP1981169716 U JP 1981169716U JP 16971681 U JP16971681 U JP 16971681U JP H0124959 Y2 JPH0124959 Y2 JP H0124959Y2
Authority
JP
Japan
Prior art keywords
leads
tape
adhesive tape
mount
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981169716U
Other languages
Japanese (ja)
Other versions
JPS5874395U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16971681U priority Critical patent/JPS5874395U/en
Publication of JPS5874395U publication Critical patent/JPS5874395U/en
Application granted granted Critical
Publication of JPH0124959Y2 publication Critical patent/JPH0124959Y2/ja
Granted legal-status Critical Current

Links

Description

【考案の詳細な説明】 [産業上の利用分野] 本考案は電子部品のリードをテープ台紙と粘着
テープとの間で固定したテーピング部品に関する
ものである。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a taping component in which the leads of an electronic component are fixed between a tape mount and an adhesive tape.

[従来の技術とその問題点] 従来、第2図a,bに示すように、テーピング
部品はコンデンサ、抵抗、ダイオードなどの電子
部品1のリード2,3をテープ台紙4と粘着テー
プ5との間で固定している構造であるが、リード
2,3間隔Fが狭いものにおいてはリード2と3
に空隙ができ、その箇所の粘着テープ5はテープ
台紙4と接着せず、リード2,3間隔Fが不正確
となる。このため、このようなテーピング部品を
電子部品自動挿入機に対して使用すると、プリン
ト配線基板のリード挿入孔への挿入が不正確とな
り、その稼動率を著しく低下させてしまうという
欠点がある。
[Prior art and its problems] Conventionally, as shown in FIG. However, in the case where the lead 2 and 3 gap F is narrow, the lead 2 and 3
A gap is created, and the adhesive tape 5 at that location does not adhere to the tape mount 4, making the distance F between the leads 2 and 3 inaccurate. For this reason, when such a taping component is used in an automatic electronic component insertion machine, there is a drawback that insertion into the lead insertion hole of the printed wiring board becomes inaccurate, which significantly reduces the operating rate.

[問題点を解決するための手段] しかるに、本考案は上述のような欠点を除去す
るために、特に電子部品のリードに段部を設ける
ことにより、相隣るリード間隔を広げ、リードが
テープ台紙と粘着テープとの間で確実に固定され
るところのテーピング部品を提供するものであ
る。
[Means for Solving the Problems] However, in order to eliminate the above-mentioned drawbacks, the present invention particularly provides step portions in the leads of electronic components to widen the distance between adjacent leads and to prevent the leads from forming a tape-like structure. To provide a taping component that is securely fixed between a mount and an adhesive tape.

[実施例] 以下、本考案の一実施例を第1図a,bにもと
づいて説明する。なお、従来例と同一箇所につい
ては同符号を付す。
[Example] Hereinafter, an example of the present invention will be described based on FIGS. 1a and 1b. Note that the same parts as in the conventional example are given the same reference numerals.

先ず、電子部品1のリード2,3の基部21,
31に第1の「ハ」の字形の段部22,32を設
け、相隣るリード2,3の間隔を広げ、間隔Fと
する。この間隔Fはプリント配線基板に穿設され
た相隣るリード挿入孔の間隔と同じである。
First, the bases 21 of the leads 2 and 3 of the electronic component 1,
31 is provided with first "V"-shaped step portions 22, 32, and the distance between adjacent leads 2, 3 is widened to a distance F. This interval F is the same as the interval between adjacent lead insertion holes drilled in the printed wiring board.

次に、リード2,3の中間部に、第2の「ハ」
の字形の段部23,33を設け、相隣るリード
2,3の間隔をさらに広げ、間隔Fxとする。
Next, place a second “ha” in the middle of leads 2 and 3.
The step portions 23 and 33 in the shape of a square are provided to further widen the distance between the adjacent leads 2 and 3 to provide the distance Fx.

テーピング化に際して、テープ台紙4は粘着テ
ープ5より幅広のものを使用し、テープ台紙4の
幅より内側で、かつ粘着テープ5の幅より外側の
テープ台紙部分41にリード2,3の第2の段部
23,33を位置させ、リード2,3の中間部か
ら先端部をテープ台紙4上に粘着テープ5にて挟
持し、固定する。このように構成すると、リード
2,3のテープ台紙4と粘着テープ5との挟持部
分には従来例のような空隙はできず、その間の粘
着テープ5はテープ台紙4に確実に接着するた
め、リード2,3は確実に固定されることにな
る。
When taping, the tape mount 4 is wider than the adhesive tape 5, and the second part of the leads 2 and 3 is attached to the tape mount portion 41 inside the width of the tape mount 4 and outside the width of the adhesive tape 5. The stepped portions 23 and 33 are positioned, and the leading ends of the leads 2 and 3 are sandwiched and fixed onto the tape mount 4 with the adhesive tape 5. With this structure, unlike the conventional example, no gap is created between the tape mount 4 and the adhesive tape 5 of the leads 2 and 3, and the adhesive tape 5 in between is reliably adhered to the tape mount 4. Leads 2 and 3 will be securely fixed.

