JP3156391B2 - Structure and method for preventing falling off of IC chip - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
The present invention relates to a structure and a method for preventing a chip from falling off.

[0002]

2. Description of the Related Art IC chips, for example, ROMs (mask ROMs, EPROMs) in which programs and data are written, etc.
And a microcomputer serving as a CPU, etc., are often connected to a printed circuit board via an IC socket so that functions can be easily improved or bugs can be easily corrected even after the start of use. That is, the IC chip is mounted on an IC socket soldered to a printed circuit board.

On the other hand, the performance improvement of microcomputers and the reduction in the price of semiconductor elements representing memories have made it possible to make circuits ultra-small and low in power consumption. LCD televisions, small computers, and terminals have become small and lightweight. As described above, even in such a portable device, the IC chip is interchangeably connected via the IC socket, that is, the circuit is connected in a detachable manner.

When an IC socket is used, the IC chip and its lead wires may be damaged when the IC chip is inserted. If the force required at the time of insertion is reduced, the possibility of damage at the time of insertion is reduced. However, in this case, not only the normal electrical contact with the lead wire of the IC chip can not be guaranteed in the inserted state, but also the danger of falling off. Will be higher.

[0005] In addition, portable equipment has many chances to carry due to its nature, and therefore has a high possibility of falling or collision.
In the conventional fixing method in which the IC chip is simply inserted into the IC socket, the IC chip comes off from the IC socket due to a shock of dropping. If the power is turned on while the IC chip is partially detached, or if the IC chip is partially detached while the power is on, there is a high possibility that the circuit will be destroyed.

[0006] In order to solve such a problem, the force with which the electrical contacts of the IC socket grip the lead wire of the IC chip can be changed by lever operation, and when inserting and removing the IC chip, the force is small, for example, almost zero. Can be inserted and withdrawn, but in use, it securely holds the IC chip.
C sockets have been commercialized. For example, the NP63 series manufactured by Yamaichi Electric Co., Ltd.

[0007]

However, such a lever-operated IC socket is not sufficient for a portable device such as a terminal device which is likely to be handled very roughly. For example, it is not effective against a drop from a height of about 1.2 m, and the IC chip comes off the IC socket. Further, the height of the IC socket is higher than that of a normal IC socket by the amount of the lever, which is not suitable for a device having a limited mounting height.

[0008] The present invention provides a method for solving such a problem.
An object of the present invention is to provide a structure and a method for preventing a chip from falling off.

[0009]

According to the present invention, a tape is passed between an IC socket and a circuit board, and the tape is wound around an upper surface of an IC chip inserted into the IC socket, and is fixed at a predetermined position with an adhesive. For example, it is fixed by the upper surface of the IC chip and the tape itself. Instead of using one tape, a similar piece of tape may be fixed to the opposite end of the IC socket.

[0010]

According to the tape, the IC chip inserted into the IC socket is firmly held at the insertion position. Since the tape is used, the mounting height does not increase even by preventing falling off. Further, replacement of the IC chip is also easy.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for fixing an IC chip according to an embodiment of the present invention will be described below with reference to the drawings. In addition, in order to facilitate understanding, in the drawings, the aspect ratio is enlarged or reduced at an appropriate ratio, and the aspect ratio is not accurate.

FIG. 1 is an exploded perspective view for explaining an embodiment of the present invention. Reference numeral 10 denotes an IC chip having a large number of lead wires 12 arranged in a predetermined arrangement, and reference numeral 14 denotes an IC socket corresponding to the arrangement of the lead wires of the IC chip 10. The IC socket 14 has a number of lead wires 1 arranged in the same manner as the IC chip 10.
6 is provided. The IC socket 14 is of a normal type that can insert and remove the IC chip 10 with a predetermined force or more. Reference numeral 18 denotes a printed circuit board, which is an IC
A number of holes 20 corresponding to the leads 16 of the socket 14 are provided.

Reference numeral 22 denotes the IC chip 10
4 is a drop-off prevention tape that prevents the tape from falling off from the IC socket when inserted into the IC socket. This drop prevention tape 22
Consists of a flexible strip of plastic film,
It is better not to have stretchability. Although the details will be described later, the falling-off prevention tape 22 is provided between the IC socket 14 and the printed circuit board 1 before and after soldering the IC socket 14 to the printed circuit board 18.
8 between. If the falling-off prevention tape 22 is appropriately thin, not only the illustrated IC socket 14 but also a normal I
Even after soldering the C socket to the printed circuit board, the IC
Captive tape 2 between socket and printed circuit board 18
2 can be passed.

An adhesive 24 for fixing is attached to one end 22a of the drop-prevention tape 22, and a similar adhesive 26 (see FIG. 2 and subsequent figures) is attached to the other end 22b. As the adhesives 24 and 26, for example, a double-sided adhesive tape is used for work.
It is convenient.

FIGS. 2, 3, 4, 5, and 6 show the steps from fixing the IC socket 14 to the printed circuit board 18, inserting the IC chip into the IC socket 14 and fixing the IC chip 14 with the drop-prevention tape 22. It will be described with reference to FIG. 2 to 6
FIG. 3 is a central cross-sectional view parallel to a direction in which lead wires 16 of an IC socket 14 are arranged.

