JPH0119413Y2 - - Google Patents
Info
- Publication number
- JPH0119413Y2 JPH0119413Y2 JP1983085129U JP8512983U JPH0119413Y2 JP H0119413 Y2 JPH0119413 Y2 JP H0119413Y2 JP 1983085129 U JP1983085129 U JP 1983085129U JP 8512983 U JP8512983 U JP 8512983U JP H0119413 Y2 JPH0119413 Y2 JP H0119413Y2
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- pattern
- pressure contact
- fpc
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003466 welding Methods 0.000 claims description 36
- 239000010408 film Substances 0.000 claims description 34
- 239000000463 material Substances 0.000 claims description 9
- 239000013039 cover film Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 5
- 230000003014 reinforcing effect Effects 0.000 claims description 5
- 239000002184 metal Substances 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 239000011889 copper foil Substances 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 230000002787 reinforcement Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Description
【考案の詳細な説明】
本考案は、フレキシブルプリント基板の接続構
造の改良に関するものである。[Detailed Description of the Invention] The present invention relates to an improvement in the connection structure of a flexible printed circuit board.
フレキシブルプリント基板から成る電子回路基
板は例えばカメラ等において広く利用されている
が、カメラの各種操作部材は、従来からのほぼ決
まつた場所に設置されていた方が、使用者の立場
からみて便利であり、電子回路基板の実装上の都
合からむやみにその位置を変更する事は許されな
い事情がある。そのため、各種操作部材の設定に
よる信号出力は、長い配線パターンによつて電子
回路に導く必要がある。また電子回路自体も、そ
の規模の増大から１ケ所にまとめて設置すること
は不可能となつてきており、カメラ内のスペース
を有効に利用して電子回路を各所に散在させ、そ
れらの電子回路どうしをも長い配線パターンにて
接続する必要がある。 Electronic circuit boards made of flexible printed circuit boards are widely used in cameras, etc., but it is more convenient from the user's perspective if the various operating parts of the camera are installed in roughly fixed locations. Therefore, there are circumstances in which it is not permissible to change the position unnecessarily due to the mounting convenience of the electronic circuit board. Therefore, it is necessary to lead the signal outputs based on the settings of the various operating members to the electronic circuit through a long wiring pattern. In addition, due to the increase in the scale of electronic circuits, it has become impossible to install them all in one place, so the space inside the camera can be effectively used to spread out electronic circuits in various locations. It is necessary to connect them with long wiring patterns.
ところで、上記配線パターン相互の接続方法で
あるが、従来よりリード線のハンダづけを一本毎
に手作業で行なつていた。この方法は簡便なもの
ではあるが、工数の増加、賃率の上昇等のマイナ
ス面が多く、リード線の配線本数の極端な増加と
いう事情には即さなくなつているのが実情であ
る。 By the way, regarding the above-mentioned method of interconnecting the wiring patterns, conventionally the lead wires have been manually soldered one by one. Although this method is simple, it has many negative aspects such as an increase in man-hours and a rise in labor rates, and the reality is that it is no longer suitable for the extreme increase in the number of lead wires.
このために最近いわゆる圧接接続法が用いられ
ている。これは、第１の基板の端部に配線パター
ンのうち外部に露出した複数の配線出力パターン
（圧接パターン）を矩形形状に集中させ、その配
線出力パターン（圧接パターン）を合致するよう
な配線出力パターン（圧接パターン）を設けた第
２の基板を、上記両パターンが向い合うように第
１の基板に対向させ、双方の基板を圧力によつて
押し付けて双方のパターン間の導通をはかるよう
にしたものである。 For this purpose, a so-called pressure connection method has recently been used. This is a method of concentrating a plurality of wiring output patterns (pressure contact patterns) exposed outside of the wiring patterns at the end of the first board into a rectangular shape, and outputting wiring that matches the wiring output patterns (pressure contact patterns). A second substrate provided with a pattern (pressure contact pattern) is placed to face the first substrate such that both patterns face each other, and both substrates are pressed together with pressure to establish electrical conduction between both patterns. This is what I did.
従来の圧接接続構造を第１図〜第３図に示す。
第１図はカメラボデイＢに収納された制御回路
（電子回路）を搭載した基板１０，１２，１４及
び１６の位置関係を示した斜視図である。 Conventional pressure welding connection structures are shown in FIGS. 1 to 3.
FIG. 1 is a perspective view showing the positional relationship between substrates 10, 12, 14, and 16 on which control circuits (electronic circuits) are mounted and housed in camera body B. As shown in FIG.
第２図は、第１図における圧接部１８，２０で
の各基板１０，１２，１４及び１６の相互位置、
および締付部材との関係を示す分解斜視図であ
る。 FIG. 2 shows the mutual positions of the substrates 10, 12, 14, and 16 at the pressure contact parts 18, 20 in FIG.
FIG. 3 is an exploded perspective view showing the relationship between the two parts and the tightening member.
