JP3102735B2 - PCB mounting structure - Google Patents

PCB mounting structure

Info

Publication number
JP3102735B2
JP3102735B2 JP05289737A JP28973793A JP3102735B2 JP 3102735 B2 JP3102735 B2 JP 3102735B2 JP 05289737 A JP05289737 A JP 05289737A JP 28973793 A JP28973793 A JP 28973793A JP 3102735 B2 JP3102735 B2 JP 3102735B2
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
shield case
notch
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP05289737A
Other languages
Japanese (ja)
Other versions
JPH07122876A (en
Inventor
和見 内藤
幸人 丹澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kenwood KK
Original Assignee
Kenwood KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kenwood KK filed Critical Kenwood KK
Priority to JP05289737A priority Critical patent/JP3102735B2/en
Publication of JPH07122876A publication Critical patent/JPH07122876A/en
Application granted granted Critical
Publication of JP3102735B2 publication Critical patent/JP3102735B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、シールドケースにプリ
ント基板を取り付けるための取付構造に係り、特に集合
基板に予め各プリント基板用のシールドケースを取り付
けるのに最適なプリント基板の取付構造に関するもので
あり、単品の基板をシールドケースに取り付ける場合に
も適用できる取付構造である。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure for mounting a printed circuit board on a shield case, and more particularly to a printed circuit board mounting structure most suitable for mounting a shield case for each printed circuit board on a collective board in advance. This is a mounting structure that can be applied to a case where a single substrate is mounted on a shield case.

【0002】[0002]

【従来の技術】電子機器等のプリント基板を得る形態と
して、1枚の基板に複数の回路を並べて形成した集合基
板に部品を実装した後に分割して複数のプリント基板を
得る形態があり、また、各分割されたプリント基板をシ
ールドケースに取り付ける場合がある。このような場
合、従来は図に示すように、シールドケース11がプ
リント基板12の周囲を取り囲む形状になっており、シ
ールドケース11の内面側には突き出し加工により突起
13が設けられていて、プリント基板12の取付け高さ
が位置決めされ、該突起13とは別に同じく突き出し加
工で突起14を設けてこれをプリント基板12の外形と
強嵌合させることによりプリント基板12を仮固定して
いた。
2. Description of the Related Art As a mode of obtaining a printed circuit board of an electronic device or the like, there is a mode of obtaining a plurality of printed circuit boards by mounting components on a collective board formed by arranging a plurality of circuits on one board and then dividing the board. In some cases, each of the divided printed boards is attached to a shield case. In such a case, conventionally, as shown in FIG. 5 , the shield case 11 has a shape surrounding the periphery of the printed circuit board 12, and the protrusion 13 is provided on the inner surface side of the shield case 11 by protrusion. The mounting height of the printed circuit board 12 is determined, and a projection 14 is provided separately from the projection 13 by a protruding process, and the printed circuit board 12 is temporarily fixed by being strongly fitted to the outer shape of the printed circuit board 12.

【0003】[0003]

【発明が解決しようとする課題】ところが従来のものに
あっては、シールドケース11がプリント基板12の周
囲を取り囲む形状、即ち、プリント基板12がシールド
ケース11内に完全に収容される形態となっているた
め、集合基板を割り取る前に各分割基板用のシールドケ
ース11を取り付けることが不可能で作業効率が悪く、
プリント基板12とシールドケース11の半田付け作業
の自動化が困難であった。
However, in the prior art, the shield case 11 has a shape surrounding the periphery of the printed board 12, that is, the printed board 12 is completely housed in the shield case 11. Therefore, it is impossible to attach the shield case 11 for each divided board before splitting the collective board, resulting in poor work efficiency,
It has been difficult to automate the soldering work between the printed circuit board 12 and the shield case 11.

