JPS58206186A - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- JPS58206186A JPS58206186A JP8903782A JP8903782A JPS58206186A JP S58206186 A JPS58206186 A JP S58206186A JP 8903782 A JP8903782 A JP 8903782A JP 8903782 A JP8903782 A JP 8903782A JP S58206186 A JPS58206186 A JP S58206186A
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- printed wiring
- conductor layer
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は）γ体重に組Ｘｒでるのに適した印刷配線板に
係り、簡学な（１４成で容易に組ヴてらｈる俊才ｔゾこ
印刷配線板を擢供することを目的とするものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a printed wiring board suitable for assembling a γ body weight, and utilizes a simple printed wiring board that is easy to assemble in a 14-layer structure. The purpose is to provide
一般に段数の印刷配線板を１１．に白文する」、うに配
置し、両者間をｌＩ：に電気的に接続する場合にＶよ第
図に・Ｊくすように予めリード線１を用いて複数の印
刷配線板２，３を１１．に電気的に接←；、：Ｌ、しか
る後−ト記印刷配線板２，３を！１；に直交するように
配置し、固定するようにしている。しかしながら、・こ
の神のものでは別個にり ｌ−線１ろシビ・安とし、す
＝−ド線１によって複数の印刷配線板２ 、３１ｉｉｉ
１１１ｉ、に電気的に接続しなければならず、そのｆ
’）Ｃ＆Ａ角業１組立作粟が非常に自制なものである。Generally, a printed wiring board with a number of stages is 11. If you want to electrically connect the printed wiring boards 2 and 3 to 11. with lead wires 1 as shown in Figures 1 and 11. Electrically connect ←;, :L, then - printed wiring boards 2 and 3! 1; and is arranged orthogonal to and fixed. However, in this god's work, the L-line 1 is connected to a plurality of printed wiring boards 2, 31iii.
111i, and its f
') C&A angle business 1 assembly millet is very restrained.
本発明は以１−のような従来の欠点を・除去するもので
あり簡単な構成で容易にσ体重に組１１て、＋、 Ｆ＋
る優れた印刷配線板を提供するものである。The present invention eliminates the conventional drawbacks as described in 1-1 below, and can be easily assembled into σ weight with a simple configuration.
This provides an excellent printed wiring board.
以下、本発明の印刷配置線機について一実施例の図面と
ともに１悦明する。Hereinafter, the printing arrangement line machine of the present invention will be explained in detail together with drawings of an embodiment.
第２図〜第６図におい−Ｃ４は絶縁ノーコ４ル、５ ＆
−１：絶縁基板４の刈面に形成された回路バタ ノを’
ｌ’ｆ’＋成する導体層、６は取イマ１足が絶縁基板
４に形成された取付孔に挿入され導体層５に半ＩＩＩ付
けされ／こ各種電気部品、７は絶縁基板４の導体層５の
形成されていない而に形成されたＶ字状の切溝、８ （
ｒｉ Ｖ字状の切溝７に塗布された接着剤である。In Figures 2 to 6 - C4 is insulation Norco 4, 5 &
-1: The circuit baton formed on the cut surface of the insulating substrate 4'
A conductive layer consisting of l'f'+, 6 a pair of take-up irons are inserted into a mounting hole formed in the insulating substrate 4 and semi-attached to the conductive layer 5, and various electrical components are formed; 7 is a conductor of the insulating substrate 4; V-shaped kerf formed where layer 5 is not formed, 8 (
ri This is an adhesive applied to the V-shaped cut groove 7.
上記実施例において絶縁基板４には先ず第２図に示すよ
うに各種電気部品６が取イ・ｊけらｆｒる。この状態で
絶縁基板４の導体層５を有しない側にＶ字状の切溝７を
形成する。（第３図参照） Ｖ字状のＬＪノγ７Ｉｌｆ
７に＆Ｊ必゛皮に応じて第４図に小才ように接ノγ、−
剤８を°・・；へ缶する。ぞして、その後第５図に、ｊ
：ずように絶縁基板４をＶ字状の切溝７を境にして導体
層６か外側となるように折曲する。このように−Ｊ−る
とリフ溝７内に塗布された接着剤８によ−・てｌ：＋ｉ
＋４切？？♂ｆ７を（）°４成する各面がＬＩ−に接合
され絶縁基板４は切ｒ１♂ｆ７を境にして折曲した状態
に強固に固定さ７Ｌｊる。−ぞし−Ｃ１この状態で導体
層５ばｒｆ、に接なが才Ｕてい・［、ので別個にＩＪ
−ド線等を必皮とせず全体としてその組）７．てか著し
く′？≠易になる。In the embodiment described above, various electrical components 6 are first mounted on the insulating substrate 4 as shown in FIG. In this state, a V-shaped groove 7 is formed on the side of the insulating substrate 4 that does not have the conductor layer 5. (See Figure 3) V-shaped LJ no γ7Ilf
7, &J must be connected to Fig. 4 as if it were a child, -
Pour agent 8 into a container. Then, in Figure 5, j
: The insulating substrate 4 is bent so that the V-shaped groove 7 is the boundary and the conductor layer 6 is on the outside. In this way, when -J- is applied, the adhesive 8 applied inside the rift groove 7 causes
+4 cut? ? Each surface forming ♂f7 ()°4 is joined to LI-, and the insulating substrate 4 is firmly fixed 7Lj in a bent state with the cut r1♂f7 as a boundary. -Zoshi-C1 In this state, the conductor layer 5 is connected to the RF, so the IJ is connected separately.
