JPS6220400A - Method and apparatus for shielding electric equipment - Google Patents
Method and apparatus for shielding electric equipmentInfo
- Publication number
- JPS6220400A JPS6220400A JP60158303A JP15830385A JPS6220400A JP S6220400 A JPS6220400 A JP S6220400A JP 60158303 A JP60158303 A JP 60158303A JP 15830385 A JP15830385 A JP 15830385A JP S6220400 A JPS6220400 A JP S6220400A
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- thin film
- conductive thin
- lead wire
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
１対象技術分野」
この発明は電気機器の電気あるいは磁気に対するシール
ド方法およびその装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION 1. Field of the Invention This invention relates to a method and apparatus for shielding electrical equipment from electricity or magnetism.
１−従来技術−］
従来この種の方法あるいは装置として第３図に示すよう
に、合成樹脂製のケース１内壁面に導電性の薄膜３を形
成し、またケース内に電子回路を形成するプリント回路
基板２を収容ｌ〜、この基板のアース導体と導電性薄膜
３を電気的に接続するリード線６を弾性材により構成し
、そのリード線を導電性薄膜に対して弾性的に接触させ
るものがあるが、この方法は弾性材の表面酸化による導
電性の低下や製品として使用されるばあい、振動のある
ところでの共振による非接触問題、あるい、はリード線
と導電性薄膜この接触点において、導電性薄膜３が破損
し、これにより非導通等を起す間題がある。1-Prior Art-] Conventionally, as shown in FIG. 3, this type of method or apparatus is a printing method in which a conductive thin film 3 is formed on the inner wall surface of a case 1 made of synthetic resin, and an electronic circuit is formed inside the case. A circuit board 2 is accommodated, and a lead wire 6 for electrically connecting the ground conductor of this board and the conductive thin film 3 is made of an elastic material, and the lead wire is brought into elastic contact with the conductive thin film. However, this method has problems such as a decrease in conductivity due to surface oxidation of the elastic material, non-contact problems due to resonance in areas with vibration when used as a product, or contact points between the lead wire and the conductive thin film. In this case, there is a problem that the conductive thin film 3 is damaged and this causes non-conductivity.
この問題を解決するために、第４図に示すようにリード
線６の一端を導電性の接着剤５を用いて、導電性薄膜に
接着する方法があるが、接着剤５が固化するまでリー
ド線６を動か１ことができず、その固定方法が難かしい
ばかりかケース１の形状が複雑になるにしたがって作業
性がますます悪化する。In order to solve this problem, there is a method of bonding one end of the lead wire 6 to a conductive thin film using a conductive adhesive 5, as shown in FIG.
The wire 6 cannot be moved 1, and the method of fixing it is difficult, and as the shape of the case 1 becomes more complicated, the workability becomes worse.
また第５図に示すように導電性薄膜３に導電性の接着剤
５を塗布し′〔これを乾燥［２、とれにリード線を直接
半田伺け７する方法があるが、半田付けをする際に導電
性薄膜３そのものを破壊するととが多く、ひいては下地
の樹脂材すなわちケース１をも溶かし、さらにこれヶ変
形させる欠点がある。In addition, as shown in Figure 5, a conductive adhesive 5 is applied to the conductive thin film 3' and then dried. In this case, the conductive thin film 3 itself is often destroyed, and the underlying resin material, that is, the case 1, is also melted and deformed.
さらに第６図に示すようにリード線６をり一ス１等に機
械的に、たとえば金属リング１１をねじ１２により固定
し、この上から金属を蒸着したり、導電性の塗料を塗布
する方法があるが、リー ド線６またはこのリー ド
線の伺属端子の界面面積が狭いため、ずなわち膜３が薄
すぎるために、下地の樹脂の膨張により、接合部が切れ
易い欠点がある。Furthermore, as shown in FIG. 6, the lead wire 6 is mechanically fixed to a wire 1 or the like, for example, by a metal ring 11 with a screw 12, and a metal is vapor-deposited or a conductive paint is applied thereon. However, because the interface area of the lead wire 6 or the interfacing terminal of this lead wire is narrow, the membrane 3 is too thin, and the joint part is easily broken due to expansion of the underlying resin. .
また第７図に示ずようにケースの外周を金属製の箱１３
で覆う方法もあるが、製造方法が複雑となり、このため
原価高となる欠点がある。In addition, as shown in FIG. 7, the outer periphery of the case is covered with a metal box 13.