【0004】また、シールドケース11の内側に突起1
3を設けてプリント基板12の取り付け高さを位置決め
する構造であるから、基板の部品実装面積が小さくなる
欠点があり、しかも位置決め用の突起13及び基板の仮
固定用の突起14は突き出し加工で形成するものである
から、突き出し加工のための金型コストや加工コストが
必要となって不経済であるばかりでなく、シールドケー
ス11の突き出し加工のばらつきが発生しやすく、位置
決め及び固定力を一定にするのが困難であった。
Further, a projection 1 is provided inside the shield case 11.
3, the mounting height of the printed circuit board 12 is determined, so that there is a disadvantage that the component mounting area of the board is reduced. Further, the projections 13 for positioning and the projections 14 for temporarily fixing the board are protruded. Since it is formed, it is not only uneconomical to require a die cost and processing cost for the protruding process, but also it is easy for the protruding process of the shield case 11 to vary, and the positioning and fixing force are fixed. Was difficult to do.

【0005】そこで本発明の目的は、上記した従来の欠
点を解消し、集合基板の分割前にシールドケースを容易
に仮固定することができ、また、単品の基板をシールド
ケースに取り付ける場合にも適用することができるプリ
ント基板の取付構造を提供することにある。
Accordingly, an object of the present invention is to eliminate the above-mentioned disadvantages of the prior art and to easily and temporarily fix the shield case before dividing the collective board, and also to attach a single board to the shield case. An object of the present invention is to provide a printed circuit board mounting structure that can be applied.

【0006】[0006]

【課題を解決するための手段】上記の目的を達するため
に、本発明のプリント基板の取付構造は、シールドケー
スにプリント基板を取り付けるプリント基板の取付構造
において、集合基板に複数のプリント基板と、複数のス
リットと、複数のプリント基板を分割するための分割線
とを形成し、集合基板にシールドケースを取り付けた後
に分割線において分割するように構成し、シールドケー
スの切欠部の開口縁に丸みを形成すると共に、プリント
基板の舌片状の支持部の基部に丸みを形成し、この支持
部の丸みに切欠部の側壁が当接する構成とし、プリント
基板をシールドケースへ収容する際、丸み(2b)が切
欠部(1a)を押し開くようにしてシールドケースの切
欠部にプリント基板の支持部を嵌合させ、シールドケー
スへのプリント基板の取付高さの位置決めを行うと共に
少なくとも仮固定するように構成したものである。
In order to achieve the above object, a printed circuit board mounting structure according to the present invention includes a printed circuit board mounting structure for mounting a printed circuit board on a shield case. A plurality of slits and a dividing line for dividing the plurality of printed circuit boards are formed, and the shield case is attached to the collective substrate, and then divided at the dividing line. In addition to forming a rounded portion at the base of the tongue-shaped support portion of the printed circuit board, the rounded portion of the support portion comes into contact with the side wall of the notch, and the printed portion is formed.
When storing the board in the shield case, the roundness (2b) is cut off.
The support portion of the printed circuit board is fitted into the cutout portion of the shield case by pushing open the notch portion (1a), and the mounting height of the printed circuit board to the shield case is determined and at least temporarily fixed. Things.

【0007】上記のシールドケースは集合基板に取り付
ける形態であるが、単品の基板をシールドケースに取り
付ける場合にも同様の条件を採用し、かつ、プリント基
板に舌片状の支持部を形成し、シールドケースには
「コ」字状の切欠部を形成して、上記支持部の丸みに、
該切欠部の側壁が当接する構成とし、プリント基板をシ
ールドケースへ収容する際、丸み(2b)が切欠部(1
a)を押し開くようにして嵌合させることによりシール
ドケースにプリント基板を取り付ける際の取付け高さの
位置決めと、仮固定を行うことができる。
The above-mentioned shield case is mounted on the collective board, but the same conditions are adopted when a single board is mounted on the shield case, and a tongue-shaped support portion is formed on the printed board. In the shield case, a "U" shaped notch is formed, and the roundness of the support
The side wall of the cutout is in contact with the printed circuit board.
When storing in the cold case, the roundness (2b) is
When the printed circuit board is mounted on the shield case, the mounting height can be determined and the temporary fixing can be performed by fitting the printed circuit board into the shield case by pushing and opening a) .

【0008】 上記の2形態において、切欠部や支持部を
対称位置に設けると、シールドケースにプリント基板を
安定的に取り付けることが可能となる。
In the above two embodiments, the notch and the support are
When installed in a symmetrical position, the printed circuit board
It becomes possible to attach it stably.

