JPS6250080B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electric circuit wiring body that does not use a printed circuit board and a method for manufacturing the same.

There are two types of electrical circuit wiring for high frequency tuners and the like: a printed wiring technique that uses a printed circuit board, and an aerial wiring technique that connects lead wires of electronic components by soldering in the air. The former printed wiring technique has the advantage that it is easy to integrate circuit components onto the printed circuit board and automate the batch soldering process, but the printed circuit board is expensive, and in high-frequency circuits, the high-frequency characteristics of the printed circuit board material may be affected. There are disadvantages such as deterioration of characteristics due to influence and restrictions on mounting density of circuit components on printed circuit boards. On the other hand, the latter aerial wiring technique has the advantage of being cheaper in terms of materials because it eliminates the need for a printed circuit board, improving high-frequency characteristics, and allowing more circuit components to be wired densely in a narrow space. However, when wiring a plurality of circuit components using this aerial wiring technique, the following problems have arisen since conventionally, terminals have been used at the connection points of the circuit components.

For example, Figures 1 to 3 show a conventional example of a wiring body in which the fixed side tuner circuit of a VHF tuner is wired in the air using a grommet terminal, as disclosed in the electric circuit wiring body of Japanese Patent Publication No. 59-32919. As shown in 1
2 is a chassis base, and 2 is a first circuit component that penetrates the chassis base 1 and is fixed by soldering, and includes components such as a feed-through capacitor, a ground terminal, and a phono jack terminal. There is. A second circuit component 5 such as a resistor, a capacitor, or a transistor is wired in the air to the tip of each support lead 3 on the back side of the chassis base 1 via a stop terminal 4. This aerial wiring is performed, for example, in the following manner.
That is, the eyelet terminal 4 is held with a jig and the support lead 3 is
Position it using the same pattern. Next, the leads 6 of the second circuit component 5 corresponding to the eyelet terminals 4 are inserted and held. They are inserted all at once into the stop terminal 4, and the lead 6 of the second circuit component 5 and the support lead 3 are joined within the stop terminal 4, as shown in FIG. After that, the lead 6 in the eyelet terminal 4 and the support lead 3 are soldered using the same solder dipping method as the printed wiring method.
For example, the soldering process is performed all at once using a jet-type automatic soldering apparatus. Then, by cutting the lead 6 and the support lead 3 protruding from the eyelet terminal 4, the lead 6 is connected and fixed to the support lead 3 via the eyelet terminal 4 with solder 7, as shown in FIG. 5, and the second circuit is completed. A component 5 is wired in the air on the back side of the chassis base 1.

By the way, the number of leads 3 and 6 inserted into the eyelet terminal 4 is not constant; some have only two leads, while others have as many as three or four. On the other hand, eyelet terminals 4 of the same average size are used regardless of the number of leads inserted. This is because if the size of the eyelet terminals 4 is changed depending on the number of leads inserted, it will take a lot of effort and time to arrange the eyelet terminals 4 in a predetermined pattern on a jig, and the diameter will be larger. This is because if a small-diameter eyelet terminal is placed in the position of the eyelet terminal, lead insertion becomes impossible. However, when all the eyelet terminals 4 are made to have the same dimensions, it is easy to insert only two leads 3 and 6 for soldering, but the lead spacing within the eyelet terminal is When soldering, molten solder gets between the leads and separates due to capillary action, resulting in poor solderability. On the other hand, when many leads 3 and 6 are inserted (3 or 4), the leads 3 and 6 are inserted in close contact with each other, so the molten solder easily creeps up between the leads during the soldering process, resulting in relatively good solderability. However, on the other hand, there was a problem that the lead insertion was difficult to release. In fact, when the leads 3 and 6 are inserted into the stop terminal 4 in the above-mentioned conventional manufacturing method, it is difficult to insert the support lead 3, which is inserted later, and if the lead is inserted forcibly, problems such as bending of the leads may occur.
Furthermore, if all the eyelet terminals 4 and leads 3 and 6 were soldered only once, many defective soldering points would remain, so the soldering process had to be performed two or three times. In addition, it is generally known that lug terminals are used in wiring bodies, such as terminal devices with a large number of lug terminals (Japanese Utility Model Publication No. 43-28743) and flat lug plates (Japanese Utility Model Publication No. 43-28743).
49-101290) are also known, but these terminal devices cannot be used as the eyelet terminals mentioned above.

