JP2637370B2 - Electronic component taping method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for taping electronic components in which electronic components are arranged on a tape in order to supply electronic components such as a resistor network and a semiconductor device to an automatic mounting apparatus.

[0002]

2. Description of the Related Art At present, means for supplying electronic components to an automatic mounting device that automatically mounts electronic components on a substrate includes:
A flexible tape in which electronic components are arranged at an upper edge is employed. Conventionally, a method of arranging electronic components on tape, that is, a method of taping electronic components,
This will be described below with reference to FIG.

[0003] Fig. 4 shows a lead 13 which is integrally connected to the tie bar 12 at its binding portions 13a, ..., 13a at the upper edge of the tie bar 12 made of a metal plate. ,..., 13 are plan views showing a state in which electronic components 14,. .., 13a
Are cut along a cutting line aa indicated by a broken line in FIG. 4, and the electronic components 14,. The separated electronic components 14,..., 14 are supported by sandwiching the lead cutting portions 13b,..., 13b between two paper tapes (not shown) to be bonded. Are arranged at predetermined intervals on a tape composed of

[0004] Electronic component 1 taped by this method
,..., 14 are separated from the tape by cutting the leads 13,.

[0005]

In the above-mentioned conventional taping method for electronic components, the lead cutting portions 13b,..., 13b of the electronic components 14 are sandwiched and supported between paper tapes. The leads 13 arranged in a row,
……, 13 must be extra long beforehand,
There was a problem that the material cost of the lead frame was increased.

The leads 13,..., 1 of the electronic component 14
3 is longer, the electronic components 1 arranged on the tape
The gap (pitch) between 4,..., 14 is deviated, and there is a problem that the mounting failure of the electronic component 14 on the substrate occurs in the automatic mounting apparatus. In addition, lead frames used for taping have longer leads than normal lead frames and must be manufactured separately.In the manufacturing process of providing electronic components on lead frames, equipment separate from the equipment for ordinary lead frames is also required. In addition, there is an inconvenience that equipment for a lead frame for taping is required.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned inconveniences, and reduces the material cost of the lead frame, eliminates the pitch shift of the electronic component, and makes it possible to process the electronic component with equipment for ordinary lead frames. It aims to provide a taping method.

[0008]

SUMMARY OF THE INVENTION In order to solve the above-mentioned disadvantages, a method of taping an electronic component according to the present invention provides an electronic component having three or more leads. A predetermined portion is removed from each tie bar so that tie bar pieces that do not come into contact with each other are left at the respective lead connection portions, and each electronic device is separated from each other at intervals larger than one pitch of small holes formed in the tie bar. The electronic parts are arranged on the tape by sandwiching and supporting the tie pieces of all leads of the component and a part of one side of each lead on the tape.

[0009]

In the method of taping an electronic component according to the present invention, the tie piece is left at the base end of the lead of the electronic component and is supported by a tape. It can be as short as the frame. Further, since each tie piece is not in contact with another tie piece, it is possible to perform a function test of the electronic component while being provided on the tape.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method for taping an electronic component according to the present invention will be described based on embodiments. 1 to 3 show examples in which the present invention is applied to taping of a resistor network.
Is a resistor network (electronic component) on tie bar 2, 4, ...
FIG. 4 is a plan view showing a state where... The leads 3,..., 3 are bound to the upper edge of the tie bar 2 made of a thin metal plate by binding portions 3a,. A circuit element (not shown) provided with a resistor is attached to the tip of each of the leads 3,..., 3; this circuit element and the tips of the leads 3,. 4,..., 4 are provided. Note that the small holes 2b,...
Are for positioning the tie bar 2 and are formed at an equal pitch.

Next, as shown in FIG. 3, the tie bar 2 has removal parts 2c,..., 2c arranged in rows so as to remove the center between the lead bases 3a,. You. A part of the tie bar 2 remaining between the removed portions 2c,..., 2c is a tie bar piece 2a,.
Is provided with one tie bar piece 2a. In this embodiment, the removing portions 2c,..., 2c are provided so as to pass up and down the small holes 2b,..., 2b of the tie bar 2, and the width thereof is also larger than the diameter of the small holes 2b,. Although it is small, it is not limited to this, and the design can be changed as appropriate.

