JPH029194A - Flexible printed circuit board arrangement structure and manufacture of flexible printed circuit board - Google Patents

Abstract

PURPOSE:To continuously arrange FPC substrates on a paste board with good positional accuracy by sticking an insulating thin sheet, wherein a plurality of the printed circuit parts are formed, on a peeling board with a double adhesive tape while cutting only an insulating thin sheet along the printed circuit parts. CONSTITUTION:A plurality of printed circuit parts 3 are formed by etching on the surface of a long insulating thin sheet 1. The thin sheet 1 is stuck on a peeling board 4 with a double adhesive tape 5. Board perforations 6, terminal holes 7 of the circuit parts 3 are opened, while half-cutting along the circuit parts 3 for cutting off only the thin sheet 1. When the thin sheet of the part excepting the circuits 3 are peeled from on the board 4, a structure, wherein the FPC substrates 3 are arranged with good accuracy on the board 4, can be obtained. The substrates can be arranged during the manufacture of the FPC substrates.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a flexible printed circuit board array structure in which a plurality of flexible printed circuit boards are arranged on a release mount, and a method for manufacturing a flexible printed circuit board.

(Prior Art) This type of flexible printed circuit board (hereinafter referred to as FPC board) is mainly used for signal transmission of movable electronic parts.
One end of the FPC board is installed on the gimbal board, and the other end is connected to a signal processing unit remote from the end, and signals are sent and received to the coil terminal on the gimbal board via this FPC. - Generally, this type of FPC board has w4 on an insulating film.
After pasting tN and forming a circuit using a known photoresist method, the circuit is manufactured by cutting into a plurality of pieces along the outline of the circuit. Figure 7(a) shows the FPC manufactured in this way.
This is an example of the board 8, and may have a terminal insertion hole 9 for attachment to an electronic component.

As for the conventional FPC board, double-sided adhesive tape 16 is attached to the back surface 8a of the board in advance as a single item as shown in FIGS. 7(a) and 7(b).
There are two types of electronic components, one on which a protective paper 17 is attached, and one on which an adhesive tape is not added and each piece is fixed one by one using an adhesive when attached to an electronic component. Since the FPC board itself has a weak structure, it is difficult to assemble it into electronic components by manually taking out one by one from a large number of them placed in a storage box etc. during the process and gluing them to the electronic components. In order to improve this, multiple FPC boards produced as single items are first pasted onto a long mount by hand, and the assembly is supplied to the process in the form of an array mount, where they are peeled off one by one from the mount and assembled. A method is being taken.

(Problem to be solved by the invention) The method of supplying a weak FPC board as a single item to a process for assembling electronic components and electronic equipment, and gluing it together is a method that prevents the board from breaking during transportation or assembly of the FPC board. There is a risk that
Storage and management on the part of workers is also troublesome. Also 1
It takes a lot of work to attach each one to electronic components with adhesive. If the mount is pasted onto a long mount, it takes an extra effort to paste, and since the pasting is done manually, the arrangement will be uneven, making it difficult to automate attachment to electronic components. .

The present invention enables FPC boards to be continuously arranged on a release mount with high positional accuracy in parallel with the manufacturing process, that is, during the manufacturing process, and the reference holes for mounting each FPC board can also be formed at the same time. The object of the present invention is to provide an FPC board array structure and a method for manufacturing an FPC board, which enable automation of the work of adhering to electronic components.

(Means for Solving the Problems) According to the present invention, there is provided a release mount in which a plurality of circuit board reference holes and sheet feeding holes are formed at a predetermined pitch, and a release mount is pasted onto the release mount via a double-sided adhesive tape. There is provided an FPC board array structure comprising a plurality of FPC boards arranged in a fixed direction and aligned with the circuit board reference hole.