The present invention has been made in view of and solved the above-mentioned conventional problems, and is a new and improved electric circuit wiring body using metal plate terminals with a large number of through holes for connecting circuit components using aerial wiring techniques. A manufacturing method thereof is provided. That is, a wiring body is disclosed that includes a circuit component with a lead and a metal plate terminal with a through hole, in which the metal plate terminal is soldered to the connection point between the circuit components. In this wiring body, the metal plate terminals are soldered while being located on the same plane, and a holding means is used in the soldering process, but after the soldering process, the holding means is removed and an aerial wiring body is formed. .

Therefore, it is a wiring body suitable for high frequency circuits.

In another aspect of the present invention, a method for manufacturing the above-mentioned aerial wiring body is disclosed in which a thin metal plate terminal is held in a substantially flat state, and predetermined circuit components are mounted thereon and fixed by solder. . Here, metal plate terminals are used as connection points (junctions) between circuit components, and each component lead is inserted into a terminal through hole and soldered.

The metal plate terminal is made of a solderable metal plate, and is coated with solder resist except for predetermined soldering parts. Note that until the soldering process, a holding means such as a jig is used to hold the metal plate terminal together with the circuit components, but after they are soldered together, this holding means is removed to form an aerial wiring body. To summarize, the above wiring body is applied to a first circuit component with a support lead attached to a chassis base, and a second circuit component with a connection lead is connected to a common connection of metal plate terminals. By using points (junctions), leads are inserted into through-holes in a one-to-one manner, resulting in aerial wiring.

The present invention uses metal plate terminals formed by etching or punching from a thin metal plate instead of the eyelet terminals of conventional electric circuit aerial wiring bodies, and the leads of circuit components are drilled at multiple locations on the metal plate terminal. It is inserted into the through hole and soldered in the same way as soldering a printed circuit board. For example, an example in which the fixed-side tuner circuit of the VHF tuner mentioned above is wired in the air according to the present invention is shown in FIGS. 6 to 8, and the structure and manufacturing method of the present invention will be explained below in sequence based on these. do.

In FIGS. 6 to 8, the same reference numerals as in FIGS. 1 to 3 indicate the same contents, and the differences are between the support lead 3 of the first circuit component 2 and the second circuit component. The metal plate terminal 8 is used as the connection point between the lead 6 and the lead 6 of the lead 5. The metal plate terminal 8 is formed of a so-called tin plate made by tin-plating an iron plate. Further, the shape of the metal plate terminal 8 is designed to be an optimal shape depending on the number of leads 3 and 6 to be connected and especially the arrangement pattern of the second circuit component 5. The metal plate terminal 8 has the same number of through holes 9 as the leads 3 and 6 to be connected (see FIG. 9), and each through hole 9 has one lead 3, 6 is inserted and connected to the back side of the metal plate terminal 8 with solder 10 as shown in FIG. In this way, one metal plate terminal 8 has two
Lead insertion and soldering are performed under the same conditions for connecting book leads 3 and 6 and for connecting 3 and 4 leads 3 and 4, allowing for uniform soldering. becomes.

