JPH0453020Y2 - - Google Patents
Info
- Publication number
- JPH0453020Y2 JPH0453020Y2 JP14609987U JP14609987U JPH0453020Y2 JP H0453020 Y2 JPH0453020 Y2 JP H0453020Y2 JP 14609987 U JP14609987 U JP 14609987U JP 14609987 U JP14609987 U JP 14609987U JP H0453020 Y2 JPH0453020 Y2 JP H0453020Y2
- Authority
- JP
- Japan
- Prior art keywords
- board
- printed circuit
- circuit board
- sub
- thin printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002390 adhesive tape Substances 0.000 claims description 12
- 239000011093 chipboard Substances 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 239000002699 waste material Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案はプリント配線基板に関し、特に薄形基
板への部品自動実装に対する自動搬送、自動実
装、基板板取り等の改良をはかつたプリント配線
基板に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to printed wiring boards, and in particular to printed wiring that improves automatic conveyance, automatic mounting, board removal, etc. for automatic mounting of components on thin boards. Regarding the board.
第３図は従来の薄形プリント基板を作るための
多数個取り基板の一例を示す斜視図である。
FIG. 3 is a perspective view showing an example of a multi-chip board for making a conventional thin printed circuit board.
従来、薄形のプリント基板への自動実装に対
し、チツプ部品を自動搭載する時には、基板に撓
みが生じ、部品がはねるという問題があり、又、
リフロー炉による半田付け時には、基板にそりや
ねじれが生じるなど、自動実装に対してはプリン
ト基板の厚さの下限が制御されていた。その為、
薄形プリント基板を別の治具により支えていた。 Conventionally, when automatically mounting chip components on a thin printed circuit board, there was a problem that the board would bend and the components would bounce.
When soldering in a reflow oven, the lower limit of printed circuit board thickness has been controlled for automatic mounting, such as warpage and twisting of the board. For that reason,
The thin printed circuit board was supported by another jig.
チツプ部品の自動実装対策用の薄形プリント基
板の一例として、第３図に示すようにものがあ
る。即ち、第１図のような副基板３に対して、第
３図に示す薄形の多数個取り基板６の裏面に両面
接着テープを貼り付け、重ね合わせて取付ける。
こうして基板に撓みが出ないようにしておいて、
プリント基板部８にチツプ部品を自動搭載する。
その後、捨て板部７を切り捨てて、所望のプリン
ト基板部８を得るようになつていた。 An example of a thin printed circuit board for automatic mounting of chip components is shown in FIG. That is, with respect to the sub-board 3 as shown in FIG. 1, double-sided adhesive tape is applied to the back surface of the thin multi-chip board 6 shown in FIG. 3, and the two are overlapped and attached.
In this way, the board is prevented from bending,
Chip parts are automatically mounted on the printed circuit board section 8.
Thereafter, the desired printed circuit board section 8 was obtained by cutting off the waste board section 7.
上述した従来の薄形プリント基板は、チツプ部
品の自動実装対策として、板状の副基板に対して
多数個取り基板に両面接着テープを貼り付け、重
ね合わせて取り付けていた。その為、両面接着テ
ープの貼り付け面積が多く、テープの消費量が大
きくなると共に剥離の際にも力を要しており、ま
た捨て板部分の面積も多く、プリント基板のコス
トアツプとなるという欠点がある。
In the conventional thin printed circuit board described above, double-sided adhesive tape is pasted onto a multi-chip board and the boards are stacked and attached to a plate-shaped sub-board as a countermeasure for automatic mounting of chip components. For this reason, the adhesive area of the double-sided adhesive tape is large, which increases the amount of tape consumed and requires force when peeling it off.Also, the area of the waste board is large, which increases the cost of the printed circuit board. There is.
本考案のプリント配線基板は、予め所要の形状
に型抜きした薄形プリント基板本体と、該薄形プ
リント基板本体の裏面に貼付けた両面接着テープ
と、副基板とからなり、前記薄形プリント基板本
体は前記両面接着テープにより複数枚が前記副基
板上に貼付けられた状態でチツプ部品を自動実装
されたのちに前記副基板からはがされるように構
成されている。
The printed wiring board of the present invention consists of a thin printed circuit board body cut out in advance into a desired shape, a double-sided adhesive tape attached to the back side of the thin printed circuit board body, and a sub-board. The main body is configured to be peeled off from the sub-board after a plurality of chip parts are automatically mounted on the sub-board using the double-sided adhesive tape.
次に、本考案について図面を参照して説明す
る。
Next, the present invention will be explained with reference to the drawings.
第１図ａは本考案の一実施例の斜視図、第１図
ｂは本実施例に使用する副基板の斜視図、第２図
ａ及びｂは本実施例の薄形プリント基板の位置決
め及び取外しの状況を示す斜視図である。 Fig. 1a is a perspective view of an embodiment of the present invention, Fig. 1b is a perspective view of a sub-board used in this embodiment, and Figs. FIG. 3 is a perspective view showing the state of removal.
本実施例は薄形プリント基板１、両面接着テー
プ２及び副基板３を有してなる。 This embodiment includes a thin printed circuit board 1, a double-sided adhesive tape 2, and a sub-board 3.
第１図に示すように、所要形状に型抜きされた
薄形プリント基板１は裏面に両面接着テープ２を
貼り付け、副基板３の所定の位置へ貼り付けられ
ている。この副基板３には、薄形プリント基板１
を貼り付ける際の位置決め用のピン５を挿入する
ピン挿入穴３′が、薄形プリント基板１の１枚当
りに２個所備えられている。第２図ａに示すよう
に、貼り付けの際にピン５を裏面より挿入し、薄
形プリント基板１をこのピン５に押し当てる様に
して位置決めし、貼り付ける。なおピン５は貼り
付け終了後、取り外される。また副基板３には自
動実装用の基準穴４，４′が設けられている。 As shown in FIG. 1, a thin printed circuit board 1 that has been die-cut into a desired shape is pasted with double-sided adhesive tape 2 on its back surface, and is pasted onto a sub-board 3 at a predetermined position. This sub-board 3 includes a thin printed circuit board 1
Each thin printed circuit board 1 is provided with two pin insertion holes 3' into which positioning pins 5 are inserted when pasting. As shown in FIG. 2a, when pasting, pins 5 are inserted from the back side, and the thin printed circuit board 1 is positioned so as to be pressed against the pins 5, and then pasted. Note that the pin 5 is removed after pasting is completed. Further, the sub-board 3 is provided with reference holes 4, 4' for automatic mounting.
このように副基板３に貼り付けられて撓みなど
が生じない薄形プリント基板１に対して、チツプ
部品の自動実装が行われる。自動実装終了後、副
基板３と薄形プリント基板１とを分離する際に使
用するピン５′を挿入するピン挿入穴３″が第２図
ｂに示すように、薄形プリント基板１の角の１個
所に当る様な位置に設けられている。このピン挿
入穴３″にピン５′を挿入することにより、薄形プ
リント基板１の角を浮かして、副基板３からはが
すことができる。 In this way, chip components are automatically mounted on the thin printed circuit board 1 which is attached to the sub-board 3 and is not bent. After the automatic mounting is completed, the pin insertion holes 3'' into which the pins 5' used to separate the sub-board 3 and the thin printed circuit board 1 are inserted are located at the corners of the thin printed circuit board 1, as shown in Figure 2b. By inserting a pin 5' into this pin insertion hole 3'', the corner of the thin printed circuit board 1 can be lifted and removed from the sub-board 3.
なお、使用している両面接着テープ２は、リフ
ローにも耐える様な耐熱性を有すると共に、接着
力については、仮り止め程度の強さとし、自動搭
載時の薄形プリント基板１のずれ等が発生しない
程度であり、簡単に剥離出来るものとなつてい
る。 The double-sided adhesive tape 2 used has heat resistance that can withstand reflow, and the adhesive strength is only strong enough to temporarily hold it, so that the thin printed circuit board 1 may shift during automatic mounting. It can be easily peeled off.
以上説明した様に本考案は、薄形プリント基板
を定尺材より切り離す前に両面接着テープを裏面
に貼り、型抜きして１枚の基板として副基板へ貼
り合わせることにより、従来、多数個取り基板と
していた為に大きかつた捨て板部が少なくなつて
コストダウンとなると共に、両面接着テープの効
果により、薄形プリント基板のそり、ねじれ、浮
き等の自動実装時の不具合点が改善される効果が
ある。
As explained above, the present invention is capable of attaching double-sided adhesive tape to the back of a thin printed circuit board before cutting it from a regular length material, cutting it out, and bonding it to a sub-board as a single board. Since it is used as a stand-alone board, there are fewer large waste boards, which reduces costs, and the double-sided adhesive tape improves problems during automatic mounting such as warping, twisting, and lifting of thin printed circuit boards. It has the effect of
第１図ａは本考案の一実施例の斜視図、第１図
ｂは本実施例に使用する副基板の斜視図、第２図
ａ及びｂは本実施例の薄形プリント基板の位置決
め及び取外しの状況を示す斜視図、第３図は従来
の薄形プリント基板を作るための多数個取り基板
の一例を示す斜視図である。
１……薄形プリント基板、２……両面接着テー
プ、３……副基板、３′，３″……ピン挿入穴、
４，４′……基準穴、５，５′……ピン、６……多
数個取り基板、７……捨て板部、８……プリント
基板部。
Fig. 1a is a perspective view of an embodiment of the present invention, Fig. 1b is a perspective view of a sub-board used in this embodiment, and Figs. FIG. 3 is a perspective view showing a state of removal, and FIG. 3 is a perspective view showing an example of a multi-chip board for making a conventional thin printed circuit board. 1...Thin printed circuit board, 2...Double-sided adhesive tape, 3...Subboard, 3', 3''...Pin insertion hole,
4, 4'...Reference hole, 5, 5'...Pin, 6...Multi-piece board, 7...Discarded board part, 8...Printed board part.
Claims (1)
本体と、該薄形プリント基板本体の裏面に貼付け
た両面接着テープと、副基板とからなり、前記薄
形プリント基板本体は前記両面接着テープにより
複数枚が前記副基板上に貼付けられた状態でチツ
プ部品を自動実装されたのちに前記副基板からは
がされるように構成したことを特徴とするプリン
ト配線基板。 It consists of a thin printed circuit board body cut out in advance into a desired shape, a double-sided adhesive tape attached to the back side of the thin printed circuit board body, and a sub-board. 1. A printed wiring board, characterized in that the printed wiring board is configured such that chip components are automatically mounted while the chip components are attached to the sub-board and then peeled off from the sub-board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14609987U JPH0453020Y2 (en) | 1987-09-24 | 1987-09-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14609987U JPH0453020Y2 (en) | 1987-09-24 | 1987-09-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6450463U JPS6450463U (en) | 1989-03-29 |
| JPH0453020Y2 true JPH0453020Y2 (en) | 1992-12-14 |
Family
ID=31415272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14609987U Expired JPH0453020Y2 (en) | 1987-09-24 | 1987-09-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0453020Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4543688B2 (en) * | 2003-02-04 | 2010-09-15 | 東レ株式会社 | Circuit board manufacturing method and manufacturing apparatus |
-
1987
- 1987-09-24 JP JP14609987U patent/JPH0453020Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6450463U (en) | 1989-03-29 |
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