According to another aspect of the present invention, a release mount, an insulating thin sheet pasted onto the release mount via a double-sided adhesive tape, and an insulating thin sheet arranged at predetermined intervals on the insulating thin sheet. An FPC board array structure is provided having a plurality of printed circuit portions etched into the thin sheet and separated from the thin sheet.

In the method for manufacturing an FPC board according to the present invention, an insulating thin sheet on which a plurality of printed circuit parts are formed by etching is pasted onto a release mount via double-sided adhesive tape, and in this state, a thin insulating sheet is formed by etching a plurality of printed circuit parts. At the same time, half-cutting the thin sheet, punching a mount feed hole in the release mount from above and forming a terminal hole in the printed circuit section, and then peeling off the insulating thin sheet from the release mount, leaving the printed circuit section. This is how it was done.

(Example) Next, embodiments of the present invention will be described with reference to the drawings.

1 to 5 are plan views showing each process step of an FPC board array structure and a method of manufacturing an FPC board according to an embodiment of the present invention. First, FIG. 1 shows an insulating thin sheet 1. In manufacturing the final FPC board array structure 10 (FIG. 5) of the present invention, a thin sheet 1 of a long polyimide film, etc. However, a long release mount having approximately the same length as the thin sheet is prepared. A plurality of etching reference holes 2 are formed on both sides of the insulating thin sheet 1 at predetermined intervals along the longitudinal direction. A plurality of printed circuit parts 3 are formed on the surface of the sheet by etching using the etching reference hole 2 using a known photoresist method or the like. In the example shown in FIG. 2, circuit portions 3 of the same shape are formed at a constant pitch in a constant direction (longitudinal direction), and are formed in two rows in the width direction of the sheet. In FIG. 2, the printed circuit portion and other portions of the w4FA remaining after etching are indicated by parallel hatching.

Next, on the back side of the thin sheet 1 which has been etched, a release mount 4 which is slightly narrower than the thin sheet 1 and approximately equal in length is pasted as shown by the chain line in FIG. in this case,
A thin strip-shaped double-sided adhesive tape 5 is interposed between (the back side of) the thin sheet l and the long release mount 4 so as to span a portion of each printed circuit section 3 on the back side of the sheet. 15, the thin sheet 1 and the mount 4 are pasted together. Therefore, the thin sheets and the mount are only overlapped but not attached to the parts other than the adhesive tape 5, and the double-sided adhesive tape 5 is indicated by a dashed line in FIG. In this manner, with the thin sheet 1 and the mount 4 integrated, terminal holes 7 are bored through the thin sheet 1 and the mount 4 at predetermined positions of the mount feed hole 6 and the printed circuit section 3.

The terminal hole 7 may be used as a reference hole when attaching the circuit board. A plurality of paper feed sixes 6 are bored at predetermined intervals in the longitudinal direction of the sheet, and these holes 6 are used to carry the sheet to the subsequent process by a feed mechanism (not shown). Sent. Incidentally, the mount feeder 66 and the terminal holes are punched using the etching reference hole 2 mentioned above as a reference.

After that, as shown in FIG. 4, half-cutting is performed from above the thin sheet 1 along the outer shape of the printed circuit section 3. As a result of this half-cutting, the lower mount 4 is not cut off at all, and the printed circuit section 3 is partially cut away. Only thin sheet 1
However, even in this state of separation, the printed circuit section 3 is not easily separated from the mount 4 due to the double-sided adhesive tape 5, and the thin sheet 1 itself is also separated from the mount 4 by the long and thin adhesive tape 5. In this way, an FPC board array structure 11, which is one form of the present invention, is obtained.

Thereafter, the thin sheet 1 is peeled off from the release mount 4 by hand or by vacuum suction, leaving only the printed circuit section 3, and an FPC board array structure 10, which is the final form of the present invention, as shown in FIG. 5 is obtained. can get. This final array structure IO has a plurality of mount feed holes and terminal holes (circuit board reference holes) formed at a predetermined pitch on a long peelable mount, and a plurality of printed circuits aligned with the terminal holes. The FPC boards 12 are arranged in a certain direction, thereby obtaining an array structure 10 of FPC boards 12 arranged at a certain interval on a mount. In addition, although a long mount was used in the illustrated example,
They can also be arranged on a rectangular or arbitrary mount with a wide area.