Next, a method of manufacturing the above-mentioned aerial wiring body according to the present invention will be explained. As for this manufacturing method, the first method shown in FIGS. 11 to 17 and the second method shown in FIGS. 18 to 32 are effective for automatic manufacturing. That is,
In the first method, as shown in FIGS. 11 and 18, from one thin metal plate 11, a plurality of metal plate terminals 8 are connected to the metal plate 1 in a predetermined arrangement pattern shown in FIG.
1 is punched out in a half-cut state and temporarily fixed to the metal plate 11 as it is. At this time, through hole 9 is punched out at the same time. Next, Figure 12 and 1
As shown in FIG. 9, a solder resist film 12 is formed on the back surface of the metal plate 11, leaving the soldered portion of the half-opened metal plate terminal 8, preferably around the through hole 9 of the metal plate terminal 8. Here, the entire metal plate terminal 8 can be made into a soldered part like a conventional eyelet terminal. Then, in the same way as automatic insertion of electronic components into a general printed circuit board,
As shown in FIGS. 13 and 20, each lead 6 of the second circuit component 5 is automatically inserted into the through hole 9 of the corresponding metal plate terminal 8 from the front side of the metal plate 11 and held as it is. Next, the second circuit component 5
Hold the sub-assembled body with a jig or the like, and as shown in FIG. Insert into the through hole 9 of the metal plate terminal 8. This insertion is performed easily and reliably after the arrangement patterns of the column leads 3 and the metal plate terminals 8 match, and only the corresponding column leads 3 are inserted into the through holes 9. Next, the metal plate 1 is soldered in the same way as the printed circuit board soldering process.
The soldered portions on the back side of the metal plate terminal 8 are subjected to flux treatment, and solder 10 is applied to the soldered portions using a jet type automatic soldering device. Then, as shown in FIG. 15, the leads 3 and 6 protruding from the through holes 9 of the metal plate terminal 8 are soldered and fixed to the metal plate terminal 8. After that, as shown in FIG. 16, each lead 3 and 6 protrudes from the solder 10.
After cutting and removing unnecessary parts using an automatic lead cutting device and adjusting the shape, the metal plate 11 is attached to each metal plate terminal 8.
When pulled out, only the metal plate terminals 8 remain on each lead 3, 6, as shown in FIG. 17, and the second circuit component 5 is aerially wired to the support lead 3 via the metal plate terminals 8.

Next, a second manufacturing method will be explained. First, as shown in FIGS. 21 and 29, a thin metal plate 14 is pasted on the surface of an adhesive paper tape 13.
This paper tape 13 is non-solderable and can be exposed to high temperatures for at least a short period of time (soldering time is 5 to 50 minutes).
6 seconds) Use a material that can withstand the thickness of the metal plate 14.
A metal foil of about 0.2 mm is sufficient. Next, unnecessary portions of the metal plate 14 are removed using a normal etching method, and metal plate terminals 8 are formed in a predetermined pattern on the surface of the paper tape 13, as shown in FIGS. 22 and 30. The metal plate terminal 8 is adhesively fixed to the paper tape 13. Next, a predetermined location of the metal plate terminal 8 is punched, and a through hole 9 is inserted through the paper tape 13 as shown in FIGS. 23 and 31.
form. Furthermore, the portion to which the soldered portion of the metal plate terminal 8 is adhered is removed from the back side of the paper tape 13. That is, as shown in FIGS. 24 and 32, a window hole 15 is partially formed in the paper tape 13, and the soldered portion on the back surface of the metal plate terminal 8 is exposed through the window hole 15. Note that the window hole 15 of this paper tape 13
may be formed in advance in a predetermined pattern in a step before the step shown in FIG. Next, the paper tape 13 is positioned in the same manner as in the first method, and the corresponding lead 6 of the second circuit component 5 is automatically inserted into the through hole 9 of each metal plate terminal 8 as shown in FIG. Then, as shown in FIG. 26, the support leads 3 of the first circuit component 2 sub-assembled on the chassis base 1 are inserted into the corresponding through holes 9 of the metal plate terminals 8. Then paper tape 1
The soldered parts of the metal plate terminals 8 exposed through the window holes 15 on the back side of the metal plate terminals 3 are flux-treated and then soldered. , 6 solder 1
Connect with 0. At this time, the paper tape 13 functions as a holder for the metal plate terminal 8 and also functions as a solder resist film. When the soldering process is completed in this way, the leads 3 and 6 protruding from the solder 10 are cut and removed (see FIG. 27), and then the paper tape 13 is peeled off from each metal plate terminal 8. Then, as shown in FIG. 28, a desired aerial wiring body is obtained. Note that it is not necessary to remove the last paper tape 13, and it is possible to leave it as long as it is made of paper with excellent insulation properties. Also, the paper tape 13 for temporarily fixing the plurality of metal plate terminals 8 in a predetermined pattern can be replaced with something other than paper, as long as it does not stick to solder and can withstand the high temperatures during the soldering process. good.

