JPH0211037B2 - - Google Patents

Info

Publication number
JPH0211037B2
JPH0211037B2 JP60158303A JP15830385A JPH0211037B2 JP H0211037 B2 JPH0211037 B2 JP H0211037B2 JP 60158303 A JP60158303 A JP 60158303A JP 15830385 A JP15830385 A JP 15830385A JP H0211037 B2 JPH0211037 B2 JP H0211037B2
Authority
JP
Japan
Prior art keywords
metal foil
thin film
conductive thin
lead wire
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60158303A
Other languages
Japanese (ja)
Other versions
JPS6220400A (en
Inventor
Takekazu Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Azbil Corp
Original Assignee
Azbil Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Azbil Corp filed Critical Azbil Corp
Priority to JP60158303A priority Critical patent/JPS6220400A/en
Publication of JPS6220400A publication Critical patent/JPS6220400A/en
Publication of JPH0211037B2 publication Critical patent/JPH0211037B2/ja
Granted legal-status Critical Current

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  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Description

【発明の詳細な説明】 「対象技術分野」 この発明は電気機器の電気あるいは磁気に対す
るシールド方法およびその装置に関するものであ
る。
DETAILED DESCRIPTION OF THE INVENTION Technical Field: This invention relates to a method and apparatus for shielding electrical equipment from electricity or magnetism.

「従来技術」 従来この種の方法あるいは装置として第3図に
示すように、合成樹脂製のケース1内壁面に導電
性の薄膜3を形成し、またケース内に電子回路を
形成するプリント回路基板を収容し、この基板の
アース導体と導電性薄膜3を電気的に接続するリ
ード線6を弾性材により構成し、そのリード線を
導電性薄膜に対して弾性的に接触させるものがあ
るが、この方法は弾性材の表面酸化による導電性
の低下や製品として使用されるばあい、振動のあ
るところでの共振による非接触問題、あるいはリ
ード線と導電性薄膜との接触点において、導電性
薄膜3が破損し、これにより非導通等を起す問題
がある。
"Prior Art" Conventionally, as shown in FIG. 3, this type of method or apparatus includes a printed circuit board in which a conductive thin film 3 is formed on the inner wall surface of a case 1 made of synthetic resin, and an electronic circuit is formed inside the case. There is one in which the lead wire 6 that electrically connects the ground conductor of the substrate and the conductive thin film 3 is made of an elastic material, and the lead wire is brought into elastic contact with the conductive thin film. This method can reduce conductivity due to surface oxidation of the elastic material, or when used as a product, may cause non-contact problems due to resonance in places with vibrations, or the contact point between the conductive thin film and the lead wire. There is a problem that this may cause damage, which may cause non-conductivity.

この問題を解決するために、第4図に示すよう
にリード線6の一端を導電性の接着剤5を用い
て、導電性薄膜に接着する方法があるが、接着剤
5が固化するまでリード線6を動かすことができ
ず、その固定方法が難かしいばかりかケース1の
形状が複雑になるにしたがつて作業性がますます
悪化する。
In order to solve this problem, there is a method of bonding one end of the lead wire 6 to a conductive thin film using a conductive adhesive 5, as shown in FIG. The wire 6 cannot be moved and the method of fixing it is difficult, and as the shape of the case 1 becomes more complex, the workability becomes worse.

また第5図に示すように導電性薄膜3に導電性
の接着剤5を塗布してこれを乾燥し、これにリー
ド線を直接半田付け7する方法があるが、半田付
けをする際に導電性薄膜3そのものを破壊するこ
とが多く、ひいては下地の樹脂材すなわちケース
1をも溶かし、さらにこれを変形させる欠点があ
る。
Alternatively, as shown in Fig. 5, there is a method in which a conductive adhesive 5 is applied to a conductive thin film 3, the adhesive is dried, and a lead wire is directly soldered 7 to this. This has the disadvantage that the thin film 3 itself is often destroyed, and the underlying resin material, that is, the case 1, is also melted and deformed.

さらに第6図に示すようにリード線6をケース
1等に機械的に、たとえば金属リング11をねじ
12により固定し、この上から金属を蒸着した
り、導電性の塗料を塗布する方法があるが、リー
ド線6またはこのリード線の付属端子の界面面積
が狭いため、すなわち膜3が薄すぎるために、下
地の樹脂の膨張により、接合部が切れ易い欠点が
ある。
Furthermore, as shown in FIG. 6, there is a method in which the lead wire 6 is mechanically fixed to the case 1 etc., for example, by a metal ring 11 with a screw 12, and then a metal is vapor-deposited or a conductive paint is applied thereon. However, since the interface area of the lead wire 6 or the attached terminal of the lead wire is small, that is, the membrane 3 is too thin, there is a drawback that the joint portion is easily broken due to expansion of the underlying resin.