7. Is it significantly? ≠ becomes easier.
１゛、”ｑ１実殉例ては切溝７に接着剤８をｌテ布して
いるか接着ｈす８は必ずしも必安でない。また、実ｒ！
１例では絶縁ノ、１；＋ル４に絶縁基板４の厚さと回６
、ｑの深さのＬＩＪ ｉ：’ｊ ７ イ＋ｊ１ｇ成して
いるが、このＱノ溝７はイｆ１縁」占＆４の１１，１さ
、Ｊ：りン’、’ ｌ’−？ｕ ＜ しても良い。また
、実施例には絶縁基板４の刈面に直接導体層５を１１そ
成し２でいるが第６図に・Ｊ、すように絶縁基板４のχ
面にフレギノゾルな肉厚の層板９を接合し、このノＩ（
仮９０）〈面に□、９体層６をノ１勿戊するように構成
しても良い。このように（ＩＩ４成した場合には絶縁基
板４を切溝７を中心に折曲する際に導体層５が不用意に
破損さハるのを未然に防１１することができより効果的
である。1゛、"q1 For example, it is not always necessary to apply adhesive 8 to the cut groove 7.
In one example, the thickness of the insulating substrate 4 and the thickness of the insulating substrate 4 and the times 6
, q has a depth of LIJ i: 'j 7 i+j1g, but this Q groove 7 has an i f1 edge 'Zan&4's 11,1, J: Rin', 'l'-? u < may be used. In addition, in the embodiment, the conductor layer 5 is formed directly on the cut surface of the insulating substrate 4, but as shown in FIG.
A thick layer plate 9 made of freginosol is bonded to the surface, and this No.I (
Temporary 90) It may be constructed so that □ and 9 body layers 6 are removed from the surface. In this way (II4), it is possible to prevent the conductor layer 5 from being accidentally damaged when bending the insulating substrate 4 around the groove 7, which is more effective. be.
以上、実施例より明らかなように本発明の印刷配線板は
絶縁基板にＶ字状の切溝を形成し、との切溝を中心に上
記絶縁基板を折曲するように構成したものであり、別個
にリ ド線やジャン・ζ線を必要とせず簡抜導体層によ
−〕て１１．に接１＝ｉ“、することができ、全体とし
てその製造組立てを著し、 ＜ ｒ＋易にすることがで
き実用十きわめて有利なものである。As is clear from the examples above, the printed wiring board of the present invention is configured such that a V-shaped groove is formed in an insulating substrate, and the insulating substrate is bent around the groove. 11. By using an easily extracted conductor layer without requiring separate lead wires or jump/zeta wires. 1 = i'', and the manufacturing and assembly thereof as a whole can be made extremely easy and <r+, which is extremely advantageous in practical use.
第１図は従来の印刷配線板の説明図、第２図〜第５図は
本発明の印刷配線板における一実ゲ１例の説明図、第６
図は他の実殉例の説明図である。
４・・・・絶縁基板、６・・・・・導体層、６・・・・
・′１（□気部品、７・・・切溝、８・・・・・接着剤
、９・・・・基板。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図
／
第２図
す
第３図
第４図
１．５５図
）
第６図FIG. 1 is an explanatory diagram of a conventional printed wiring board, FIGS. 2 to 5 are explanatory diagrams of one example of a printed wiring board of the present invention, and FIG.
The figure is an explanatory diagram of another actual example. 4...Insulating substrate, 6...Conductor layer, 6...
・'1 (□Air parts, 7...kerf, 8...adhesive, 9...substrate. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1)
Figure/ Figure 2, Figure 3, Figure 4, Figure 1.55) Figure 6
Claims (1)
すると共にこの絶縁基板の上記導体層を有しない而にＶ
字状の切溝を形成し、この切溝を中心に上記絶縁基板を
上記導体層が外側になるように折曲して成る印刷配線板
。A conductor layer constituting a circuit pattern is formed on the surface of an insulating substrate, and V
A printed wiring board formed by forming a letter-shaped cut groove and bending the insulating substrate around the cut groove so that the conductor layer faces outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8903782A JPS58206186A (en) | 1982-05-25 | 1982-05-25 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8903782A JPS58206186A (en) | 1982-05-25 | 1982-05-25 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58206186A true JPS58206186A (en) | 1983-12-01 |
Family
ID=13959689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8903782A Pending JPS58206186A (en) | 1982-05-25 | 1982-05-25 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58206186A (en) |
-
1982
- 1982-05-25 JP JP8903782A patent/JPS58206186A/en active Pending
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