【0009】[0009]

【作用】集合基板には複数の同一の回路が並べて形成さ
れており、部品を実装した後に割り取ることにより複数
のプリント基板が得られる。分割されるべきプリント基
板はその周囲にスリットが形成されていて2箇所程度の
支持部で保持されている。この支持部には、V溝、ミシ
ン目、破線状のスリット等からなる分割線が形成されて
おり、従来のものにおいては分割されたプリント基板に
支持部が残存しないように分割線が形成されているが、
本発明においては支持部が舌片状に残存するような位置
に分割線を設ける。
A plurality of identical circuits are formed side by side on a collective board, and a plurality of printed boards can be obtained by dividing after mounting components. The printed circuit board to be divided has slits formed around it, and is held by about two supporting portions. Dividing lines formed of V grooves, perforations, dashed slits, and the like are formed in the supporting portion, and in the related art, the dividing lines are formed so that the supporting portion does not remain on the divided printed circuit board. But
In the present invention, a dividing line is provided at a position where the supporting portion remains like a tongue piece.

【0010】 このような集合基板にシールドケースを取
り付けるには、シールドケースの周縁部を上記スリット
に嵌入させるようにして押し込む。上記支持部の基部及
びシールドケースの切欠部の開口縁には丸みが形成され
ているから、支持部は開口縁の丸みでガイドされて切欠
部に嵌入する。このとき、支持部の基部には丸みがある
からこの丸み部分が切欠分の側縁に密嵌し、プリント基
板とシールドケースとが仮固定される。支持部が切欠部
の底部まで到達するとプリント基板の取り付け高さが位
置決めされる。このようにしてすべての分割されるべき
プリント基板のためのシールドケースを取り付けた後に
プリント基板とシールドケースとを半田付けし、上記分
割線から割り取ることにより、それぞれシールドケース
に取り付けられた複数の基板が得られる。
In order to attach the shield case to such a collective board, the periphery of the shield case is pushed in so as to fit into the slit. Since the opening edge of the base of the support portion and the cutout portion of the shield case is rounded, the support portion is guided by the roundness of the opening edge and fits into the cutout portion. At this time, since the base of the support portion is rounded, the rounded portion is closely fitted to the side edge of the cutout, and the printed board and the shield case are temporarily fixed. When the support reaches the bottom of the notch, the mounting height of the printed circuit board is determined. After attaching the shield cases for the printed circuit boards to be divided in this way, the printed circuit board and the shield case are soldered, and by dividing from the dividing line, a plurality of the shield cases are respectively attached to the shield cases. A substrate is obtained.

【0011】 上記の例は集合基板にシールドケースを取
り付ける場合であるが、単品の基板の外周に上記のよう
な支持部を形成しておけば、上記の構成のシールドケー
スを用いることにより、単品の基板をシールドケースに
取り付ける場合にもそのまま適用することができる。
In the above example, the shield case is attached to the collective board. However, if the above-described supporting portion is formed on the outer periphery of the single board, the shield case having the above configuration can be used. The present invention can be applied to the case where the above-mentioned substrate is attached to the shield case.

【0012】[0012]

【実施例】本発明の実施例を図1〜4に基づいて説明す
る。図1はプリント基板とシールドケースの分解斜視
図、図2はプリント基板をシールドケースに取り付けた
状態を示す斜視図、図3はプリント基板をシールドケー
スに取り付けた状態の平面図、図4は集合基板の平面図
である。図において、3は集合基板であって、1枚の基
板に複数の回路を並べて形成すると共に部品を実装した
後に分割線において分割することにより複数のプリント
基板2が得られるようになっている。1はプリント基板
2を収容する形態でプリント基板2が取り付けられるシ
ールドケースである。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIGS. 1 is an exploded perspective view of a printed circuit board and a shield case, FIG. 2 is a perspective view showing a state in which the printed circuit board is attached to the shield case, FIG. 3 is a plan view of a state in which the printed circuit board is attached to the shield case, and FIG. It is a top view of a board. In the drawing, reference numeral 3 denotes an aggregate substrate, on which a plurality of circuits are arranged and formed on a single substrate, and after a component is mounted, a plurality of printed boards 2 are obtained by dividing the substrate at a dividing line. Reference numeral 1 denotes a shield case to which the printed board 2 is attached so as to accommodate the printed board 2.