また第7図に示すようにケースの外周を金属製
の箱13で覆う方法もあるが、製造方法が複雑と
なり、このため原価高となる欠点がある。
Alternatively, as shown in FIG. 7, there is a method of covering the outer periphery of the case with a metal box 13, but this method has the disadvantage of complicating the manufacturing method and increasing the cost.

「目 的」 この発明はこのような従来の欠点にかんがみ、
安定したシールド方法およびその装置を提供しよ
うとするものである。
"Purpose" This invention takes into consideration the drawbacks of the conventional technology, and
The present invention aims to provide a stable shielding method and device.

「実施例」 以下図によつてこの発明の一実施例について説
明する。
"Embodiment" An embodiment of the present invention will be described below with reference to the drawings.

すなわち第1図において、絶縁性ケース1は合
成樹脂により構成され、このケース内には電子回
路を形成するプリント回路2が収容される。また
ケース1の内壁面には導電性薄膜3が蒸着等の手
段により形成されている。さらにこの導電性薄膜
上にはテープ状の金属箔4が貼付されている。こ
の金属箔は裏面に接着剤があらかじめ塗布された
もので、金属箔の材質はたとえば銅箔である。ま
た金属箔4の周縁部において、この金属箔と導電
性薄膜3とに跨つて導電性の接着剤5が塗布さ
れ、これによつて両者はたがいに電気的に接続さ
れる。そしてその接着剤5が硬化した状態で、金
属箔4にリード線6の一端を半田付け7し、さら
にそのリード線の他端はプリント回路基板2のア
ース導体9に半田付け8等により電気的に接続さ
れる。
That is, in FIG. 1, an insulating case 1 is made of synthetic resin, and a printed circuit 2 forming an electronic circuit is accommodated within this case. Further, a conductive thin film 3 is formed on the inner wall surface of the case 1 by means such as vapor deposition. Furthermore, a tape-shaped metal foil 4 is pasted on this conductive thin film. The back surface of this metal foil is coated with an adhesive in advance, and the material of the metal foil is, for example, copper foil. Furthermore, a conductive adhesive 5 is applied at the peripheral edge of the metal foil 4 over the metal foil and the conductive thin film 3, thereby electrically connecting them to each other. Then, with the adhesive 5 hardened, one end of the lead wire 6 is soldered 7 to the metal foil 4, and the other end of the lead wire is electrically connected to the ground conductor 9 of the printed circuit board 2 by soldering 8, etc. connected to.

これによつてプリント回路基板2を含むケース
1内の電子回路が電気あるいは磁気からシールド
される。
This shields the electronic circuitry within the case 1, including the printed circuit board 2, from electricity or magnetism.

また第2図に示すものは金属箔4の中間部を導
電性薄膜3から少し離して、その両端部を導電性
薄膜3に接着したもので、ケース1が熱によつて
伸びたばあいにも、その伸びを吸収するものであ
る。
In the case shown in FIG. 2, the middle part of the metal foil 4 is placed a little apart from the conductive thin film 3, and both ends are glued to the conductive thin film 3, so that when the case 1 is expanded due to heat, It also absorbs that growth.

「効 果」 この発明によれば導電性薄膜3と金属箔4とは
導電性の接着剤5により接着されるため、十分な
導通が得られ、また金属箔4とリード線6は半田
付け7により接続されるため、信頼性が高く、万
一半田付けした部分の直下の導電性薄膜が熱によ
つて破損したとしても電気的に何ら支障はなく、
さらに金属箔4は少量使用すれば事足り、したが
つて安価である。
"Effects" According to the present invention, the conductive thin film 3 and the metal foil 4 are bonded together with the conductive adhesive 5, so that sufficient conduction can be obtained, and the metal foil 4 and the lead wire 6 are connected by soldering 7. Since the connection is made with
Furthermore, it is sufficient to use a small amount of the metal foil 4, and therefore it is inexpensive.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明における電気機器のシールド
方法およびその装置の一実施例を示す側断面図、
第2図はこの発明の他の実施例を示す側断面図、
第3図ないし第7図は従来の方法および装置を示
す側断面図である。 1…ケース、2…プリント回路基板、3…導電
性薄膜、4…金属箔、5…導電性の接着剤、6…
リード線、7…半田付け、8…半田付け、9…ア
ース導体。
FIG. 1 is a side sectional view showing an embodiment of the shielding method and device for electrical equipment according to the present invention;
FIG. 2 is a side sectional view showing another embodiment of the invention;
FIGS. 3-7 are side cross-sectional views illustrating a conventional method and apparatus. DESCRIPTION OF SYMBOLS 1... Case, 2... Printed circuit board, 3... Conductive thin film, 4... Metal foil, 5... Conductive adhesive, 6...
Lead wire, 7...Soldering, 8...Soldering, 9...Ground conductor.

