JPH04225295A - Method of mounting electronic element and electronic element used therein - Google Patents

Abstract

PURPOSE:To surely insert a lead even when the lead is dislocated from a through hole in a mounting board when an electronic element is inserted into the mounting board by a method wherein the tip part of the lead at the electronic element is worked and formed to be a tapered conical shape. CONSTITUTION:In order to make the length of a lead definite before it is worked, the tip part of a lead 2a is cut perpendicularly or the tip part of a lead 2b is pressed from both side ends and cut. Tip parts of the leads 2a, 2b which have been cut are immersed in a solder solution; after that, they are lifted up. Thereby, a solder forms each conical protrusion 3 at the tip part of each lead 2. The lead 2 is inserted into a through hole 7 formed in a mounting board 6 from the tip of the conical protrusion 3. At this time, even when the lead 2 extended form a package main body 1 is dislocated a little from the through hole 7 in the mounting board 6, the conical face of the conical protrusion 3 at the tip of the lead 2 comes into contact with the edge of the through hole 7, and the lead 2 is slid into the through hole 7 and mounted surely.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention relates to a method for mounting electronic devices on a mounting board, etc., and the electronic devices used therein, and in particular to a technology for preventing lead tips from getting caught during mounting on a mounting board, thereby increasing mounting reliability. Regarding.

0002

2. Description of the Related Art Conventionally, when mounting an electronic element such as a capacitor on a mounting board, as shown in FIG. It was common practice to insert the device into a through hole drilled in the mounting board while the device was in the same state.

0003

[Problems to be Solved by the Invention] In the conventional electronic device leads, as shown in FIG. 7, the leads 32 may be bent, and there may be variations in package assembly or misalignment when drilling through holes in the mounting board. Furthermore, if the package or mounting board is misaligned during the mounting process, when automatically inserting the leads into the mounting board, as shown in Figure 8,
The tip of the lead 32 got caught on the edge of the through hole 37 of the mounting board 36, resulting in a high rate of mounting defects.

The present invention has been made in view of the above-mentioned problems, and even when there is a misalignment between the leads and the through-holes of the mounting board when inserting an electronic element into the mounting board, the leads can be reliably inserted into the mounting board. The purpose is to provide a mounting technology that can be inserted.

[0005]

[Means for solving the problems] The first invention of the present invention is
The tips of the leads protruding from the package body are dipped in a solder solution and pulled up. After forming a tapered conical protrusion on the tip of the lead, the conical protrusion is inserted into the through hole drilled in the mounting board. The method for mounting electronic devices was to insert the leads from the tips of the protrusions.

In a second invention, the tips of the leads protruding from the package body are immersed in a solder solution and then pulled up to form tapered conical protrusions at the tips of the leads to form electronic devices.

[0007] In the third invention, a conical grindstone that rotates at high speed is attached to the tip of the shaft of the second motor, which is erected on a circular base that is rotated at low speed by the first motor. A method for mounting an electronic device, in which the tip of the lead is brought into contact with the conical surface of the grindstone to process the tip into a tapered conical shape, and then the lead is inserted into a through hole formed in a mounting board. And so.

[0008]

[Operation] In the present invention, the tips of the leads of the electronic device are formed into a tapered conical shape. Therefore, when automatically inserting the lead of the electronic element into the mounting board, even if there is a misalignment between the lead and the through hole of the mounting board, the tip of the lead is extremely unlikely to get caught on the edge of the through hole.

[0009]

[Embodiment 1] Embodiment 1 of the present invention will be explained below based on FIGS. 1 to 4.

Example 1 is a lead processing method using solder dipping according to the present invention.

In order to make the length of the lead before processing constant, the tip of the lead 2a is first cut at a right angle as shown in FIGS. 2(a) and (b), or the tip of the lead 2a is cut at a right angle as shown in FIG. 3(a).・(b)
- As shown in (c), the tip of the lead 2b is cut by pressing from both side ends. The cutting shown in FIGS. 2 and 3 is also used to make the tip of the lead, which is oblique before processing, into a substantially horizontal shape.

Next, the tips of the cut leads 2a and 2b are immersed in a solder solution and then pulled up. Then, as shown in FIG. 1, the solder forms a conical protrusion 3 at the tip of the lead 2.

Then, as shown in FIG. 4, the lead 2 is inserted into the through hole 7 formed in the mounting board 6 from the tip of the conical projection 3. At this time, even if there is some misalignment between the leads 2 extending from the package body 1 and the through holes 7 of the mounting board 6, the conical surface of the conical protrusion 3 at the tip of the leads 2 will align with the edge of the through hole 7. When they come into contact, the lead 2 slides into the through hole 7 and is securely mounted.