【0013】 上記集合基板3には分割されるべきプリン
ト基板2のためのスリット4がプレス抜き加工により形
成され、この分割されるべきプリント基板2は対称的に
設けた支持部2aで保持されている。本実施例において
は分割された状態においてプリント基板2に上記支持部
2aが舌片状に残存するように、上記スリット4の端部
を延設すると共に破線で示すように分割線としてのV溝
5を該スリット4の先端側に形成してある。このV溝5
集合基板3の両面に形成してもよいが、少なくとも
合基板3の部品取付面の反対側の面に形成する。また、
上記支持部2aのプリント基板2側の基部には丸み2b
が形成されている。
[0013] slit 4 for the printed circuit board 2 to be divided into the collective substrate 3 is formed by press punching, printed circuit board 2 to be this division is held by the supporting portion 2a provided symmetrically I have. In this embodiment, the ends of the slits 4 are extended so that the support portions 2a remain in a tongue shape on the printed circuit board 2 in the divided state, and a V-groove as a dividing line as shown by a broken line 5 is formed on the tip side of the slit 4. This V groove 5
Although it may be formed on both surfaces of collective board 3, at least current
It is formed on the surface of the composite board 3 opposite to the component mounting surface. Also,
The base of the support portion 2a on the printed circuit board 2 side is rounded 2b.
Are formed.

【0014】 シールドケース1はその周縁部を集合基板
の上記スリット4に嵌入し得るような外径と肉厚に形
成され、該周縁部には上記支持部2aが嵌合する切欠部
1aが設けられると共に、該切欠部1aの開口縁には丸
み1bが形成されている。
[0014] The shield case 1 has a peripheral portion formed of a collective substrate.
3 is formed to have an outer diameter and a wall thickness capable of being fitted into the slit 4, and a peripheral portion is provided with a notch portion 1a into which the support portion 2a is fitted, and an opening edge of the notch portion 1a A roundness 1b is formed.

【0015】 集合基板4にシールドケース1を取り付け
る場合、シールドケース1の周縁部を上記スリット4に
嵌入させるようにして押し込むと、支持部2aは切欠部
1aの開口縁の丸み1bでガイドされて切欠部1aに嵌
入する。このとき、支持部2aの基部の丸み2bが切欠
部1aの側縁を図3の矢示方向に押し開くように作用
し、その反作用で切欠部1aの側縁に密嵌して、プリン
ト基板2とシールドケース1とを仮固定することができ
る。また、支持部2aが切欠部1aの底部まで到達する
とプリント基板2の取り付け高さが位置決めされる。こ
のようにしてすべての分割されるべきプリント基板2の
シールドケース1を取り付けた後にプリント基板2とシ
ールドケース1とを半田付けし、上記V溝5の線から割
り取ることにより、それぞれシールドケース1に取り付
けられた複数のプリント基板2を得ることができる。
When the shield case 1 is mounted on the collective board 4, the peripheral portion of the shield case 1 is pushed into the slit 4 so as to be fitted into the slit 4, and the support portion 2a is guided by the roundness 1b of the opening edge of the cutout portion 1a. Fit into the notch 1a. At this time, the roundness 2b at the base of the support portion 2a acts to push open the side edge of the notch 1a in the direction indicated by the arrow in FIG. 3, and the reaction closely fits the side edge of the notch 1a to form the printed circuit board. 2 and the shield case 1 can be temporarily fixed. When the support 2a reaches the bottom of the cutout 1a, the mounting height of the printed circuit board 2 is determined. After the shield cases 1 of the printed circuit boards 2 to be divided are all attached in this way, the printed circuit boards 2 and the shield cases 1 are soldered, and the shield cases 1 are separated from the V-groove 5 lines. Can be obtained.

【0016】 なお、上記の例は集合基板3にシールドケ
ース1を取り付ける場合であるが、単品のプリント基板
の外周に上記のような支持部を形成しておけば、上記の
構成のシールドケース1を用いることにより、単品のプ
リント基板をシールドケースに取り付ける場合にもその
まま適用することができる。
In the above example, the shield case 1 is mounted on the collective board 3. However, if the above-described supporting portion is formed on the outer periphery of a single printed circuit board, the shield case 1 having the above-described configuration is provided. By using this, the present invention can be applied to a case where a single printed circuit board is attached to a shield case.