第３図ａは第２図に示すFPC１０とEPC１２
との圧接部１８での拡大図であり、ｂは第２図に
示す圧接部１８でのＹ−Ｙ矢視断面図である。第
１図及第２図に示す基板１０，１２及び１４はフ
レキシブルプリン板（以下「FPC」と略称する）
であり、基板１６はリジツド基板である。FPC
１０とFPC１２とは、圧接部１８にて、また
FPC１０とFPC１４とは圧接部２０にて各々電
気的導通がはかられている。FPC１０は、巻上
側（第２図中左側）において圧接部１８地点の裏
側に圧接パターン２２ａ〜２２ｇ（第３図）が、
巻戻側の表側には圧接パターン２４が、中央部に
は測光用IC２５が各々設けられており、一方
FPC１２はシヤツターダイヤルＴの機械的変位
を電気信号に変換するパターン２６で変換された
シヤツタタイム情報を伝達するための圧接パター
ン２８ａ〜２８ｇ（第３図）を表側に有している。
またFPC１４は、リジツド基板１６に搭載され
たシーケンス制御用IC３０の信号等を、端子部
３２を介して裏側の圧接パターン３４に伝達して
いるものである。 Figure 3 a shows FPC10 and EPC12 shown in Figure 2.
FIG. 2 is an enlarged view of the pressure contact portion 18, and b is a sectional view of the pressure contact portion 18 shown in FIG. The substrates 10, 12, and 14 shown in FIGS. 1 and 2 are flexible printed circuit boards (hereinafter abbreviated as "FPC").
The substrate 16 is a rigid substrate. FPC
10 and FPC 12 are connected at the pressure welding part 18, and
The FPC 10 and the FPC 14 are electrically connected to each other at the pressure contact portion 20. The FPC 10 has pressure contact patterns 22a to 22g (see FIG. 3) on the back side of the pressure contact portion 18 on the winding side (left side in FIG. 2).
A pressure contact pattern 24 is provided on the front side of the unwinding side, and a photometric IC 25 is provided in the center.
The FPC 12 has pressure contact patterns 28a to 28g (FIG. 3) on its front side for transmitting shutter time information converted by a pattern 26 for converting mechanical displacement of the shutter dial T into an electrical signal.
Further, the FPC 14 transmits signals from the sequence control IC 30 mounted on the rigid substrate 16 to the press-contact pattern 34 on the back side via the terminal portion 32.
第３図ａに示すように、圧接部１８において
FPC１２の圧接パターン２８ａ〜２８ｇは不図
示の電気回路の配線パターンのうちFPCの端子
部でカバーフイルム４７を一部取り除いた露出し
た部分であり、これはFPC１０の圧接パターン
２２ａ〜２２ｇについても同様である。そして第
３図ｂに示すように圧接部１８は、圧接パターン
２２ａ〜２２ｇと２８ａ〜２８ｇとが対向する如
くFPC１０と１２とをセツトした後、その上に
ゴム板３８及び金属板３６を重ね、締付部材であ
るビス４０を金属板３６、ゴム板３８及びFPC
１０，１２の貫通孔３５，３７，３９及び４１を
貫通させた後、下方の金属板４２のねじ穴４３に
螺合させることにより完成される。この事情は他
方の圧接部２０についても同様であり、FPC１
０の圧接パターン２４とFPC１４の圧接パター
ン３４とを重ね、ビス４２を金属板４６、ゴム板
４４、FPC１０，１４の貫通孔を貫通させた後、
下方の金属板４８に螺合することにより完成され
る。 As shown in FIG. 3a, at the pressure welding part 18,
The pressure contact patterns 28a to 28g of the FPC 12 are exposed portions of the wiring pattern of an electric circuit (not shown) where the cover film 47 is partially removed at the terminal portion of the FPC, and the same applies to the pressure contact patterns 22a to 22g of the FPC 10. be. As shown in FIG. 3b, the pressure contact part 18 is constructed by setting the FPCs 10 and 12 so that the pressure contact patterns 22a to 22g and 28a to 28g face each other, and then overlaying a rubber plate 38 and a metal plate 36 thereon. Screw 40, which is a tightening member, is attached to metal plate 36, rubber plate 38 and FPC.
After passing through the through holes 35, 37, 39, and 41 of 10 and 12, the metal plate 42 is screwed into the screw hole 43 of the lower metal plate 42, thereby completing the process. This situation is the same for the other pressure contact part 20, and FPC1
After overlapping the pressure contact pattern 24 of 0 and the pressure contact pattern 34 of the FPC 14 and passing the screw 42 through the metal plate 46, the rubber plate 44, and the through holes of the FPCs 10 and 14,
It is completed by screwing into the lower metal plate 48.
第３図に示すように向かい合う圧接パターンの
接触圧は必要とされる接触抵抗を安定して低く抑
えるために、ある程度の制御が必要とされる。つ
まり、ビス４０のねじ込み量が足りないと接触圧
が不足して接触不良となり逆に多すぎると、ゴム
３８が弾性限界を越えてしまつて永久変形を起こ
し、接触抵抗に経年変化をもたらしてしまう危険
がある。 As shown in FIG. 3, the contact pressure of the opposing pressure contact patterns requires a certain degree of control in order to keep the required contact resistance stably low. In other words, if the screw 40 is not screwed in enough, the contact pressure will be insufficient and the contact will be poor, and if it is too much, the rubber 38 will exceed its elastic limit and become permanently deformed, causing a change in contact resistance over time. There is danger.
