JPS6269700A - Hybrid integrated circuit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Industrial Application Field of the Present Invention The present invention relates to a hybrid integrated circuit having a shield structure.

<Prior art and its drawbacks> (Fig. 5.6) Conventionally, as shown in Fig. 5, when a hybrid integrated circuit 1 requiring shielding is mounted on a mounting board 2 together with other mounting components 3, An external shield plate 4 is provided between the hybrid integrated circuit 1 that requires shielding and other mounted components 3, and is mounted on the mounting board 2.

However, this method requires a special space for mounting the external shield plate 4 on the mounting board 2.
The drawback was that it was unsuitable for high-density packaging.

For this reason, conventionally, as shown in FIG.
A hybrid integrated circuit 1 is also used in which a shielding conductor 7 is printed on almost the entire surface of the back surface 5a on which no component 6 is mounted, thereby forming a shield structure itself. (In addition, in FIG. 6, there is J3, Qa is an external lead for the shield electrode electrically connected to the conductor 7, 8b is another external lead, 9
is the exterior material. ) However, this method has the disadvantage that the cost of materials used is high because silver thread paste is used to form the conductor 7, and the manufacturing cost increases significantly because the number of man-hours required to form the conductor 7 increases. there were. Another drawback is that it is possible only for single-sided mounted hybrid integrated circuits, and cannot be realized for double-sided printing or double-sided mounting.

<Object of the present invention> The present invention aims to correct the above-mentioned drawbacks and provide a hybrid integrated circuit having a shield structure that can be manufactured at low cost.

Embodiments of the present invention> (Figure 1.2) Hereinafter, the present invention will be explained in detail based on the drawings.

FIG. 1.2 shows an embodiment of a hybrid integrated circuit according to the invention.

In the figure, 10 is an insulating substrate, and one side 1 of the insulating substrate 10 is
A conductor 11 is formed on 0a by a method such as screen printing, and a component 12 is mounted thereon.

On the back surface 10b of the insulating substrate 10, a metal foil (for example, copper foil) 13, which is previously prepared in a size that covers almost the entire surface, is pasted with an adhesive. This metal foil 13 has a bent portion 13a at its end, and this bent portion 13a is penetrated by the IL 14 provided on the insulating substrate 10. The bent portion 13a is electrically connected to the conductor 11a, which is electrically connected to the external lead 15a for the shield electrode, by soldering or the like. These entire exteriors are covered with an insulating sheathing material 16. A3.15b is another external lead.

In this way, the metal foil 13 attached to the back surface 10b of the insulating substrate 10 serves as a shield for the electronic circuit formed on the insulating substrate 10 by the conductor 11 and the component 12.

<Other embodiments of the present invention> (Fig. 3) The embodiments shown in Fig. 1.2 were for single-sided printed/single-sided mounted boards, but Fig. 3 is a case of double-sided printed/single-sided mounted boards. 2 shows another embodiment of the invention.

That is, in this embodiment, both surfaces 10a11 of the insulating substrate 10
A conductor 11 is formed on 0b by printing or the like, and one side 1
Component 12 is mounted only on 0a. This back side 10b
A metal foil 1 similar to the embodiment of FIG. 1.2 is placed on the conductor 11 of
3 is pasted with an insulating material. The metal foil 13 is electrically connected to the conductor 11a on the back surface 10b by soldering (plug, etc.).

Other Embodiments of the Present Invention (FIG. 4) FIG. 4 shows an embodiment of the present invention applied to a double-sided printing and double-sided mounting board.

That is, in this embodiment, both surfaces 10a and 1 of the insulating substrate 10
A conductor 11 is formed on 0b by printing or the like, and both sides 10
Components 12 are mounted on parts a and 10b. A metal foil 13 similar to that described above is pasted onto this back component 12 with an adhesive. Then, the metal foil 13 is on the back side 10
It is electrically connected to the conductor 11a of b by soldering or the like.

In addition, in the embodiments shown in FIGS. 3 and 4, the conductor 1
Insulation between the conductor 11 and parts 12 other than 1a and the metal foil 13 is obtained by a glass coat formed on the conductor 11 and parts 12 and an insulating adhesive applied to the metal foil 13.

Although the present invention has been described in detail above, the structure of the present invention is not limited to the above embodiments, and various modifications can be made to each part. For example, in the above embodiments, the metal foil 13 is Although it is connected to the conductor 11 connected to the external lead 15a, it may be electrically connected directly to the external lead 15a by soldering, etc. Further, the metal foil 13 may be provided on both sides of the substrate 10.

<Effects of the Present Invention> Since the hybrid integrated circuit of the present invention is configured as described above, it has the following effects.

(a) Compared to the case where an external shield plate is provided as in the conventional example shown in FIG. 5, the hybrid integrated circuit itself has a shield structure, which saves space and enables high-density mounting.

(b) Compared to forming the shielding conductor directly on the insulating substrate 10 by printing etc. as in the conventional example shown in FIG.
Since the inexpensive metal foil 13 is used, the cost is low, and since it is sufficient to simply apply the metal foil at the time of packaging, and processes such as printing are not required, manufacturing costs can be significantly reduced.

(0) Unlike the conventional example shown in FIG. 6, the shield structure can be realized even with a board printed on both sides or mounted on both sides.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing one embodiment of the present invention, FIG. 2 is a perspective view thereof, and FIG. 3.4 is a sectional view showing another embodiment of the invention. FIG. 5 is a perspective view showing a conventional example in which a shield plate is provided between a hybrid integrated circuit and other mounted components, and FIG. 6 is a perspective view showing a conventional hybrid integrated circuit. 10...Insulating substrate, 11...Conductor, 1
2...Parts, 13...Metal foil, 14.
...hole, 15a ...external lead, 16.
...Exterior material. Patent applicant Nifco Co., Ltd. Agent Patent attorney Makoto Hayakawa Shikan 3 Figure 1 Figure 5m Figure 6

Claims (1)

[Claims] Placing a metal foil for shielding on an insulating substrate or its mounting surface, and electrically connecting the metal foil to an external lead for a shield electrode or a conductor electrically connected to the external lead. A hybrid integrated circuit featuring: