JPS59211295A - Solderless connection printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a structure of a solderless printed wiring board that does not require connecting and fixing leads by solder.

Conventional printed wiring boards (hereinafter referred to as PWB) are made by forming a required conductive pattern by printing, etching, etc. on a pre-prepared surface of a required thickness, and at the same time providing a through-hole at a required position and mounting components inserted into the hole. The leads were connected and fixed using solder.

However, in order to perform the soldering process automatically, it is necessary to immerse the mounted PWB in a molten solder tank or pass it through a solder jet tank, which is not only necessary for the PWB itself but also for the mounted parts. However, the process and equipment are complicated and expensive, such as the presence of a 9-bottom joint that can cause thermal shock, and the need to remove flux after soldering.

A conductive foil adhered to at least the position of the hole marked on the surface of the plave is penetrated in the desired shape near the center of the hole, and a plurality of plates processed in this way are placed at the position of the hole. A solderless connection printed wiring board is provided in which a lead inserted into the hole is mechanically fixed by the conductive foil protruding from the periphery of the hole and electrically connected by aligning the gold and adhering the A''JI layer. The entire purpose is to provide.

Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings.

FIG. 1 is a perspective view showing an embodiment of a printed wiring board according to the present invention.

That is, a desired conductive pattern 3'ft is formed on the surface of the pre-prefabricated laminate 10 and the component mounting surface 2, which will be described later, in the same way as a normal printed wiring board, and a lead insertion hole 4 is formed in the laminate at the insertion part of the mounted component lead. At the same time, a conductive foil such as a copper foil is provided with an X on its surface to cover the hole 4 as shown in this figure.
A letter-shaped through hole 5 is provided.

Figure 2 (a) is a sectional view taken along line A-A in Figure 1, and is 100 μm thick.
At least the through holes 4, 4.・・・・・・Conductive foil 7, 7, attached to the periphery
. . . through holes 5, 5 . . . similar to those shown in FIG.・・・
. . . and attach the required number of sheets with adhesive 8, 8.・・・
It is laminated and fixed at the bend.

The component 9 mounted on the printed wiring board of the present invention constructed as described above has its leads 10 connected to the pre-previous 6, 6 . Conductive foil 7.7 protruding from the periphery of the lead insertion hole 4 provided in . . . . holes 5, 5. . . ., it is pressed and bitten while bending its edges, and since it is elastically supported by a large number of bent portions, it is fixed without coming off and faces the mounting component 9. Since it is in contact with the uppermost conductive foil 7 over a considerable area, sufficient electrical connection is ensured.

A printed wiring board having the above-mentioned structure can be easily manufactured by, for example, the following procedure.

FIG. 3 is a diagram showing the manufacturing process.

That is, the aligned lead insertion holes 4, 4°...
...Prebrave 6,6° for the required number of all holes drilled.
...Prepare everything and place conductive foil such as steel foil on one surface of each7.
7.・・・・・・All adheres. This attachment may be carried out, for example, by pasting copper foil or the like with an adhesive.

Next, a photoresist film 11 is attached to both sides of the pre-plate 6 to which the conductive foil 7 has been attached using a laminator, exposed and developed, and then etched.

In the etching step, the desired wiring pattern 3 is formed and at the same time, the conductive foil 7 extending from the wiring pattern 3 and covering the lead insertion hole 4 of the pre-plave 6 is tightened.

5. Of course, holes may be made in the conductive foil attached to the pre-prev from the beginning by etching or the like. After that, the photoresist film 11 is removed and adhesives 8, 8 . ...
...It is completely printed or coated, laminated, and fixed with adhesive.

The conductive foil attached to the surface of each Bribrave may have the same pattern as the top layer plate facing the mounted components, but in order to save conductive foil, the conductive foil on the second and subsequent layers should be limited to the area around the lead insertion hole. It may be attached.

Further, the lead insertion hole 4 of the pre-preave may be Y-shaped, and a circular shape is suitable for supporting and fixing a glue 1o having a similar cross section.

Further, as shown in the figures, the two-shaped hole is suitable for supporting and fixing a flat lead 12i used for DIP, etc., and the lead 12 is inserted so as to cross the oblique side of z as shown by the dashed line in the figure. In this case, the contact area between the two is extremely close, which is advantageous.

Since the present invention is configured and used as described above, it can be manufactured without changing the conventional printed wiring board manufacturing equipment, etc., and the soldering process can be improved.
Since it is possible to cut and remove the parts, it greatly simplifies the component mounting process.In addition to soldering, there is no chance of thermal shock problems associated with the soldering process, reducing the number of man-hours required for manufacturing printed circuits and improving product dripping. This makes it possible to achieve a remarkable effect in reducing manufacturing costs.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing the external appearance of a printed wiring board according to the present invention, FIG. 2(a) is a cross-sectional view taken along line A-A, FIG. Figures 4(a) to 4(a) to 4(a) are diagrams explaining the manufacturing process of the printed wiring board according to the present invention.
c) is the lead insertion hole 'f! : It is a figure which shows the Example with a different shape of the through-hole drilled in the covering conductive foil. Hole, 5......Through hole drilled in conductive foil. 6... Pre-play, 7...
...Lead insertion patent applicant Toyo Tsushinki Co., Ltd. Gikukai

Claims (1)

[Scope of Claims] (1) A conductive foil attached to at least a position covering the hole of a Bribrave having a hole for inserting a mounted component lead in a predetermined position is shaped into a desired shape near the center of the hole. It can be penetrated and processed like this for several trays. Poor, ugly. Hole. □ By stacking and fixing with adhesive, the mounted component lead inserted into the hole is fixed mechanically and electrically with the sandy conductive foil edge protruding from the periphery of the hole. The top layer plate facing the component has metal foil through holes near the center of the mounted component lead insertion hole and a desired wiring pattern extending from these at the same time. A solderless connection printed wiring board according to claim 1. (3) The shape of the metal foil through-hole that covers the mounting component lead insertion hole of the pre-prev is shaped like a Roman letter X, Y, or an asterisk, thereby making it compatible with a lead having a circular or similar cross-sectional shape. A solderless connection printed circuit board according to claim 1 or 2. (4) The device according to claim 1 or 2, characterized in that the shape of the metal foil through hole that covers the mounting component lead insertion hole of the pre-prev is shaped like a Roman letter Z to correspond to a flat lead. Solder connection printed wiring board.