また、一方の圧接部１８の断面を示す第３図ｂ
から明らかなように、ビス４０が通過するFPC
１０，１２の孔３９，４１のまわりには補強の目
的でカバーフイルム４５，４７がそれぞれに残さ
れている。そしてベースフイルムとカバーフイル
ム４５，４７とは接着剤４９，５１を介して接着
されているが、この接着剤４９，５１の厚みは
FPC製造時のばらつきで厚くなる場合もある。
そうすると、通常のとき圧接パターンの厚みは接
着剤４９，５１とカバーフイルム４５，４７との
厚みとほぼ等しくなつているが、上述のように接
着剤の厚みにばらつきがあると圧接パターンの厚
みより厚くなつてしまうことがある。従つて、第
３図に示したように、圧接パターンのある圧接部
分の厚みt1よりもビス４０によつて締付けられる
締付部分のカバーフイルム４５，４７、接着剤４
９，５１の厚みt2が大となる場合が考えられ、こ
のような場合にはビス締めにて加圧しても孔３９
の近辺のゴム３８のみが大きく変形するが、圧接
部分のゴム３８の変化量が少ないため、必要とさ
れる加圧力が不足して電気的接触不良となる危険
がある。 Also, FIG. 3b shows a cross section of one pressure contact part 18.
As is clear from the FPC through which screw 40 passes
Cover films 45 and 47 are left around holes 39 and 41 of holes 10 and 12, respectively, for reinforcement purposes. The base film and cover films 45, 47 are bonded together via adhesives 49, 51, and the thickness of these adhesives 49, 51 is
It may become thicker due to variations during FPC manufacturing.
Normally, the thickness of the pressure welding pattern is approximately equal to the thickness of the adhesive 49, 51 and the cover films 45, 47, but if there is variation in the thickness of the adhesive as described above, the thickness of the pressure welding pattern becomes It may become thick. Therefore, as shown in FIG. 3, the thickness of the cover films 45, 47 and the adhesive 4 of the tightened part tightened by the screw 40 is smaller than the thickness t1 of the pressure welded part with the pressure welding pattern.
There may be cases where the thickness t 2 of holes 39 and 51 becomes large, and in such cases, even if pressure is applied by tightening screws, the hole 39
Only the rubber 38 in the vicinity of is deformed significantly, but since the amount of change in the rubber 38 in the press-contact portion is small, there is a risk that the necessary pressing force will be insufficient and electrical contact will be poor.
尚、経験的に圧接部１８，２０の金属板３６，
４２，４６，４８、ゴム類３８，４４の加圧部材
はFPCの薄さに比べるとはるかに体積を必要と
するものであり、第１図のように圧接部１８及び
２０の２個所で圧接を行なつた場合には、金属
板、ゴム等が各々二組ずつ必要となるので、実装
スペース上大変不利なものであつた。 It should be noted that, empirically, the metal plates 36 of the pressure welding parts 18, 20,
The pressure members 42, 46, 48 and rubber 38, 44 require a much larger volume compared to the thinness of the FPC, and as shown in Fig. In this case, two sets of each metal plate, rubber, etc. are required, which is very disadvantageous in terms of mounting space.
第４図〜第６図は別の従来例を示し、第１図〜
第３図の圧接部１８，２０が一ケ所にされたもの
である。第４図は、圧接部１８，２０を一ケ所に
まとめ圧接部５６としたときの各FPC１２，５
０，５４の相互位置、および加圧部材との関係を
示す分解斜視図である。第５図は、圧接部５６で
の各基板１２，５０，５４の圧接パターンの相互
関係を示す説明図である。また第６図は、第４図
に示す圧接部５６のＺ−Ｚ矢視断面図である。な
お第１図〜第３図の部品番号と同様である部品に
ついては説明を省略する。第４図に示すFPC５
４は、リジツド基板１６上に搭載されたシーケン
ス制御用IC３０の信号を端子部３２を介して裏
面側の圧接パターン部７０に伝達しているもので
あり、FPC１０の上部にまたがるようにして配
設されている。 Figures 4 to 6 show another conventional example, and Figures 1 to 6 show another conventional example.
The pressure contact portions 18 and 20 shown in FIG. 3 are placed in one place. FIG. 4 shows each FPC 12, 5 when the pressure contact parts 18, 20 are combined in one place to form the pressure contact part 56.
FIG. 5 is an exploded perspective view showing the mutual positions of 0 and 54 and the relationship with the pressure member. FIG. 5 is an explanatory diagram showing the mutual relationship between the pressure contact patterns of the respective substrates 12, 50, and 54 at the pressure contact portion 56. Further, FIG. 6 is a sectional view taken along the Z-Z arrow of the pressure contact portion 56 shown in FIG. 4. Note that descriptions of parts having the same part numbers as those shown in FIGS. 1 to 3 will be omitted. FPC5 shown in Figure 4
4 transmits the signal of the sequence control IC 30 mounted on the rigid board 16 to the press-contact pattern part 70 on the back side via the terminal part 32, and is arranged so as to straddle the upper part of the FPC 10. has been done.
