JPH0246064Y2 - - Google Patents
Info
- Publication number
- JPH0246064Y2 JPH0246064Y2 JP1985076987U JP7698785U JPH0246064Y2 JP H0246064 Y2 JPH0246064 Y2 JP H0246064Y2 JP 1985076987 U JP1985076987 U JP 1985076987U JP 7698785 U JP7698785 U JP 7698785U JP H0246064 Y2 JPH0246064 Y2 JP H0246064Y2
- Authority
- JP
- Japan
- Prior art keywords
- flexible wiring
- wiring board
- conductor
- coating film
- conductor wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 17
- 239000011248 coating agent Substances 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 11
- 238000009413 insulation Methods 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
【考案の詳細な説明】
〈技術分野〉
本考案は、例えば、抵抗、コンデンサなどの部
品端子を有する電子部品を載置する回路基板にフ
レキシブル配線基板を実装するフレキシブル配線
基板の実装装置に関する。[Detailed Description of the Invention] <Technical Field> The present invention relates to a flexible wiring board mounting apparatus for mounting a flexible wiring board on a circuit board on which electronic components having component terminals such as resistors and capacitors are mounted.
〈従来技術〉
第３図に示すように、フレキシブル配線基板の
実装装置は、部品端子３１を有する電子部品３を
載置した回路基板１にフレキシブル配線基板２を
実装する時、フレキシブル配線基板２と部品端子
３１が当接する部分で、部品端子３１により絶縁
被覆フイルムが破損し、導体配線の短絡もしくは
破損を防止するために絶縁スペーサにより絶縁被
覆フイルムの保護と補強を行つていた。しかしな
がら、そのため余分な絶縁スペーサが必要となり
作業工程が増加し、コスト高となる欠点があつ
た。<Prior Art> As shown in FIG. 3, the flexible wiring board mounting apparatus mounts the flexible wiring board 2 on the circuit board 1 on which the electronic component 3 having the component terminal 31 is mounted. The insulating film is damaged by the component terminal 31 at the part where the component terminal 31 comes into contact with it, and the insulating spacer is used to protect and reinforce the insulating film to prevent short-circuiting or damage to the conductor wiring. However, this has the drawback of requiring an extra insulating spacer, increasing the number of work steps, and increasing costs.
〈目的〉
本考案は、上述の従来の欠点を解消するため、
余分なスペーサを使用することなく、絶縁被覆フ
イルムを補強し、電子部品の部品端子によるフレ
キシブル配線基板の導体配線の短絡もしくは破損
を未然に防止できるフレキシブル配線基板の実装
装置を提供することを目的とする。<Purpose> In order to eliminate the above-mentioned conventional drawbacks, the present invention
The purpose of the present invention is to provide a mounting device for a flexible wiring board that can prevent short-circuiting or damage to the conductor wiring of the flexible wiring board due to component terminals of electronic components by reinforcing the insulation coating film without using extra spacers. do.
〈実施例〉
第１図において、部品端子３１を有する電子部
品３を載置した回路基板１の透孔（図示せず）に
フレキシブル配線基板２を実装する。その場合、
第２図に示すように、フレキシブル配線基板２の
絶縁被覆フイルムのみをＡ−A′線で切断し、切
断した一方の絶縁被覆フイルムをＸ方向に少しず
らして導体配線露出部分２２と導体配線を有しな
い絶縁被覆フイルム２３を形成する。そこで、こ
の導体配線露出部分２２をAA′で折曲げ、回路基
板１の透孔に挿入し半田付等で固着する。また、
上記回路基板１よりフレキシブル配線基板２側に
突出する上記部品端子３１に上記絶縁被覆フイル
ム部分２３が当接するように実装し、フレキシブ
ル配線基板の導体配線を保護する。第１図の実施
例においては、フレキシブル配線基板の被覆導体
配線部分２１と絶縁被覆フイルム部分２３をフリ
ーにしているが両面テープ等により接着し一体化
してもよい。上記フレキシブル配線基板の実装装
置は、例えばポケツトコンピユータのプリンター
インターフエイス用基板として用いることができ
る。<Example> In FIG. 1, a flexible wiring board 2 is mounted in a through hole (not shown) of a circuit board 1 on which an electronic component 3 having a component terminal 31 is mounted. In that case,
As shown in FIG. 2, only the insulation coating film of the flexible wiring board 2 is cut along the A-A' line, and one of the cut insulation coating films is slightly shifted in the X direction to separate the conductor wiring exposed portion 22 and the conductor wiring. An insulating coating film 23 is formed. Therefore, this conductor wiring exposed portion 22 is bent at AA', inserted into the through hole of the circuit board 1, and fixed by soldering or the like. Also,
The insulating film portion 23 is mounted so as to come into contact with the component terminal 31 protruding from the circuit board 1 toward the flexible wiring board 2, thereby protecting the conductor wiring of the flexible wiring board. In the embodiment shown in FIG. 1, the covered conductor wiring portion 21 and the insulating coating film portion 23 of the flexible wiring board are made free, but they may be bonded together using double-sided tape or the like. The flexible wiring board mounting apparatus described above can be used, for example, as a printer interface board for a pocket computer.
