JPH07162138A - Integrated circuit mounting method - Google Patents

Abstract

PURPOSE:To provide an integrated circuit mounting method which makes it possible to incorporate an integrated circuit onto an electronic circuit without using solder. CONSTITUTION:A wedge-shaped lead terminal 1, the upper side of which is larger than the lower side, having a protrusion 10, which comes in contact with the upper part of a conductive part 4 provided in the through hole of an electronic circuit board 3 and also having a longitudinally slender through hole 11 formed along the longitudinal direction, is provided on an integrated circuit 2, and the integrated circuit can be electrically connected and mechanically fixed by inserting the lead terminal 1 into the through hole of the electronic circuit board 3 and it is adhered closely to the conductive part 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of mounting an integrated circuit on an electronic circuit board, and more particularly to a method of mounting using a contact type lead terminal that does not require a soldering step.

[0002]

2. Description of the Related Art As a conventional mounting technique of an integrated circuit on an electronic circuit board, a lead terminal 6 included in the integrated circuit 2 is provided on the electronic circuit board 3 as shown in FIGS. The majority of the methods are to attach the conductive portion 4 of the through hole and the lead terminal 6 with the solder 5 after the insertion into the through hole.

As a method of mounting on a thin film substrate, a technique of sandwiching and crimping a lead terminal of an integrated circuit with a conductor pattern corresponding to the lead terminal formed on the thin film substrate is disclosed in Japanese Patent Laid-Open No. 61-121493. It is disclosed in the official gazette.

[0004]

In the conventional method involving a soldering process, a secondary failure occurs due to the use of a chemical such as CFC or a CFC substitute in the process, and maintenance and quality of equipment are reduced. However, there is a problem in that management and maintenance cost a lot of money.

Further, the soldered integrated circuit has a problem that its workability is poor even in maintenance work such as replacement.

The method disclosed in Japanese Patent Laid-Open No. 61-121493 is a technique applicable only to a thin film circuit board.

[0007]

In view of such a problem in a mounting method involving a soldering step, the integrated circuit mounting method according to the present invention does not require a soldering step.

According to the method of mounting an integrated circuit of the present invention, the lead terminal of the integrated circuit has a protrusion contacting an upper portion of a conductive portion provided in a through hole of an electronic circuit board, and the lead terminal in the terminal length direction. The lead terminal has a wedge shape with an upper dimension larger than a lower dimension, and the lead terminal is inserted into a through hole of an electronic circuit board to form a through hole. It is characterized in that it is mounted by being brought into close contact with the provided conductive portion.

[0009]

The present invention will be described below with reference to the drawings.

FIG. 1 is an external view of an integrated circuit having lead terminals according to an embodiment of the present invention, and FIG. 1B is a perspective view showing only the lead terminal portion.

FIG. 2 is a diagram showing an embodiment of the present invention.
FIG. 3B is a sectional view of a portion where the lead terminal is inserted into the through hole of the electronic circuit board.

The same object is denoted by the same reference numeral in these figures and in FIG. 3 which has already been described.

The lead terminal 1 of the integrated circuit 2 shown in FIG. 1 (a) has a protrusion 10 and a vertically elongated through hole 11 along the terminal length direction, as shown in FIG. 1 (b). The shape is wedge-shaped with the upper dimension larger than the lower dimension.

The integrated circuit 2 having the lead terminal 1 having such a shape is mounted on the electronic circuit board 3 as shown in FIG.
Is shown in.

As shown in FIG. 2B, since the lead terminal 1 has a wedge shape, it guides the insertion of the electronic circuit board 3 into the through hole, and the conductive portion 4 provided in the through hole. It has the adhesiveness of.

Further, when the lead terminal 1 is pushed into the through hole, the protrusion 10 comes into contact with the upper portion of the conductive portion 4, and the through hole 11 absorbs the inward deflection and repels the adhesive to further improve the adhesion. have.

[0017]

As described above, according to the present invention, it is possible to eliminate the need for soldering work when mounting an integrated circuit on an electronic circuit board. Therefore, work efficiency, quality, and maintainability are improved. An integrated circuit mounting method that can sufficiently contribute to improvement can be provided.

[Brief description of drawings]

1A and 1B are diagrams illustrating a lead terminal according to an embodiment of the present invention, FIG. 1A is an external view of an integrated circuit, and FIG. 1B is a perspective view showing only a lead terminal portion.

FIG. 2 is a diagram showing an embodiment of the present invention, FIG. 2 (a) is a perspective view showing a state in which an integrated circuit is mounted on an electronic circuit board;
2B is a sectional view taken along line AA of FIG.

FIG. 3 is a diagram showing a conventional integrated circuit mounting method;
3A is an external view, and FIG. 3B is a sectional view taken along line BB of FIG.

[Explanation of symbols]

 1 Lead Terminal 2 Integrated Circuit 3 Electronic Circuit Board 4 Conductive Part 5 Solder 6 Lead Terminal 10 Projection 11 Through Hole

Claims (1)

[Claims] 1. A lead terminal of an integrated circuit has a protrusion that comes into contact with an upper portion of a conductive portion provided in a through hole of an electronic circuit board, and the lead terminal has a vertically long through hole along the terminal length direction. , The lead terminal is a wedge-shaped lead terminal having an upper dimension larger than a lower dimension, and the lead terminal is inserted into a through hole of an electronic circuit board to be in close contact with a conductive portion provided in the through hole. A method of mounting an integrated circuit, which is characterized in that the mounting is performed by