さらにカメラボデイに固定された金属板７２の
上に前記FPC１２，FPC５０及びFPC５４が設
置される。ここでFPC１２の圧接パターン６４
と、FPC５０の裏面の圧接パターン５９とは互
いに向かい合うように設けられている。この上に
はFPC５０の表面の圧接パターン５８と、FPC
５４の圧接パターン７０とが互いに向かい合うよ
うに設置されている。そして、圧接部５６は、ビ
ス８２を金属板８４、ゴム板８６、FPC５４，
５０及び１２の貫通孔８８，９０，９２，９４及
び９６を貫通させた後、下方の金属板７２のねじ
孔９８にねじ込むことにより形成される。 Further, the FPC 12, FPC 50, and FPC 54 are installed on a metal plate 72 fixed to the camera body. Here, the pressure contact pattern 64 of FPC12
and the press-contact pattern 59 on the back surface of the FPC 50 are provided so as to face each other. On this, there is a pressure contact pattern 58 on the surface of the FPC 50, and a pressure contact pattern 58 on the surface of the FPC 50.
54 pressure contact patterns 70 are installed so as to face each other. Then, the pressure contact part 56 connects the screw 82 to the metal plate 84, the rubber plate 86, the FPC 54,
It is formed by passing through the through holes 88, 90, 92, 94 and 96 of 50 and 12 and then screwing into the screw hole 98 of the lower metal plate 72.
第５図は、FPC５０，１２及び５４について
各々の圧接パターン５８，５９，６４及び７０を
示す説明図であり、FPC５０のベースフイルム
表裏のパターン５８ａ〜５８ｇ及び５９ａ〜５９
ｇが「千鳥状」に、しかもそれぞれの表裏で重な
りがないように形成されたものである。FPC１
２の圧接部は図示の如く、圧接パターン６４ａ〜
６４ｇは斜線で示され、カバーフイルム８７で覆
われている配線パターンの延長上の露出した配線
パターンで構成されている。以下同様にして
FPC５０の表裏両面及びFPC５４の裏面につい
ても７本づつの圧接パターン５８ａ〜５８ｇ、５
９ａ〜５９ｇ及び７０ａ〜７０ｇの露出した部分
以外はカバーフイルム８１，８３，８５にて覆わ
れている。この３枚のFPC５０，１２及び５４
をビス８２により第６図に示したように締付、加
圧すると、圧接パターン５９と６４及び圧接パタ
ーン５８と７０が接触、導通する。 FIG. 5 is an explanatory diagram showing pressure contact patterns 58, 59, 64, and 70 for FPCs 50, 12, and 54, and patterns 58a to 58g and 59a to 59 on the front and back sides of the base film of FPC 50.
g is formed in a ``staggered'' pattern, with no overlap between the front and back sides. FPC1
As shown in the figure, the pressure contact portion 2 has pressure contact patterns 64a to 64a.
64g is indicated by diagonal lines and is composed of an exposed wiring pattern that is an extension of the wiring pattern covered with the cover film 87. Do the same below
For both the front and back sides of the FPC 50 and the back side of the FPC 54, there are 7 press patterns 58a to 58g, 5
The parts other than the exposed portions 9a to 59g and 70a to 70g are covered with cover films 81, 83, and 85. These three FPCs 50, 12 and 54
When the screws 82 are tightened and pressurized as shown in FIG. 6, the pressure contact patterns 59 and 64 and the pressure contact patterns 58 and 70 are brought into contact and electrically connected.
しかしながら、このような構成においてゴム８
６にてFPC５０，１２及び５４の圧接を行なう
と、FPC５０裏面での例えばパターン５９ａ，
６４ａ及び５９ｂ，６４ｂ等の圧接部の間に
FPC５０表面でのパターン５８ｂ，７０ｂ等の
圧接部が完全に入いつてしまう形となる。この場
合には、圧接パターン自体は変形していないので
面接触を保てるものの、FPC５０のベースフイ
ルムを角部５０ａで極端に曲げる力が作用するの
で、この部分でベースフイルムが裂けてしまうこ
とがある。さりとて、加圧力を小さくすると、接
触圧が不足して導体パターン同士が接触不良とな
る。 However, in such a configuration, the rubber 8
When the FPCs 50, 12 and 54 are pressed together in step 6, patterns 59a, 54, etc. are formed on the back side of the FPC 50.
Between pressure contact parts such as 64a and 59b, 64b
The pressure contact portions of the patterns 58b, 70b, etc. on the surface of the FPC 50 are completely inserted. In this case, the pressure welding pattern itself is not deformed and surface contact can be maintained, but the base film of the FPC 50 is subjected to an extreme bending force at the corner 50a, so the base film may tear at this part. . However, if the pressing force is reduced, the contact pressure will be insufficient, resulting in poor contact between the conductor patterns.
また、圧接パターン部分の厚さt3とビスどめ部
分の厚さt4との差は、FPCが３枚とされているた
めに上記従来例（第１図〜第３図）よりも、接着
剤１０２，１０４，１０６及び１０８の厚みのば
らつきの危険性がそれだけ大きくなる。その結
果、第６図から明らかなように、前記カバーフイ
ルム８１，８３，８５及び８７は各々接着剤１０
２，１０４，１０６及び１０８によつてベースフ
イルムに接着されており、圧接パターン（圧接部
分）近辺の厚さt3よりも、ビスどめ部分（締付部
分）の厚さt4の方がはるかに厚くなつている。そ
して、圧接パターン同士の接触が不良になること
が考えられる。 Furthermore, the difference between the thickness t 3 of the pressure welding pattern part and the thickness t 4 of the screw fastening part is smaller than that of the above conventional example (Figs. 1 to 3) because there are three FPCs. The risk of variations in the thickness of adhesives 102, 104, 106 and 108 is increased accordingly. As a result, as is clear from FIG. 6, each of the cover films 81, 83, 85 and 87 is
2, 104, 106 and 108, and the thickness t 4 of the screwed part (tightening part) is greater than the thickness t 3 of the vicinity of the pressure welding pattern (pressure welding part). It's much thicker. Then, it is conceivable that the contact between the press-contact patterns becomes poor.