【0017】[0017]

【発明の効果】本発明に係るプリント基板の取付構造に
よれば、切欠部の丸みやプリント基板の支持部の丸みを
利用することによって、プリント基板のシールドケース
への仮固定が確実かつ容易に実施できることとなり、半
田付け作業や組み込み作業を安定的に効率良く実行でき
るようになる。このため、各作業の自動化を確実に達成
できる。さらに、他の発明では、これらの効果に加え、
集合基板を割り取る前に集約的に各プリント基板のため
のシールドケースを確実かつ容易に取り付けることがで
きるから作業効率を著しく高めることができ、プリント
基板とシールドケースとの組み立て作業や半田付け作業
をロボット等により確実に自動化することができる。更
に、シールドケースに従来のような突出し加工等をする
必要がないから形状が簡単となり、安価に製造すること
ができる。シールドケースが取り付けられた集合基板を
分割する場合においても分割線を割ることによって分割
でき、特別な設備を必要とせず経済的である。
According to the printed circuit board mounting structure of the present invention, the roundness of the notch and the roundness of the supporting portion of the printed circuit board are reduced.
By using the shield case of the printed circuit board
Temporary fixation can be performed reliably and easily.
Can perform stitching and installation work stably and efficiently
Become so. As a result, automation of each operation is reliably achieved
it can. Further, in other inventions, in addition to these effects,
Since the shield case for each printed circuit board can be securely and easily attached before dividing the collective board, work efficiency can be significantly increased, and the assembly work and soldering work between the printed circuit board and the shield case it can be reliably automated by a robot or the like. Further, since the shield case does not need to be subjected to a projection process or the like as in the conventional case, the shape is simplified, and the shield case can be manufactured at low cost. Even when dividing the collective substrate to which the shield case is attached, the substrate can be divided by dividing the dividing line, and it is economical without requiring any special equipment.

【図面の簡単な説明】[Brief description of the drawings]

【図1】プリント基板とシールドケースの分解斜視図。FIG. 1 is an exploded perspective view of a printed circuit board and a shield case.

【図2】プリント基板をシールドケースに取り付けた状
態を示す斜視図。
FIG. 2 is a perspective view showing a state in which a printed circuit board is attached to a shield case.

【図3】プリント基板をシールドケースに取り付けた状
態の平面図。
FIG. 3 is a plan view showing a state in which a printed circuit board is attached to a shield case.

【図4】集合基板の平面図。FIG. 4 is a plan view of the collective substrate.

【図5】従来のプリント基板とシールドケースを示す分
解斜視図。
FIG. 5 is an exploded perspective view showing a conventional printed circuit board and a shield case.

【符号の説明】[Explanation of symbols]

1 シールドケース 1a 切欠部 1b 丸み 2 プリント基板 2a 支持部 2b 支持部の基部の丸み 3 集合基板 4 スリット 5 割取り用のV溝DESCRIPTION OF SYMBOLS 1 Shield case 1a Notch 1b Roundness 2 Printed circuit board 2a Support part 2b Roundness of the base of a support part 3 Assembly board 4 Slit 5 V groove for splitting

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) H05K 9/00 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. 7 , DB name) H05K 9/00