There is also a method of covering the material with a metal oxide, but this method requires a complicated manufacturing method and has the disadvantage of increasing costs.
１目的−１
この発明はこのような従来の欠点にかんがみ、安定した
シールド方法およびその装置を提供１２ようとするもの
である。1.Objective 1. In view of these conventional drawbacks, the present invention aims to provide a stable shielding method and device.
「実施例」 以下図によってこの発明の一実施例について説明する。"Example" An embodiment of the present invention will be described below with reference to the drawings.
すなわち第１図において、絶縁性ケース１は合成樹脂に
より構成され、このケース内には電子回路を形成するプ
リント回路基板２が収容される。That is, in FIG. 1, an insulating case 1 is made of synthetic resin, and a printed circuit board 2 forming an electronic circuit is accommodated within this case.
またケー７１の内壁面には導電性薄膜３が蒸着等の手段
により形成されている。さらにこの導電性薄膜上にはテ
ープ状の金属箔４が貼付されている。この金属箔は裏面
に接着剤があらかじめ塗布されたもので、金属箔の材質
はたとえば銅箔である。また金属箔４の周縁部において
、この金属箔と導電性薄膜３とに跨って導電性の接着剤
５が塗布され、これによって両者はたがいに電気的に接
続される。そしてその接着剤５が硬化した状態で、金属
箔４ Ｋ ＩＪ−ド線６の一端を半日１付け７し、さら
にそのリード線の他端はプリント回路基板２のアース導
体９に半田付け８等により電気的に接続される。Further, a conductive thin film 3 is formed on the inner wall surface of the case 71 by means such as vapor deposition. Furthermore, a tape-shaped metal foil 4 is pasted on this conductive thin film. The back surface of this metal foil is coated with an adhesive in advance, and the material of the metal foil is, for example, copper foil. Furthermore, a conductive adhesive 5 is applied to the peripheral edge of the metal foil 4, spanning the metal foil and the conductive thin film 3, thereby electrically connecting them to each other. Then, with the adhesive 5 hardened, one end of the lead wire 6 is soldered to the metal foil 4 for half a day, and the other end of the lead wire is soldered to the ground conductor 9 of the printed circuit board 2. electrically connected.
これによってプリント回路基板２を含むケース１内の電
子回路が電気あるいは磁気からシールドされる。This shields the electronic circuitry within the case 1, including the printed circuit board 2, from electricity or magnetism.
また第２図に示ずものは金属箔４の中間部を導電性薄膜
３から少し離して、その両端部を導電性薄膜３に接着し
たもので、ケース１が熱によって伸びたばあいにも、そ
の伸びを吸収するものである。In addition, the one not shown in FIG. 2 is one in which the middle part of the metal foil 4 is placed a little apart from the conductive thin film 3, and both ends are glued to the conductive thin film 3, so that it can be used even if the case 1 is expanded due to heat. , which absorbs that elongation.
１効果」
この発明によれば導電性薄膜３と金属箔４とは導電性の
接着剤５により接着されろため、十分な導通が得られ、
また金属箔４とリード線６は半ＨＪ付け７により接続さ
れるため、信頼性が高く、万一半田付けした部分の直下
の導電性薄膜が熱によって破損したとしても電気的に何
ら支障はな（、さらに金属箔４は少量使用すれば事足り
、ｌまたがって安価である。1. According to the present invention, since the conductive thin film 3 and the metal foil 4 are bonded together using the conductive adhesive 5, sufficient conduction can be obtained.
In addition, since the metal foil 4 and the lead wire 6 are connected by half-HJ attachment 7, reliability is high, and even if the conductive thin film directly under the soldered part is damaged by heat, there will be no electrical problem. (Furthermore, it is sufficient to use a small amount of the metal foil 4, and it is inexpensive.
第１図はこの発明における電気機器のシールド方法およ
びその装置の一実施例を示す側断面図、第２図はこの発
明の他の実施例を示す側断面図、第３図ないし第７図は
従来の方法および装置を示す側断面図ｔある。
ｌ・・・ケース、２・・・プリント回路基板、３・・・
導電性薄膜、４・・・金属箔、５・・・導電性の接着剤
、６・・・リード線、７・・・半田付け、８・・・半田
付け、９・・・アース導体。
特 許 出 願 人 内式〕・ネウエル株式会社第
１図
第２図
６ ｉ ９
２・・ −３
第３図
第４図
第５図
第７図FIG. 1 is a side sectional view showing an embodiment of the method and apparatus for shielding electrical equipment according to the present invention, FIG. 2 is a side sectional view showing another embodiment of the invention, and FIGS. 3 to 7 are There is a side cross-sectional view illustrating a conventional method and apparatus. l...Case, 2...Printed circuit board, 3...