In such an FPC array structure, the circuit parts are aligned in a certain direction and the precision of the arrangement position is high, so the mount is sent to an automatic assembly machine and fixed at a predetermined position by vacuum suction etc.
Automated installation is possible by peeling off the FPC board from the mount using a vacuum chuck, etc., and pasting it on the required parts using the adhesive tape. FIG. 6 is a plan view of the FPC board 14 manufactured as described above attached to the gimbal plate 13 of the floppy head.

A part of the board corresponding to the back surface of the double-sided adhesive tape 15 attached to a part of the FPC board 12 is picked up from the mount with a suction chuck, and is conveyed onto the gimbal board 13 and pasted. In this embodiment, the core 16 protrudes above the gimbal plate 13 and the coil is disposed above the gimbal plate, and the coil terminal is directly soldered to the circuit of the FPCPCl3. When the coil is under the gimbal plate, the bobbin terminals and the board circuit are glued together because the bobbin terminals protrude above the gimbal plate. The other end of the FPC board is connected to a signal input/output section separate from the floppy head.

(Effects of the Invention) As explained above, according to the present invention, the outline of the circuit part can be separated from the thin sheet while it is held on the mount, and the mounting reference holes for the terminals of the circuit part can also be punched. It can be simultaneously punched with a press, and compared to the conventional method of pasting individual FPC boards one by one onto a mount by hand, the arrangement of the bases is more accurate, and it is done during the manufacturing process of the board itself. , efficiency and cost reduction are achieved.

It has excellent effects such as automatic pasting to necessary parts because the pasting pitch and posture of the array are highly accurate.

[Brief explanation of the drawing]

1 to 6 show examples of the present invention, in which FIG. 1 is a plan view of an insulating thin sheet in the middle of manufacturing an FPC board array structure, and FIG. 2 is a photoresist. Fig. 3 is a plan view of the thin sheet shown in Fig. 2 and a mount attached to each other, and Fig. 4 is a plan view of the thin sheet with half-cutting applied to the thin sheet. A plan view of the FPC board array structure in a state,
Figure 5 is an overall perspective view of the FPC board array structure with the thin sheet removed from the mount leaving only the printed circuit section, Figure 6 is a plan view of the floppy head with the FPC board attached to the gimbal board, and Figure 7 Figure (a). (b) is an enlarged plan view and side view of a conventional FPCM board. ...Insulating thin sheet, ...Printed circuit section, ...Double-sided adhesive tape, ...Terminal hole, 10.1 2...FPC board, 1

Claims (3)

[Claims] (1). a release mount in which a plurality of circuit board reference holes and mount feed holes are formed at a predetermined pitch; and a release mount that is affixed to the release mount via double-sided adhesive tape and aligned with the circuit board reference holes so as to move in a certain direction. 1. A flexible printed circuit board array structure comprising a plurality of arranged flexible printed circuit boards. (2). A release mount, an insulating thin sheet pasted on the release mount via double-sided adhesive tape, and printed circuit parts etched on the insulating thin sheet and arranged at predetermined intervals, the A flexible printed circuit board array structure, wherein the printed circuit section is separated from the insulating thin sheet. (3). An insulating thin sheet on which a plurality of printed circuit parts are formed by etching is pasted onto a release mount via double-sided adhesive tape, and in this state half-cutting is performed along the printed circuit parts, and the A flexible printed circuit board characterized in that a mount feed hole is bored in a release mount and a terminal hole is formed in the printed circuit section, and then the insulating thin sheet is peeled off from the release mount, leaving the printed circuit section. manufacturing method.