Claims (1)

【特許請求の範囲】 1 絶縁性のケース壁面に導電性薄膜を形成する
とともに、この導電性薄膜上に金属箔を貼付し、
かつこの金属箔の周縁部に、この金属箔と上記導
電性薄膜とをたがいに電気的に接続する導電性の
接着剤を、上記金属箔と上記導電性薄膜に跨がる
ように塗布し、上記金属箔にリード線の一端を半
田付けし、さらにこのリード線の他端を電子回路
を形成するプリント回路基板のアース導体に接続
することを特徴とする電気機器のシールド方法。 2 絶縁性のケースと、このケース壁面に形成し
た導電性薄膜と、この導電性薄膜上に貼付した金
属箔と、この金属箔の周縁部において、この金属
箔と上記導電性薄膜とに跨つて塗布され、これら
両者をたがいに電気的に接続する導電性接着剤
と、上記金属箔に一端が、またその他端が電子回
路を形成するプリント回路基板のアース導体にそ
れぞれ接続したリード線とから構成された電気機
器のシールド装置。
[Claims] 1. Forming a conductive thin film on the wall of an insulating case, and pasting metal foil on the conductive thin film,
and applying a conductive adhesive for electrically connecting the metal foil and the conductive thin film to each other on the peripheral edge of the metal foil so as to span the metal foil and the conductive thin film, A method for shielding electrical equipment, comprising: soldering one end of a lead wire to the metal foil, and further connecting the other end of the lead wire to a ground conductor of a printed circuit board forming an electronic circuit. 2. An insulating case, a conductive thin film formed on the wall of the case, a metal foil pasted on the conductive thin film, and a metal foil that straddles the metal foil and the conductive thin film at the peripheral edge of the metal foil. It consists of a conductive adhesive that is applied to electrically connect these two to each other, and a lead wire that has one end connected to the metal foil and the other end connected to the ground conductor of the printed circuit board forming the electronic circuit. shielding equipment for electrical equipment.
JP60158303A 1985-07-19 1985-07-19 Method and apparatus for shielding electric equipment Granted JPS6220400A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60158303A JPS6220400A (en) 1985-07-19 1985-07-19 Method and apparatus for shielding electric equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60158303A JPS6220400A (en) 1985-07-19 1985-07-19 Method and apparatus for shielding electric equipment

Publications (2)

Publication Number Publication Date
JPS6220400A JPS6220400A (en) 1987-01-28
JPH0211037B2 true JPH0211037B2 (en) 1990-03-12

Family

ID=15668671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60158303A Granted JPS6220400A (en) 1985-07-19 1985-07-19 Method and apparatus for shielding electric equipment

Country Status (1)

Country Link
JP (1) JPS6220400A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63140695U (en) * 1987-03-06 1988-09-16

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5517517U (en) * 1978-07-20 1980-02-04
JPS5727189U (en) * 1980-07-22 1982-02-12
JPS596861B2 (en) * 1975-05-19 1984-02-15 オオツカセイヤク カブシキガイシヤ Method for producing 5-[(2-halogeno-1-hydroxy)alkyl[carbostyryl derivative]

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55139596U (en) * 1979-03-24 1980-10-04
JPS596861U (en) * 1982-07-07 1984-01-17 松下電器産業株式会社 wiring board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS596861B2 (en) * 1975-05-19 1984-02-15 オオツカセイヤク カブシキガイシヤ Method for producing 5-[(2-halogeno-1-hydroxy)alkyl[carbostyryl derivative]
JPS5517517U (en) * 1978-07-20 1980-02-04
JPS5727189U (en) * 1980-07-22 1982-02-12

Also Published As

Publication number Publication date
JPS6220400A (en) 1987-01-28

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