但し、このような配線構造によれば、FPC５
０の両面にパターン５８，５９を設けたのでただ
１個所での圧接接続が可能となるので、実装スペ
ースが少なくて済み、加圧のための金属板７２，
８６、ゴム８４を圧接個所毎に用意する必要がな
くなつて、部品コストを下げるばかりでなく、基
板類を重ねておいてビス８２でねじ止めする工程
が減少して、工数削減にも役立つ利点はある。 However, according to this wiring structure, FPC5
Since the patterns 58 and 59 are provided on both sides of the 0, it is possible to make a pressure connection at only one place, which requires less mounting space.
86. It is no longer necessary to prepare rubber 84 for each pressure welding point, which not only reduces component costs, but also reduces the process of stacking boards and screwing them together with screws 82, which is an advantage that helps reduce man-hours. There is.
本考案は、上述した事情を背景にして、従来技
術における欠点を解消すること、即ち、所定の圧
接パターンが形成されたフレキシブルプリント基
板同士をねじ部材等で締付、圧接するにあたり、
基板が無理な力が加わつて裂けることも、また締
付力が不足して接触不良となることもない信頼性
の高い接続構造を提供することを目的としてなさ
れたものである。 The present invention is based on the above-mentioned circumstances, and aims to solve the drawbacks of the conventional technology, that is, in tightening and press-welding flexible printed circuit boards on which a predetermined pressure-welding pattern is formed using screw members, etc.
The purpose of this invention is to provide a highly reliable connection structure that will neither tear the board due to excessive force nor cause poor contact due to insufficient tightening force.
上記目的を達成するために、本考案において
は、絶縁性のベースフイルムと、該ベースフイル
ム上に形成された配線パターンと、該配線パター
ンを一部被覆する絶縁性カバーフイルムとから成
るフレキシブルプリント基板と；前記配線パター
ンのうち露出した圧接パターン同士が重なり合う
ように前記フレキシブルプリント基板同士を挟持
し、該圧接パターン同士の重なり合う圧接部分上
に位置する圧接用板部と、該圧接用板部から両側
に延在する締付用板部とから成る一対の締付板材
と；前記締付板材の締付用板部において前記一対
の締付板材を締め付ける締付手段と；を備え、前
記フレキシブルプリント基板同士を電気的に接続
するフレキシブルプリント基板の接続構造におい
て、前記圧接部分と対向するように前記圧接部分
と略同一の寸法の補強パターンが、前記フレキシ
ブルプリント基板同士の少なくとも一方の前記圧
接パターンの形成された前記ベースフイルムの面
の裏面側に、前記導体パターンと同材料で形成さ
れ、それによつて前記フレキシブルプリント基板
同士が挟持された時のフレキシブルプリント基板
同士の総厚さに関して、前記締付板材の圧接用板
部における前記圧接パターン同士が重なり合う部
分の総厚さよりも、前記締付板材の締付用板部に
おける前記圧接パターンの存在しない部分の総厚
さのほうが薄くなるようにしたのである。 In order to achieve the above object, the present invention provides a flexible printed circuit board comprising an insulating base film, a wiring pattern formed on the base film, and an insulating cover film partially covering the wiring pattern. and; sandwiching the flexible printed circuit boards so that the exposed pressure contact patterns of the wiring patterns overlap each other, and a pressure contact plate portion located on the pressure contact portion where the pressure contact patterns overlap, and a pressure contact plate portion located on both sides from the pressure contact plate portion. a pair of clamping plates comprising a clamping plate extending from the clamping plate; and clamping means for tightening the pair of clamping plates at the clamping plate of the clamping plate; In the connection structure of flexible printed circuit boards for electrically connecting the flexible printed circuit boards, a reinforcing pattern having substantially the same dimensions as the pressure contact part and facing the pressure contact part forms the pressure contact pattern of at least one of the flexible printed circuit boards. The clamping plate material is formed of the same material as the conductive pattern on the back side of the base film, and is made of the same material as the conductor pattern, so that the clamping plate material is formed with respect to the total thickness of the flexible printed circuit boards when they are held together The total thickness of the portion of the clamping plate portion of the clamping plate where the pressure welding pattern does not exist is thinner than the total thickness of the portion of the pressure welding plate portion where the pressure welding patterns overlap. .
以下、本考案の実施例を示す図面をもとにして
詳述する。 DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
第７図は第１実施例を示し、前述した第１図〜
第３図に示した従来例の欠点を解消し得るもので
ある。第７図は圧接部での断面図を示す。なお、
第１図〜第３図で使用した部品番号と同様な部品
については説明を省略する。第７図において第３
図と同様に、FPC１２のベースフイルム表面の
圧接パターン２８ａ〜２８ｇと対向する如く
FPC１０のベースフイルム表面の圧接パターン
２２ａ〜２２ｇが重ね合わせられている。ここ
で、第１図〜第３図に示された従来例との違いは
FPC１２の圧接パターン２８ａ〜２８ｇに対応
するベースフイルム裏面に銅箔（補強パターン）
１００が形成されていることである。 FIG. 7 shows the first embodiment, and the above-mentioned FIGS.