Conductive thin film, 4... Metal foil, 5... Conductive adhesive, 6... Lead wire, 7... Soldering, 8... Soldering, 9... Earth conductor. Patent application person internal formula] Newel Co., Ltd. Figure 1 Figure 2 Figure 6 i9 2... -3 Figure 3 Figure 4 Figure 5 Figure 7
Claims (2)
もに、この導電性薄膜上に金属箔を貼付し、かつこの金
属箔の周縁部に、この金属箔と上記導電性薄膜とをたが
いに電気的に接続する導電性の接着剤を、上記金属箔と
上記導電性薄膜に跨がるように塗布し、上記金属箔にリ
ード線の一端を半田付けし、さらにこのリード線の他端
を電子回路を形成するプリント回路基板のアース導体に
接続することを特徴とする電気機器のシールド方法。(1) A conductive thin film is formed on the insulating case wall surface, a metal foil is pasted on the conductive thin film, and the metal foil and the conductive thin film are attached to each other around the periphery of the metal foil. A conductive adhesive for electrical connection is applied across the metal foil and the conductive thin film, one end of the lead wire is soldered to the metal foil, and the other end of the lead wire is soldered to the metal foil. A method of shielding electrical equipment, characterized by connecting it to a ground conductor of a printed circuit board forming an electronic circuit.
電性薄膜と、この導電性薄膜上に貼付した金属箔と、こ
の金属箔の周縁部において、この金属箔と上記導電性薄
膜とに跨つて塗布され、これら両者をたがいに電気的に
接続する導電性接着剤と、上記金属箔に一端が、またそ
の他端が電子回路を形成するプリント回路基板のアース
導体にそれぞれ接続したリード線とから構成された電気
機器のシールド装置。(2) An insulating case, a conductive thin film formed on the wall of the case, a metal foil pasted on the conductive thin film, and a connection between the metal foil and the conductive thin film at the periphery of the metal foil. A conductive adhesive that is applied across the metal foil and electrically connects them to each other, and a lead wire that has one end connected to the metal foil and the other end connected to the ground conductor of the printed circuit board forming the electronic circuit. A shielding device for electrical equipment consisting of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60158303A JPS6220400A (en) | 1985-07-19 | 1985-07-19 | Method and apparatus for shielding electric equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60158303A JPS6220400A (en) | 1985-07-19 | 1985-07-19 | Method and apparatus for shielding electric equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6220400A true JPS6220400A (en) | 1987-01-28 |
| JPH0211037B2 JPH0211037B2 (en) | 1990-03-12 |
Family
ID=15668671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60158303A Granted JPS6220400A (en) | 1985-07-19 | 1985-07-19 | Method and apparatus for shielding electric equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6220400A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63140695U (en) * | 1987-03-06 | 1988-09-16 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5517517U (en) * | 1978-07-20 | 1980-02-04 | ||
| JPS55139596U (en) * | 1979-03-24 | 1980-10-04 | ||
| JPS5727189U (en) * | 1980-07-22 | 1982-02-12 | ||
| JPS596861U (en) * | 1982-07-07 | 1984-01-17 | 松下電器産業株式会社 | wiring board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS596861B2 (en) * | 1975-05-19 | 1984-02-15 | オオツカセイヤク カブシキガイシヤ | Method for producing 5-[(2-halogeno-1-hydroxy)alkyl[carbostyryl derivative] |
-
1985
- 1985-07-19 JP JP60158303A patent/JPS6220400A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5517517U (en) * | 1978-07-20 | 1980-02-04 | ||
| JPS55139596U (en) * | 1979-03-24 | 1980-10-04 | ||
| JPS5727189U (en) * | 1980-07-22 | 1982-02-12 | ||
| JPS596861U (en) * | 1982-07-07 | 1984-01-17 | 松下電器産業株式会社 | wiring board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63140695U (en) * | 1987-03-06 | 1988-09-16 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0211037B2 (en) | 1990-03-12 |
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