Claims (4)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 プリント基板(2)を収容するシールド
ケース(1)に「コ」字状の切欠部(1a)を設けると
共にプリント基板には舌片状の支持部(2a)を設け、
シールドケースの切欠部(1a)の開口縁に丸み(1
b)を形成すると共に、プリント基板の舌片状の支持部
(1a)の基部に丸み(2b)を形成し、この丸み(2
b)に切欠部(1a)の側壁が当接する構成とし、プリ
ント基板をシールドケースへ収容する際、丸み(2b)
が切欠部(1a)を押し開くようにしてシールドケース
の切欠部(1a)にプリント基板の支持部(2a)を嵌
合させ、シールドケースへのプリント基板の取付高さの
位置決めを行うと共に少なくとも仮固定するように構成
したことを特徴とするプリント基板の取付構造。
A shield case (1) for accommodating a printed board (2) is provided with a U-shaped notch (1a) and a tongue-shaped support (2a) on the printed board.
The opening edge of the notch (1a) of the shield case is rounded (1
b), and a rounded portion (2b) is formed at the base of the tongue-shaped support portion (1a) of the printed circuit board.
b) the side wall of the notch (1a) is in contact with
When the printed circuit board is housed in the shield case, it is round (2b)
Together with at least There notch (1a) support of the printed circuit board (2a) is fitted into the notch (1a) of the shield case and the like pushed open, the positioning of the printed circuit board mounting height of the shield case A mounting structure for a printed circuit board, which is configured to be temporarily fixed.
【請求項2】 シールドケース(1)にプリント基板
(2)を取り付けるプリント基板の取付構造において、
集合基板(3)に、複数のプリント基板(2)と、複数
のスリット(4)と、上記複数のプリント基板を分割す
るための分割線(5)とを形成し、上記集合基板(3)
にシールドケース(1)を取り付けた後に上記分割線に
おいて分割するように構成し、シールドケースの切欠部
(1a)の開口縁に丸み(1b)を形成すると共に、プ
リント基板の舌片状の支持部(1a)の基部に丸み(2
b)を形成し、この丸み(2b)に切欠部(1a)の側
壁が当接する構成とし、プリント基板をシールドケース
へ収容する際、丸み(2b)が切欠部(1a)を押し開
くようにしてシールドケースの切欠部(1a)にプリン
ト基板の支持部(2a)を嵌合させ、シールドケースへ
のプリント基板の取付高さの位置決めを行うと共に少な
くとも仮固定するように構成したことを特徴とするプリ
ント基板の取付構造。
2. A printed circuit board mounting structure for mounting a printed circuit board (2) on a shield case (1).
A plurality of printed boards (2), a plurality of slits (4), and a dividing line (5) for dividing the plurality of printed boards are formed on the aggregate board (3).
After the shield case (1) is attached to the shield case, it is configured to be divided at the above-mentioned dividing line, a rounded portion (1b) is formed at the opening edge of the cutout (1a) of the shield case, and a tongue-shaped support of the printed circuit board Round (2a) at the base of the part (1a)
b) is formed and this roundness (2b) is formed on the side of the notch (1a).
The wall comes into contact with the printed circuit board and the shield case
When the printed circuit board is accommodated in the shield case, the support (2a) of the printed circuit board is fitted into the notch (1a) of the shield case so that the roundness (2b) pushes open the notch (1a). A mounting structure for a printed circuit board, wherein the mounting height is determined and at least temporarily fixed.
【請求項3】 シールドケース(1)に複数の切欠部
(1a)を対称位置に設けたことを特徴とする請求項1
または2記載のプリント基板の取付構造。
3. The shield case (1) wherein a plurality of notches (1a) are provided at symmetrical positions.
Or the printed circuit board mounting structure according to 2.
【請求項4】 プリント基板(2)に複数の舌片状の支
持部(2a)を対称位置に設けたことを特徴とする請求
項1または2記載のプリント基板の取付構造。
4. The printed circuit board mounting structure according to claim 1, wherein a plurality of tongue-shaped support portions are provided at symmetrical positions on the printed circuit board.
JP05289737A 1993-10-27 1993-10-27 PCB mounting structure Expired - Fee Related JP3102735B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP05289737A JP3102735B2 (en) 1993-10-27 1993-10-27 PCB mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP05289737A JP3102735B2 (en) 1993-10-27 1993-10-27 PCB mounting structure

Publications (2)

Publication Number Publication Date
JPH07122876A JPH07122876A (en) 1995-05-12
JP3102735B2 true JP3102735B2 (en) 2000-10-23

Family

ID=17747108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP05289737A Expired - Fee Related JP3102735B2 (en) 1993-10-27 1993-10-27 PCB mounting structure

Country Status (1)

Country Link
JP (1) JP3102735B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4536467B2 (en) 2004-09-17 2010-09-01 株式会社エヌ・ティ・ティ・ドコモ Flat circuit housing

Also Published As

Publication number Publication date
JPH07122876A (en) 1995-05-12

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