This can eliminate the drawbacks of the conventional example shown in FIG. FIG. 7 shows a cross-sectional view of the pressure welding part. In addition,
Descriptions of parts similar to the part numbers used in FIGS. 1 to 3 will be omitted. In Figure 7, the third
As shown in the figure, facing the pressure contact patterns 28a to 28g on the surface of the base film of the FPC 12.
The pressure contact patterns 22a to 22g on the surface of the base film of the FPC 10 are overlapped. Here, the difference from the conventional example shown in Figures 1 to 3 is
Copper foil (reinforcement pattern) on the back side of the base film corresponding to pressure contact patterns 28a to 28g of FPC12
100 is formed.
この銅箔１００は、例えばFPC１２のベース
フイルム裏面が不図示の所に電気回路を備えてい
るいわゆる両面FPCであるとすれば、FPC１２
のベースフイルム裏面の電気回路を形成するため
のエツチング処理をするときに圧接パターン２８
ａ〜２８ｇに対応するベースフイルム裏面に銅箔
１００を残すようエツチング処理することで簡単
に形成できる。ただし、この銅箔１００はFPC
１２のどの電気回路とも電気的接続はないもので
も良いが、電気回路中の接地ラインと接続すれば
ノイズ防止にも役立つ。そして、銅箔１００の大
きさはFPC１２の表面に露出した圧接パターン
２８ａ〜２８ｇが形成されている範囲とほぼ等し
くなつている。この実施例において電子回路基板
（FPC）とはベースフイルム、カバーフイルム、
接着剤、圧接パターン（配線パターン）とで構成
され、また締付部材は金属板ゴム板、ビスとで構
成されている。 For example, if the FPC 12 is a so-called double-sided FPC in which the back side of the base film is provided with an electric circuit (not shown), the copper foil 100 is
The pressure contact pattern 28 is used when etching is performed to form an electric circuit on the back side of the base film.
It can be easily formed by etching so as to leave the copper foil 100 on the back side of the base film corresponding to a to 28g. However, this copper foil 100 is FPC
It may not be electrically connected to any of the 12 electrical circuits, but if it is connected to the ground line in the electrical circuit, it will help prevent noise. The size of the copper foil 100 is approximately equal to the range in which the pressure contact patterns 28a to 28g exposed on the surface of the FPC 12 are formed. In this example, the electronic circuit board (FPC) includes a base film, a cover film,
It is composed of an adhesive and a pressure contact pattern (wiring pattern), and the tightening member is composed of a metal plate, a rubber plate, and a screw.
FPC１２とFPC１０との圧接パターンどうし
を重ね合せ、FPC１０上にゴム板３８を設け、
それらを金属板３６，４２とで挾み込み、ビス４
０によつて締付けてFPC１０とFPC１２との電
気的接続を図つている。そのとき、FPCの圧接
パターン２２ａ〜２２ｇと２８ａ〜２８ｇとが重
なり合つている圧接部分の厚さをt5とし、またビ
ス４０によつて締付けられている締付部分の厚さ
をt6とする。すると、第７図から解るように圧接
部分の厚さt5はFPC１０のベースフイルム、圧接
パターン２２ａ〜２２ｇとFPC１２のベースフ
イルム、圧接パターン２８ａ〜２８ｇ、銅箔１０
０との厚さの合計であり、一方締付部分の厚さt6
はFPC１０のベースフイルム、接着剤４９、カ
バーフイルム４５とFPC１２のベースフイルム、
接着剤５１、カバーフイルム４７との厚さの合計
である。そして圧接部分の厚さt5は締付部分の厚
さt6よりも厚くなつている。 The pressure contact patterns of FPC12 and FPC10 are overlapped, and a rubber plate 38 is provided on FPC10,
Insert them between metal plates 36 and 42, and screw 4
0 to establish an electrical connection between the FPC 10 and the FPC 12. At that time, the thickness of the pressure welding part where the pressure welding patterns 22a to 22g and 28a to 28g of the FPC overlap is t5 , and the thickness of the tightening part tightened by the screw 40 is t6 . do. Then, as can be seen from FIG. 7, the thickness t 5 of the pressure welding portion is the base film of the FPC 10, the pressure bonding patterns 22a to 22g, the base film of the FPC 12, the pressure bonding patterns 28a to 28g, and the copper foil 10.
0 and the thickness of the tightening part t 6
are base film of FPC10, adhesive 49, cover film 45 and base film of FPC12,
This is the total thickness of the adhesive 51 and the cover film 47. The thickness t 5 of the pressure welding portion is thicker than the thickness t 6 of the tightening portion.