〈効果〉
以上のように本考案のフレキシブル配線基板の
実装装置によれば、余分な絶縁スペーサを使用す
ることなく、絶縁被覆フイルムを保護し、補強す
ることができるため、作業工程が簡略化し、コス
トダウンが計れるという効果がある。<Effects> As described above, according to the flexible wiring board mounting apparatus of the present invention, the insulating coating film can be protected and reinforced without using extra insulating spacers, so the work process is simplified. This has the effect of reducing costs.
第１図は本考案のフレキシブル配線基板の実装
装置の一実施例を示す要部側面図、第２図は同装
置に使用されるフレキシブル配線基板の要部平面
図、第３図は従来のフレキシブル配線基板の実装
装置の側面図である。
１：回路基板、２：フレキシブル配線基板、
３：電子部品、２１：被覆導体配線部分、２２：
導体配線露出部分、２３：絶縁被覆フイルム部
分、３１：部品端子。
Fig. 1 is a side view of the main parts showing an embodiment of the flexible wiring board mounting device of the present invention, Fig. 2 is a plan view of the main parts of the flexible wiring board used in the device, and Fig. 3 is a conventional flexible wiring board mounting device. FIG. 2 is a side view of a wiring board mounting apparatus. 1: Circuit board, 2: Flexible wiring board,
3: Electronic component, 21: Covered conductor wiring part, 22:
Exposed conductor wiring portion, 23: Insulating coating film portion, 31: Component terminal.
Claims (1)
線基板を実装する装置において、 上記フレキシブル配線基板は、 絶縁被覆フイルムで覆われた導体配線を有する
被覆導体配線部分と、 導体配線が露出する導体配線露出部分と、 導体配線を有しない絶縁被覆フイルム部分とか
ら構成され、 上記フレキシブル配線基板を上記導体配線部分
で上記絶縁被覆フイルム部分と被覆導体配線部分
とが対向するように折曲げて上記導体配線部分を
上記回路基板に固着する手段と、 折曲げられた上記絶縁被覆フイルム部分を上記
回路基板よりフレキシブル配線基板側に突出する
上記電子部品の端子に当接させる手段 とを具備することを特徴とするフレキシブル配線
基板の実装装置。[Scope of Claim for Utility Model Registration] In an apparatus for mounting a flexible wiring board on a circuit board on which electronic components are mounted, the flexible wiring board includes: a covered conductor wiring portion having conductor wiring covered with an insulating coating film; and a conductor. It is composed of an exposed conductor wiring part where the wiring is exposed, and an insulating coating film part having no conductor wiring, and the flexible wiring board is arranged such that the insulating coating film part and the covered conductor wiring part face each other with the conductor wiring part. means for bending and fixing the conductor wiring portion to the circuit board; and means for bringing the bent insulation coating film portion into contact with terminals of the electronic component protruding from the circuit board toward the flexible wiring board. A flexible wiring board mounting device comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985076987U JPH0246064Y2 (en) | 1985-05-22 | 1985-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985076987U JPH0246064Y2 (en) | 1985-05-22 | 1985-05-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61192478U JPS61192478U (en) | 1986-11-29 |
| JPH0246064Y2 true JPH0246064Y2 (en) | 1990-12-05 |
Family
ID=30619634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985076987U Expired JPH0246064Y2 (en) | 1985-05-22 | 1985-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0246064Y2 (en) |
-
1985
- 1985-05-22 JP JP1985076987U patent/JPH0246064Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61192478U (en) | 1986-11-29 |
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