JPS59127267U - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS59127267U JPS59127267U JP2090283U JP2090283U JPS59127267U JP S59127267 U JPS59127267 U JP S59127267U JP 2090283 U JP2090283 U JP 2090283U JP 2090283 U JP2090283 U JP 2090283U JP S59127267 U JPS59127267 U JP S59127267U
- Authority
- JP
- Japan
- Prior art keywords
- chip components
- printed board
- circuit board
- abstract
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図Ａ、 Ｂは従来のチップ部品搭載用プリント基板
の印刷パターン電極部を示し、Ａは正面図、Ｂ図はその
断面図、第２図は同じ〈従来のプリント基板にチップ部
品を搭載した状態を示す平面図。
第３図Ａ、 Ｂは本考案プリント基板の一実施例を示し
、Ａ図が正面図、Ｂ図はその断面図、第４図Ａ、 Ｂは
本考案のプリント基板へチップ部品を搭載した状態図で
Ａ図が正面図、Ｂ図がその断面図である。
１・・・基板、２・・・印刷パターン電極、３・・・チ
ップ部品仮固定用接着剤、４・・・チップ部品、４ａ・
・・チップ部品の電極、５・・・接着剤拡散防止用凹部
、５ａ・・・障壁。Figures 1A and 1B show printed pattern electrodes of a conventional printed circuit board for mounting chip components, A is a front view, Figure B is a cross-sectional view, and Figure 2 is the same. FIG. Figures 3A and 3B show an embodiment of the printed circuit board of the present invention, where Figure A is a front view, Figure B is a cross-sectional view, and Figures 4A and B show a state in which chip components are mounted on the printed circuit board of the present invention. In the figures, Figure A is a front view, and Figure B is a sectional view thereof. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Printed pattern electrode, 3... Adhesive for temporarily fixing chip components, 4... Chip components, 4a.
. . . Electrode of chip component, 5 . . Recess for preventing adhesive diffusion, 5a . . . Barrier.
Claims (1)
装着時に使用する、チップ部品仮固定用接着剤のはみ出
し防止機能を有する凹部を印刷パターンの電極間に設け
たことを特徴とするプリント基板。1. A printed circuit board on which chip components are mounted, characterized in that a recessed portion is provided between electrodes of a printed pattern and has a function of preventing extrusion of an adhesive for temporary fixing of chip components used when mounting the chip components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2090283U JPS59127267U (en) | 1983-02-17 | 1983-02-17 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2090283U JPS59127267U (en) | 1983-02-17 | 1983-02-17 | Printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59127267U true JPS59127267U (en) | 1984-08-27 |
Family
ID=30152029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2090283U Pending JPS59127267U (en) | 1983-02-17 | 1983-02-17 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59127267U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013187316A (en) * | 2012-03-07 | 2013-09-19 | Mitsubishi Electric Corp | Printed wiring board, printed circuit board, and method for manufacturing printed wiring board |
| US10512168B2 (en) | 2016-02-18 | 2019-12-17 | Mitsubishi Electric Corporation | Electronic device and method of manufacturing the same |
| US11818840B2 (en) | 2019-03-25 | 2023-11-14 | Mitsubishi Electric Corporation | Printed wiring board and electronic device |
-
1983
- 1983-02-17 JP JP2090283U patent/JPS59127267U/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013187316A (en) * | 2012-03-07 | 2013-09-19 | Mitsubishi Electric Corp | Printed wiring board, printed circuit board, and method for manufacturing printed wiring board |
| US10512168B2 (en) | 2016-02-18 | 2019-12-17 | Mitsubishi Electric Corporation | Electronic device and method of manufacturing the same |
| US11818840B2 (en) | 2019-03-25 | 2023-11-14 | Mitsubishi Electric Corporation | Printed wiring board and electronic device |
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