Next, the resistance networks 4,..., 4 divided by the tie bar 2 are connected to the tie bar pieces 2a,. One part of the small hole 2b of the tie bar 2 is provided on the upper edge of the tape 5 composed of the paper tapes 6a and 6b by sandwiching and supporting a part of the paper tapes 6a and 6b with each other with an adhesive. They are arranged in rows with an interval P larger than the pitch (see FIG. 1). The small holes 5a,..., 5a formed in the tape 5 are for engagement with sprocket claws or the like for tape feeding or positioning in the automatic mounting device.

The resistance networks 4,.
Are arranged on the tape 5 at an interval P larger than one pitch of the small holes 2b, so that the resistance networks 4,..., 4 do not come into contact with each other. There is no restriction on the size of the main unit. That is, taping is possible even for a large-sized electronic component having the same number of leads. Further, tapes 6a, 6a,
6b are firmly fixed to each other, and the holding power of the resistance network 4 is further improved. Moreover, when the taped resistance networks 4,..., 4 are accommodated in a box or the like, for example, a portion where the tapes 6a and 6b are fixed to each other (interval P
), And the handling of the tapered resistance network 4 is further facilitated.

Each of the resistor networks 4,..., 4 arranged in a row on the tape 5 can be inspected as before by bringing a probe or the like into contact with the leads 3,. . Resistance network 4, ……, 4
Are those leads 3,..., 3 in the automatic mounting device.
Is cut off along the dashed line BB in FIG. 1, for example, to be separated from the tape 5 and mounted on the substrate.

Although the above embodiment shows an example in which the present invention is applied to taping of a resistance network, the present invention can be widely applied to electronic components such as semiconductor elements.

[0016]

The taping method for electronic parts according to the present invention is as follows.
As described above, the tie bars in which the electronic components having three or more leads are bonded to each other and the electronic components are arranged in a row, and the tie pieces that do not contact each other are left at the respective lead bonding portions. The tie bar pieces of all the leads of each electronic component and a part of one side of the tie bar of each lead are taped at intervals larger than one pitch of the small holes formed in the tie bar. Since electronic components are arranged in a row on the tape by sandwiching and supporting them, it is not necessary to make the leads longer than usual, reducing the material cost of the lead frame and using it as a lead frame for taping for normal products. Can be used as it is, and there is an advantage that manufacturing equipment can be shared.

In addition, since the leads can be shortened, errors in the intervals (pitch) between the electronic components arranged on the tape are reduced, and defective mounting of the electronic components on the substrate in the automatic mounting device is effectively prevented. Has advantages. Moreover, by arranging the electronic components on the tape at intervals larger than one pitch of the small holes of the tie bar, there is an advantage that the electronic components do not come into contact with each other and the size of the electronic component (substrate) main body is not restricted. . Further, there is an advantage that the tapes are firmly adhered to each other at a portion between the electronic components, and the holding force of the electronic components is further improved. In addition, when the taped electronic components are stored in a box or the like, the taped electronic components can be bent, for example, at a portion where the tapes are fixed (a portion between the electronic components), and the handling of the taped electronic components is further improved. It has the advantage of being easier.

In addition to these, the tie bar pieces of all the leads of each electronic component and a part of the tie bar on one side of each lead are sandwiched and supported by the tape, so that the leads and the tie bar pieces are firmly held integrally. This has the advantage that the fixing force is improved and the bending of the lead can be prevented.

[Brief description of the drawings]

FIG. 1 is a plan view showing a state in which electronic components are arranged on a tape in one embodiment.

FIG. 2 is a plan view showing a state in which electronic components are arranged on a tie bar in the embodiment.

FIG. 3 is a plan view showing a state where a predetermined portion of a tie bar is removed in the embodiment.

FIG. 4 is a plan view showing a state in which electronic components are arranged on a tie bar in a conventional taping method.

[Explanation of symbols]

 2 Tiba 2a Tiba piece 3 Lead 4 Resistance network (Electronic component) 5 Tape P Spacing between electronic components

Claims (1)

(57) [Claims] 1. An electronic component having three or more leads, wherein the tie bars on which the electronic components are arranged in a row by binding the leads leave tie bar pieces that do not contact each other at the respective lead connection portions. A predetermined portion is removed so that the tie bar pieces of all the leads of each electronic component and a part of the tie bar on one side of each lead are taped at intervals larger than one pitch of the small holes formed in the tie bar. A method of taping an electronic component, comprising arranging electronic components on a tape by sandwiching and supporting them.