First, as shown in FIG.
The IC socket 14 is fixed to the printed circuit board 18 by disposing the drop prevention tape 22 between the printed circuit board 4 and the printed circuit board 18. After the IC socket 14 is soldered to the printed circuit board 18, the fall prevention tape 22 may be passed through a gap between the IC socket 14 and the printed circuit board 18. The falling-off prevention tape 22 may be cut in advance to a length necessary for fixing the IC chip 10, or may be a long one, and an unnecessary portion may be cut after fixing the IC chip 10. .

At the stage shown in FIG. 2, the adhesives 24 and 26 are adhered to the falling-off prevention tape 22.
This is for the purpose of making it easy to understand the attachment position of the. The adhesives 24 and 26 may be attached to the falling-off prevention tape 22 at a necessary time.

As described above, after the IC socket 14 is soldered to the printed circuit board 18 with the drop prevention tape 22 interposed therebetween, the IC chip 10 is inserted into the IC socket 14.
FIG. 3 shows a state immediately before the IC chip 10 is inserted into the IC socket 14. FIG. 7 is a sectional view taken along line BB in FIG. FIG. 4 shows that the IC chip 10 is connected to the IC socket 1.
FIG. 4 shows a state where it is completely inserted. At least at the time shown in FIG. 4, the adhesives 24 and 26 need to be attached to predetermined positions of the falling-off prevention tape 22.

After the IC chip 10 is completely inserted into the IC socket 14, as shown in FIG.
Is bent over the IC chip 10 so that the adhesive 2
4 adheres to the surface of the IC chip 10. Next, FIG.
As shown in (2), the other end 22b of the fall-prevention tape 22 is bent on the fall-prevention tape 22 adhered to the IC chip 10, and is adhered to the fall-prevention tape 22 on the IC chip 10 by the adhesive 26. In this manner, the falling-off prevention tape 22 is wound around the IC chip 10 and the IC socket 14 integrally, and is fixed in this wound state by the adhesives 24 and 26. FIG. 8 is a perspective view showing the state in which the falling-off is prevented in this way.

When it is desired to replace the IC chip 10, the falling-off prevention tape 22 is developed in the order of FIGS. 6 to 5 and FIG. 4, then the IC chip 10 is removed from the IC socket 14, and a new IC chip 10 is inserted. What is necessary is just to mount | wear with the procedure demonstrated previously and to prevent falling off. At this time, the adhesives 24, 26
If the adhesive strength is insufficient, replace it. Adhesive 24,2
If a double-sided adhesive tape is used as 6, the replacement is easy.

In the above embodiment, the falling-off prevention tape 22 separate from the IC socket 14 is used. However, an IC socket having the same tape as the falling-off prevention tape 22 may be used. In the above embodiment, the falling-off prevention tape 2
Although 2 overlaps on the IC chip 10, it does not necessarily have to overlap. However, the more the overlap is made, the greater the fall prevention force.

Although an IC chip such as a ROM has been described as an example,
The present invention can be similarly applied to a case where a hybrid IC or other solid state device is connected to a circuit via an insertable / removable socket, and an IC chip and an IC socket are used for such an element and a socket. Should be understood to include.

When the falling-off prevention tape 22 is formed of an electrostatic shielding material, damage to the IC chip due to static electricity can be prevented to a considerable extent.

[0024]

As can be easily understood from the above description, according to the present invention, it is possible to prevent the IC chip from falling off the IC socket with a very simple structure. In addition, since the mounting height does not increase, the present invention can be applied to a case where it is arranged in a narrow place.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of one embodiment of the present invention.

FIG. 2 is a cross-sectional view before the IC socket 14 is mounted on a printed circuit board 18.

FIG. 3 is a sectional view showing a state where the IC socket 14 is mounted on a printed circuit board 18.

FIG. 4 is a sectional view showing a state where the IC chip 10 is inserted into the IC socket 14;

FIG. 5 is a cross-sectional view showing a state where one end 22a of the falling-off prevention film 22 is adhered to the surface of the IC chip 10;

FIG. 6 is a cross-sectional view showing a state in which drop prevention is completed.

FIG. 7 is a sectional view taken along line BB of FIG. 3;

FIG. 8 is a perspective view showing a state in which drop prevention is completed.

[Explanation of symbols]

10: IC chip 12: Lead wire 14: IC socket 16: Lead wire 18: Printed circuit board 20: Hole
22: Captive tape 22a, 22b: Tape end 2
4, 26: adhesive

Claims (5)

(57) [Claims] 1. A drop-off prevention structure for preventing an IC chip inserted into an IC socket from falling off, wherein at least one tape member extending from at least one side of the IC socket is attached to an upper surface of the inserted IC chip. Winding,
A structure for preventing an IC chip from falling off, which is fixed at a predetermined location. 2. The method according to claim 1, wherein the at least one tape member is an IC.
The structure for preventing the IC chip from falling off according to claim 1, wherein the structure is fixed to a socket. 3. The IC chip according to claim 1, wherein the at least one tape member comprises two tape members extending from opposite ends of the IC socket, and the two tape members are connected at a lower surface of the IC socket. Structure to prevent falling off. 4. A falling-off prevention structure for preventing an IC chip inserted into an IC socket from falling off, comprising: a tape member wound around the IC chip and the IC socket; and a fixing member fixing the tape member in a wound state. A structure for preventing falling off of an IC chip. 5. A method for preventing an IC chip inserted in an IC socket from falling off, wherein a tape member is passed between the socket and a circuit board, and both ends of the tape member are bent to the upper surface of the IC chip. Bonding the IC chip at a predetermined location including the upper surface of the IC chip and the tape member.