したがつて、FPC１２のベースフイルム裏面
に不図示の電気回路を形成するのと同時に銅箔１
００を形成したことにより、従来のように接着剤
４９，５１の厚さにバラツキがあつたとしても、
圧接パターン２２ａ〜２２ｇと２８ａ〜２８ｇと
の電気的接続は、第７図からも解るように厚さt5
が厚さt6より厚いので、金属板３６とFPC１０の
ベースフイルムとの間に位置するゴム板３８が締
付部分より圧接部分に大きな圧接力を与えること
になり、FPC１０とFPC１２との電気的接続を
確実にする。 Therefore, at the same time as forming an electric circuit (not shown) on the back side of the base film of FPC 12, copper foil 1
By forming 00, even if there is variation in the thickness of the adhesives 49 and 51 as in the past,
The electrical connection between the pressure contact patterns 22a to 22g and 28a to 28g has a thickness of t 5 as can be seen from FIG.
is thicker than the thickness t 6 , the rubber plate 38 located between the metal plate 36 and the base film of the FPC 10 applies a larger pressure contact force to the pressure contact part than the tightening part, and the electrical connection between the FPC 10 and the FPC 12 is reduced. Ensure the connection.
尚、FPC１２のベースフイルム裏面に電気回
路を有しない場合には、銅箔１００を電気回路と
同時に形成できないので、銅箔１００の代りをす
る硬質部材を圧接パターン２８ａ〜２８ｇに対応
するベースフイルム裏面に張り付けることも可能
である。また、第７図において、銅箔１００を被
うようにカバーフイルムが設けられていても、圧
接部分及び締付部分では全体的に厚みが増すの
で、圧接パターン２２ａ〜２２ｇ、２８ａ〜２８
ｇの電気的接続に何ら悪影響を与えることはな
い。 In addition, if the back side of the base film of the FPC 12 does not have an electric circuit, the copper foil 100 cannot be formed at the same time as the electric circuit, so a hard member to replace the copper foil 100 is attached to the back side of the base film corresponding to the pressure-welding patterns 28a to 28g. It is also possible to attach it to In addition, in FIG. 7, even if a cover film is provided to cover the copper foil 100, the overall thickness increases at the pressure welding portions and the tightening portions, so the pressure welding patterns 22a to 22g, 28a to 28
There is no adverse effect on the electrical connection of g.
なお、上述したのはあくまで本考案の一実施例
にすぎず、本考案はこれに限定して解釈されるべ
きでないことは言うまでもない。例えば、圧接パ
ターンの個数、間隔等は任意に変更であるし、ま
た電子回路基板はカメラ以外にも種々の電子機器
に応用可能である。 It should be noted that what has been described above is merely one embodiment of the present invention, and it goes without saying that the present invention should not be interpreted as being limited thereto. For example, the number and spacing of the press-contact patterns can be changed as desired, and the electronic circuit board can be applied to various electronic devices other than cameras.
以上のように本考案によれば、圧接パターン同
士の重なり合う圧接部分に対向するように圧接部
分と略同一寸法の補強パターンを、圧接パターン
の形成されたベースフイルムの裏側に、導体パタ
ーンと同材料で形成したので、この補強パターン
がフレキシブルプリント基板の作成の際に導体パ
ターンの形成と同一工程にて形成でき、更にベー
スフイルム上に形成されるために別個の部品とし
て設けたものに比べると組み立て作業等が簡略化
でき、更に補強パターンが硬い材料であるのでゴ
ム材等の弾性材料に比べて締付部材による締付力
の向上に寄与し、このように、簡単にしかも効果
的に締付部材の締付力を向上でき、電気的導通を
確実にすることができる。 As described above, according to the present invention, a reinforcing pattern of approximately the same size as the pressure welding part is placed on the back side of the base film on which the pressure welding pattern is formed, so as to face the pressure welding part where the pressure welding patterns overlap, and is made of the same material as the conductor pattern. Since the reinforcing pattern is formed on the base film, it can be formed in the same process as the conductor pattern when creating the flexible printed circuit board, and since it is formed on the base film, it is easier to assemble than when it is formed as a separate component. The work can be simplified, and since the reinforcing pattern is made of a hard material, it contributes to an improvement in the tightening force of the tightening member compared to elastic materials such as rubber, making it possible to tighten easily and effectively. The tightening force of the members can be improved and electrical continuity can be ensured.
第１図〜第３図は第１従来例を示し、第１図は
カメラボデイに搭載された電子回路基板の斜視
図、第２図は第１図の電子回路基板の分解斜視
図、第３図ａは圧接部の電気回路基板の拡大図、
第３図ｂは圧接部のＹ−Ｙ矢視断面図である。第
４図〜第６図は第２従来例を示し、第４図は第２
図の２つの圧接部を１つにまとめた際の電子回路
基板の分解斜視図、第５図は第４図の圧接部の電
気回路基板の拡大図、第６図は第４図の圧接部の
Ｚ−Ｚ矢視断面図である。第７図は第１従来例に
対応する第１実施例を示し、圧接部の断面であ
る。
主要部分の符号の説明、１０，１２……フレキ
シブルプリント基板（電子回路基板）、２２ａ〜
２２ｇ，２８ａ〜２８ｇ……圧接パターン、｛４
０……ビス、３６，４２……金属板、３８……ゴ
ム板｝締付部材、１００……銅箔（補強パター
ン）。
1 to 3 show a first conventional example, in which FIG. 1 is a perspective view of an electronic circuit board mounted on a camera body, FIG. 2 is an exploded perspective view of the electronic circuit board in FIG. Figure a is an enlarged view of the electric circuit board of the pressure welding part.
FIG. 3b is a sectional view taken along the Y-Y arrow of the press-contact portion. Figures 4 to 6 show the second conventional example, and Figure 4 shows the second conventional example.