It should be noted that the present invention is not limited to the electric circuit wiring body of a VHF tuner, but can be applied to all wiring bodies to which other general electronic components are soldered.

As explained above, according to the present invention, the metal plate terminals of the circuit components to be wired in the air are soldered to each other through the corresponding through holes, so that the solder connection is uniform and reliable, similar to the solder connection of printed circuit boards. Furthermore, since this soldering process only needs to be performed once, assembly work efficiency is improved. Furthermore, since the metal plate terminals are arranged in a predetermined pattern and the circuit components are assembled and soldered, automation is easy and mass production is possible.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of essential parts showing an example of a conventional electric circuit wiring body, Figs. 2 and 3 are front and bottom views of the wiring body of Fig. 1, and Figs. FIG. 6 is a perspective view of a main part showing an embodiment of the electric circuit wiring body according to the present invention, and FIGS. 7 and 8 are an enlarged sectional view of a part of the wiring body shown in FIG. 6 after assembly. 9 is a perspective view showing an example of a metal plate terminal used in the wiring body of FIG. 6, FIG. 10 is a partially enlarged sectional view of the wiring body of FIG. 6, and FIG. 11 Figures 11 to 20 are for explaining the first manufacturing method of the present invention, Figures 11 to 13 are plan views of the metal plate at each step, and Figures 14 to 17 are plane views of the metal plate at each step. 18 to ₂₀ are cross _- sectional views of _the assembly operation in FIG _.
21 to ₃₂ are for explaining the second method of the manufacturing method of the present invention, and FIGS. 21 to 24 show each process. 25 to 28 are cross-sectional views of the assembly operation in each step, and FIGS. 29 to 32 are sectional views of the second
Each T ₄ - _{T 4} line, T ₅ - T ₅ line, T ₆ in Figures 1 to 24
It is a sectional view along the _-T6 line and the T7 _{- T7} line. DESCRIPTION OF SYMBOLS 1... Chassis base, 2... First circuit component, 3... Support lead, 5... Second circuit component,
6... Connection lead, 8... Metal plate terminal, 10...
Solder, 11, 14...metal plate.

Claims (1)

[Claims] 1. A first structure with a strut lead fixed to a chassis base.
circuit components, a plurality of metal plate terminals formed with a large number of through holes, and a plurality of second circuit components each having a connection lead. An electric circuit wiring body, characterized in that a support lead of a circuit component and a lead of a second circuit component are inserted and fixed by soldering. 2. A process of fixing the first circuit component having a support lead to the chassis base, a process of drilling holes in a flat metal plate to form a plurality of metal plate terminals with a large number of through holes, and a process of holding the metal plate terminals. a step of arranging the means on substantially the same plane, a step of inserting the connection leads of the second circuit component into the through holes of the metal plate terminal one-to-one, and a step of inserting the support leads of the first circuit component into the through holes of the second circuit component. a step of inserting connection leads one-on-one into the remaining through holes of the metal plate terminal into which they have been inserted; a step of collectively soldering each lead inserted into the metal plate terminal; and a step of soldering the leads inserted into the metal plate terminal at once;
and a method for manufacturing an electric circuit wiring body, comprising the step of removing the holding means after soldering the second circuit component to the metal plate terminal.