JPS61192478U - - Google Patents
Info
- Publication number
- JPS61192478U JPS61192478U JP1985076987U JP7698785U JPS61192478U JP S61192478 U JPS61192478 U JP S61192478U JP 1985076987 U JP1985076987 U JP 1985076987U JP 7698785 U JP7698785 U JP 7698785U JP S61192478 U JPS61192478 U JP S61192478U
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- wiring
- conductor wiring
- board
- flexible wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
Landscapes
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案のフレキシブル配線基板の実装
装置の一実施例を示す要部側面図、第２図は同装
置に使用されるフレキシブル配線基板の要部平面
図、第３図は従来のフレキシブル配線基板の実装
装置の側面図である。
１：回路基板、２：フレキシブル配線基板、３
：電子部品、２１：被覆導体配線部分、２２：導
体配線露出部分、２３：絶縁被覆フイルム部分、
３１：部品端子。
Fig. 1 is a side view of the main parts of an embodiment of the flexible wiring board mounting device of the present invention, Fig. 2 is a plan view of the main parts of the flexible wiring board used in the device, and Fig. 3 is a conventional flexible wiring board mounting device. FIG. 2 is a side view of a wiring board mounting apparatus. 1: Circuit board, 2: Flexible wiring board, 3
: Electronic component, 21: Covered conductor wiring part, 22: Exposed conductor wiring part, 23: Insulating coating film part,
31: Component terminal.
Claims (1)
線基板を実装する装置において、 上記フレキシブル配線基板は、 絶縁被覆フイルムで覆われた導体配線を有する
被覆導体配線部分と、 導体配線が露出する導体配線露出部分と、 導体配線を有しない絶縁被覆フイルム部分とか
ら構成され、 上記フレキシブル配線基板を上記導体配線部分
で上記絶縁被覆フイルム部分と被覆導体配線部分
とが対向するように折曲げて上記導体配線部分を
上記回路基板に固着する手段と、 折曲げられた上記絶縁被覆フイルム部分を上記
回路基板よりフレキシブル配線基板側に突出する
上記電子部品の端子に当接させる手段 とを具備することを特徴とするフレキシブル配線
基板の実装装置。[Scope of Claim for Utility Model Registration] In an apparatus for mounting a flexible wiring board on a circuit board on which electronic components are mounted, the flexible wiring board includes: a covered conductor wiring portion having conductor wiring covered with an insulating coating film; and a conductor. It is composed of an exposed conductor wiring part where the wiring is exposed and an insulating covering film part having no conductor wiring, and the flexible wiring board is arranged such that the insulating covering film part and the covered conductor wiring part face each other with the conductor wiring part. means for bending and fixing the conductor wiring portion to the circuit board; and means for bringing the bent insulation coating film portion into contact with terminals of the electronic component protruding from the circuit board toward the flexible wiring board. A flexible wiring board mounting device comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985076987U JPH0246064Y2 (en) | 1985-05-22 | 1985-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985076987U JPH0246064Y2 (en) | 1985-05-22 | 1985-05-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61192478U true JPS61192478U (en) | 1986-11-29 |
| JPH0246064Y2 JPH0246064Y2 (en) | 1990-12-05 |
Family
ID=30619634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985076987U Expired JPH0246064Y2 (en) | 1985-05-22 | 1985-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0246064Y2 (en) |
-
1985
- 1985-05-22 JP JP1985076987U patent/JPH0246064Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0246064Y2 (en) | 1990-12-05 |
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