An exploded perspective view of the electronic circuit board when the two pressure contact parts shown in the figure are combined into one, Figure 5 is an enlarged view of the electric circuit board of the pressure contact part of Figure 4, and Figure 6 is the pressure contact part of Figure 4. It is a ZZ arrow sectional view of. FIG. 7 shows a first embodiment corresponding to the first conventional example, and is a cross section of a pressure welding part. Explanation of symbols of main parts, 10, 12...Flexible printed circuit board (electronic circuit board), 22a~
22g, 28a to 28g...pressure pattern, {4
0... Screw, 36, 42... Metal plate, 38... Rubber plate} tightening member, 100... Copper foil (reinforcement pattern).
Claims (1)
上に形成された配線パターンと、該配線パターン
を一部被覆する絶縁性カバーフイルムとから成る
フレキシブルプリント基板と、 前記配線パターンのうち露出した圧接パターン
同士が重なり合うように前記フレキシブルプリン
ト基板同士を挟持し、該圧接パターン同士の重な
り合う圧接部分上に位置する圧接用板部と、該圧
接用板部から両側に延在する締付用板部とから成
る一対の締付板材と、 前記締付板材の締付用板部において前記一対の
締付板材を締め付ける締付手段とを備え、 前記フレキシブルプリント基板同士を電気的に
接続するフレキシブルプリント基板の接続構造に
おいて、 前記フレキブルプリント基板同士が挟持された
時の前記フレキシブルプリント基板同士の総厚さ
に関して、前記締付板材の圧接用板部における前
記圧接パターン同士が重なり合う部分の総厚さよ
りも、前記締付板材の締付用板部における前記圧
接パターンの存在しない部分の総厚さのほうが薄
くなるように、前記圧接部分と対向するように前
記圧接部分と略同一の寸法の補強パターンが、前
記フレキシブルプリント基板同士の少なくとも一
方の前記圧接パターンの形成された前記ベースフ
イルムの面の裏面側に、前記導体パターンと同材
料で形成されたことを特徴とするフレキシブルプ
リント基板の接続構造。[Claims for Utility Model Registration] A flexible printed circuit board comprising an insulating base film, a wiring pattern formed on the base film, and an insulating cover film partially covering the wiring pattern, and the wiring pattern. The flexible printed circuit boards are sandwiched between each other so that the exposed pressure-welding patterns overlap each other, and a pressure-welding plate portion is positioned on the pressure-welding portion where the pressure-welding patterns overlap, and a clamping plate portion extends from the pressure-welding plate portion to both sides. and a tightening means for tightening the pair of clamping plates at the clamping plate part of the clamping plate, and electrically connecting the flexible printed circuit boards to each other. In the flexible printed circuit board connection structure, with respect to the total thickness of the flexible printed circuit boards when they are sandwiched, the portion where the pressure contact patterns overlap with each other in the pressure contact plate portion of the clamping plate material is The dimensions are substantially the same as the press-contact portion so as to face the press-contact portion so that the total thickness of the portion of the tightening plate portion of the tightening plate material where the press-contact pattern does not exist is thinner than the total thickness. A reinforcing pattern is formed of the same material as the conductor pattern on the back side of the surface of the base film on which the pressure contact pattern of at least one of the flexible printed circuit boards is formed. Connection structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8512983U JPS59191753U (en) | 1983-06-06 | 1983-06-06 | Connection structure of flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8512983U JPS59191753U (en) | 1983-06-06 | 1983-06-06 | Connection structure of flexible printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59191753U JPS59191753U (en) | 1984-12-19 |
| JPH0119413Y2 true JPH0119413Y2 (en) | 1989-06-05 |
Family
ID=30215094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8512983U Granted JPS59191753U (en) | 1983-06-06 | 1983-06-06 | Connection structure of flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59191753U (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62141524A (en) * | 1985-12-14 | 1987-06-25 | Canon Inc | Package structure of flexible printed board on camera |
| JPH051094Y2 (en) * | 1987-04-28 | 1993-01-12 | ||
| JP4584006B2 (en) * | 2005-04-12 | 2010-11-17 | 日本メクトロン株式会社 | Flexible circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5212951U (en) * | 1975-07-16 | 1977-01-29 | ||
| JPS5342366A (en) * | 1976-09-29 | 1978-04-17 | Tokyo Shibaura Electric Co | Connector |
| JPS552024B2 (en) * | 1975-02-17 | 1980-01-18 | ||
| JPS5829884B2 (en) * | 1978-01-19 | 1983-06-25 | 株式会社村田製作所 | filter |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS552024U (en) * | 1978-06-20 | 1980-01-08 | ||
| JPS5829884U (en) * | 1981-08-20 | 1983-02-26 | 松下電器産業株式会社 | Wiring board lead wire fixing device |
-
1983
- 1983-06-06 JP JP8512983U patent/JPS59191753U/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS552024B2 (en) * | 1975-02-17 | 1980-01-18 | ||
| JPS5212951U (en) * | 1975-07-16 | 1977-01-29 | ||
| JPS5342366A (en) * | 1976-09-29 | 1978-04-17 | Tokyo Shibaura Electric Co | Connector |
| JPS5829884B2 (en) * | 1978-01-19 | 1983-06-25 | 株式会社村田製作所 | filter |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59191753U (en) | 1984-12-19 |
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