[0014] After the mounting of electronic elements has been completed, the entire mounting board is immersed in a solder solution, pulled out, and then cleaned. Then, the excess leads protruding from the back side of the mounting board are cut off to create a product.

[0015]

[Embodiment 2] Next, Embodiment 2 will be explained based on FIG. 5. Example 2 is a lead processing method using grinding.

A first shaft 21 is installed at the bottom of the circular base 15.
One end of the first shaft 21 is fitted, and the first motor 16 is connected to the other end of the first shaft 21.

A second motor 17 is installed upright on the upper end of the substrate 15. Further, one end of the second shaft 22 is connected to the upper part of the second motor 17, and a conical grindstone 19 is attached to the other end.

The first motor 16 is driven to rotate the substrate 15 at a low speed via the first shaft 21.
The second motor 17 is driven by the second shaft 22.
The conical grindstone 19 is rotated at high speed through the .

The second motor 17 is an air motor, for example, and is driven by supplying air from a hose 18. The second motor main body 25, which is a hose connection portion of the second motor 17, is formed to be rotatable independently of the base 26 fixed to the base 15.

Then, the package body 11 from which the leads 12 extend is vertically lowered to a position where it abuts the conical surface of the conical grindstone 19. The conical grindstone 19 rotates around the tip of the lead 12 while grinding at high speed,
The tip of the lead 12 is processed into a tapered conical shape.

[0021]Also, by rotating the conical grindstone independently at high speed,
The package body may descend while rotating around the lead, and the tip may be machined into a tapered conical shape.

Furthermore, a grinding wheel having a conical grinding surface on the inside is rotated independently at high speed, and with the package upside down, the tip of the lead is brought into contact with the apex of the cone vertically from below the grinding wheel. The portion may be processed into a tapered conical shape. At this time, the lead grinding chips fall downward and do not clog the apex of the grindstone.

After the tip of the lead 12 is processed into a tapered conical shape, the same process as in Example 1 is followed to form the product into a product.

[0024]

[Effects of the Invention] The present invention provides the tips of the leads of electronic devices.
It was processed and formed into a tapered conical shape by methods such as solder dipping and grinding.

Therefore, when inserting the lead of an electronic device into the mounting board, even if there is some misalignment between the lead and the through hole of the mounting board, the conical part of the processed lead tip will align with the edge of the through hole. The electronic element can be reliably mounted on the mounting board by sliding into contact with the mounting board.

[Brief explanation of the drawing]

FIG. 1 is a front view of an electronic device in Example 1.

FIG. 2(a) is a top view after the lead cutting process in Example 1, and FIG. 2(b) is a front view thereof.

3(a) is a top view of the lead in Example 1 after being separately cut, FIG. 3(b) is a front view thereof, and FIG. 3(c) is a side view thereof.

FIG. 4 is an explanatory diagram showing a state when a lead is mounted on a mounting board in Example 1.

FIG. 5 is an explanatory diagram showing a state in which the lead is ground in Example 2;

FIG. 6 is a front view of a device in the prior art.

FIG. 7 is a side view of a device in the prior art.

FIG. 8 is an explanatory diagram showing a state of a mounting defect in the prior art.

[Explanation of symbols]

1　Package body, 2. Lead, 2a lead, 2b lead, 3 Conical projection, 6 Mounting board, 7 Through hole, 11　Package body, 12. Lead, 15 Foundation, 16 First motor, 17 Second motor, 18 Hose, 19 Conical whetstone, 21 First shaft, 22 Second shaft, 25 Second motor body, 26 base, 31　Package body, 32 lead, 36 Mounting board, 37 Through hole.

Claims (3)

[Claims] Claim 1: The tip of the lead protruding from the package body is dipped in a solder solution and then pulled up, a tapered conical protrusion is formed at the tip of the lead, and then a through hole is drilled in the mounting board. A method for mounting an electronic device in which a lead is inserted from the tip of the conical projection. 2. An electronic device in which the tips of the leads protruding from the package body are immersed in a solder solution and then pulled up to form tapered conical protrusions at the tips of the leads. 3. A conical grindstone that rotates at high speed is attached to the tip of the shaft of a second motor that is erected on a circular base that is rotated at low speed by the first motor, and the conical grindstone of the grindstone that is rotating at high speed is A method for mounting an electronic device, in which the tip of the lead is brought into contact with a surface, the tip of the lead is processed into a tapered conical shape, and then the lead is inserted into a through hole formed in a mounting board.