[効果] 以上にて述べた本考案によると、電子部品のリ
ードに複数の段部を形成し、相隣るリード間隔を
広げるようにしたので、リード間隔の狭い電子部
品も容易にテーピング部品として構成できるもの
である。また、テープ台紙幅より内側でかつ粘着
テープ幅より外側のテープ台紙部分において、電
子部品のリードに第2の段部を構成したのでリー
ドを確実に固定できると共に、粘着テープに捩れ
を生ずることなく、電子部品自動挿入機でリード
を裁断する場合も良好であるという利点を奏する
ものである。
[Effects] According to the present invention described above, multiple steps are formed on the leads of electronic components to widen the gap between adjacent leads, so electronic components with narrow lead spacing can easily be used as taping components. It is configurable. In addition, a second step is formed on the lead of the electronic component in the part of the tape mount that is inside the width of the tape mount and outside the width of the adhesive tape, so the lead can be securely fixed and the adhesive tape will not be twisted. This has the advantage that it is also suitable for cutting leads with an automatic electronic component insertion machine.

【図面の簡単な説明】[Brief explanation of drawings]

第1図a,bは本考案の一実施例を示す平面図
と断面図、第2図a,bは従来例を示す平面図と
断面図である。 図中、1……電子部品、2,3……リード、4
……テープ台紙、5……粘着テープ、22,2
3,32,33……段部。
1A and 1B are a plan view and a sectional view showing an embodiment of the present invention, and FIGS. 2A and 2B are a plan view and a sectional view showing a conventional example. In the diagram, 1...electronic component, 2, 3...lead, 4
...Tape mount, 5...Adhesive tape, 22,2
3, 32, 33...Dan section.

Claims (1)

【実用新案登録請求の範囲】 (1) 電子部品1のリード2,3をテープ台紙4と
粘着テープ5との間で固定したテーピング部品
において、電子部品1のリード2,3の基部2
1,31に第1の段部22,32を設けて相隣
るリード2,3間隔を広げ、リード2,3の中
間部に第2の段部23,33を設けて相隣るリ
ード2,3間隔をさらに広げ、リード2,3の
中間部から先端部をテープ台紙4上に粘着テー
プ5にて挟持し、固定したテーピング部品。 (2) 実用新案登録請求の範囲(1)において、テープ
台紙4は粘着テープ5より幅広のものを使用
し、テープ台紙4の幅より内側で、かつ粘着テ
ープ5の幅より外側のテープ台紙部分41にリ
ード2,3の第2の段部23,33を位置させ
たテーピング部品。
[Claims for Utility Model Registration] (1) In a taping component in which the leads 2 and 3 of the electronic component 1 are fixed between the tape mount 4 and the adhesive tape 5, the base 2 of the leads 2 and 3 of the electronic component 1
First step portions 22, 32 are provided at the leads 1, 31 to widen the interval between the adjacent leads 2, 3, and second step portions 23, 33 are provided at the intermediate portion of the leads 2, 3 to increase the distance between the adjacent leads 2, 3. , 3 is further widened, and the ends of the leads 2 and 3 are sandwiched and fixed on a tape mount 4 with adhesive tape 5 from the middle part to the leading end. (2) In claim (1) for utility model registration, the tape mount 4 is wider than the adhesive tape 5, and the portion of the tape mount that is inside the width of the tape mount 4 and outside the width of the adhesive tape 5. A taping component in which the second step portions 23, 33 of the leads 2, 3 are located at 41.
JP16971681U 1981-11-14 1981-11-14 taping parts Granted JPS5874395U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16971681U JPS5874395U (en) 1981-11-14 1981-11-14 taping parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16971681U JPS5874395U (en) 1981-11-14 1981-11-14 taping parts

Publications (2)

Publication Number Publication Date
JPS5874395U JPS5874395U (en) 1983-05-19
JPH0124959Y2 true JPH0124959Y2 (en) 1989-07-27

Family

ID=29961692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16971681U Granted JPS5874395U (en) 1981-11-14 1981-11-14 taping parts

Country Status (1)

Country Link
JP (1) JPS5874395U (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58184425U (en) * 1982-06-02 1983-12-08 雪印乳業株式会社 Device that captures and discharges products

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5629400A (en) * 1979-08-20 1981-03-24 Nippon Electric Co Multilayer high density circuit board

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5723918Y2 (en) * 1977-04-19 1982-05-24

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5629400A (en) * 1979-08-20 1981-03-24 Nippon Electric Co Multilayer high density circuit board

Also Published As

Publication number Publication date
JPS5874395U (en) 1983-05-19

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