JPH11297881A - Cutting method of package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable a frame plate where packages are provided to be easily cut into unit packages causing no damage to them. SOLUTION: Insulating protectors 2b which protect parts such as semiconductor devices are provided onto the front surface of a resin plate 2a, and solder ball pins 2c serving as outer connection leads are provided on the rear surface of the resin plate 2a protruding downward, whereby a synthetic resin frame plate 1 mounted with packages 2 is obtained. The synthetic resin frame plate 1 is placed on a holding member 5 composed of a main member 5a and a sub- member 5b placed thereon. The frame plate 1 is held on the holding member 5 inserting the solder ball pins 2c into engaging holes 6 bored in the sub-member 5b, and the packages 2 are separately cut off from the frame plate 1 with rotary blades 11 as the packages 2 are controlled in movement by the holding member 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to cutting and separating packages individually from a frame plate obtained by taking multiple packages of semiconductor elements and the like and mounting the package without damaging the packages without damaging the packages. The present invention relates to a method of cutting a package which can be performed.

[0002]

2. Description of the Related Art With the miniaturization, weight reduction, and multi-functionality of electronic devices, the progress of high density and high efficiency of semiconductor packages used for such devices has been remarkable. For example, a BGA (Ball G) in which the semiconductor element or the like is mounted on the front surface and a large number of small-diameter pins (Pins) serving as leads for external connection are formed on the back surface.
(Rid Array) is being promoted for practical use.

In this BGA, a large number of pins composed of true spherical solder balls made of minute diameter metal balls are densely formed at regular intervals on the back surface of a package as leads for external connection. A bump (Bump) that shares a terminal and a joint is formed, and the package is mounted on a printed circuit board or the like using the bump.

[0004] Such a BGA is actually obtained by cutting multiple packages of a predetermined number of BGAs on a plastic frame plate made of epoxy resin containing glass fiber or the like, and cutting the packages individually from the frame plate thus cut. The product is obtained as a package (hereinafter, referred to as a product). The cutting method includes press punching with a press die device, and mounting the frame on the holding frame member with the mounting surface of each package down. It has been practiced that the package is held in a tightly fitted state in the provided recessed portion and vacuum suction is performed from below, and the periphery of the package is cut by a rod-shaped cutter.

[0005]

When the package is cut and separated from the frame plate, a large number of processes can be performed in a short time by punching with the press die apparatus, but the package itself has a shear resistance due to the impact of the punching. In addition to the risk of cracking due to receiving, when punching the package, burrs occur on the edge near the punched part,
In many cases, all of the pins near the cutting edge are crushed and cannot maintain accurate conductivity, resulting in a problem of a high incidence of defective products.

On the other hand, the method of cutting the frame plate held by the holding frame member with a rod-shaped cutter has few problems such as generation of cracks and burrs. However, in order to stop the movement of the package at the time of cutting. Since each package is closely held in the recess formed in the holding frame member, there is a problem that it is not easy to take out the package after cutting.

In order to solve this problem, an adhesive sheet which can be easily peeled off by ultraviolet irradiation is attached to the lower surface (mounting surface side) of the frame plate, and the cut product is not separated by the adhesive sheet. It is also necessary to remove the adhesive sheet of the product taken out in the connected state by removing it from the holding frame member in the connected state, and peeling it by irradiating ultraviolet rays, but it is necessary for sticking and peeling of such a sheet The time and effort involved are extremely troublesome, and the processing time and costs cannot be ignored.

Further, there is still a problem that it is difficult to sufficiently cope with cutting with a bar-shaped cutter as the size of the package constituted by the BGA is further reduced.

An object of the present invention is to provide a package which can be easily cut and separated from a frame plate without damaging the package even in the case of a reduced package in view of the problem in the conventional method of cutting a package. To provide a cutting method.

Another object of the present invention is to provide a method of cutting a package which can use a very thin disk-shaped rotating blade for cutting the package and can advantageously cut and separate the package from a frame plate. is there.

[0011]

In order to achieve the above object, a method of cutting a package according to the present invention is directed to a method for cutting a solder ball having a small diameter which can be used as a surface for mounting a semiconductor element or the like and a lead for external connection is provided on the back surface. When cutting the packages individually from a synthetic resin frame plate formed by taking multiple packages formed by projecting many pins consisting of
The frame is placed on a holding member such that pins formed on the back surface of the package face downward, and the cutting movement of each package held by the holding member is regulated by the pins and cut. Is what you do.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A package cutting method according to the present invention mounts a frame plate on a predetermined holding member when cutting and separating multiple packages from a frame plate made of a synthetic resin. The greatest feature is that the movement of the package caused at the time of cutting is restricted depending on the pins provided on the back surface of each package and the cutting is performed. As a means for controlling the movement of the package by these pins, for example, This can be achieved by forming insertion holes in the holding member into which all the pins formed in each package can be individually inserted, and inserting all the pins of each package formed in the frame plate into these insertion holes. it can.

As another regulating means, a holding member provided with a recessed portion into which the pins of each package, which has been multi-faced, can be collectively fitted into the frame plate is used, and the holding member is collectively fitted into the recessed portion of the holding member. This can be achieved by making the outer contour of the pin of the package provided close to the peripheral wall of the concave portion of the holding member.

Further, as another restricting means, there is provided a concave portion into which pins formed in each package can be collectively fitted, and three or four pins near the corners of the pins formed in the package are provided in the concave portions. This can be attained by using a holding member having at least two projections which can be inserted between the pins, and inserting the projection of the holding member between the pins near the corners.

The movement of the package depending on these pins is regulated by cutting each package while vacuum-suctioning the package from a vacuum suction hole provided through the holding member. And a more reliable cutting can be achieved.

When cutting each package from the frame plate, a disk-shaped rotating blade can be used.
Dust such as cuttings generated at the time of cutting can be cut while being discharged to the outside through dust collecting holes separately provided in the holding member.

[0017]

According to the method of cutting a package of the present invention, when mounting a frame made of a synthetic resin, in which a package made of BGA is multi-faced, on a holding member, a plurality of pins formed of a plurality of solder balls protruding from the back of each package are formed. By mounting the frame on the holding member so as to protrude into the holding member, the cutting movement is regulated by direct or indirect engagement between the pin protruding from the back surface of each package and the holding member. This package cuts the package, which reduces the movement of the package during cutting compared to the conventional cutting method, in which cutting by pressure punching or cutting is performed by tightly holding and mounting the mounting surface of the surface in the recess provided in the holding frame member. Steady sealing enables more reliable cutting.

[0018]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a package cutting method according to an embodiment of the present invention.
FIGS. 4 to 6 show an example of a synthetic resin frame plate applied to the package cutting method of the present invention.
Are made of a glass fiber-containing epoxy resin plate, and nine packages 2, 2,.

Each package 2 formed on the frame plate 1
Are a resin plate portion 2a and an insulating protection portion 2 in which a component such as a semiconductor device is mounted on the upper surface of the resin plate portion 2a for insulation protection.
b (see FIGS. 4 and 6) and a pin 2c (see FIGS. 5 and 5) formed of a large number of solder balls serving as leads for connecting devices provided on the lower surface of the resin plate portion 2a to the outside. 6).

As shown in FIG. 4, linear cutting marks 3, 3... For cutting each package 2 are formed on the outer peripheral portion of the surface of the frame plate 1. Are also formed at appropriate intervals in the part to be cut, and these cutting marks 3, 4 are captured by a camera when cutting with a disk-shaped rotating blade described later. It is configured to automatically disconnect.

FIG. 1 shows the frame plate 1 and a holding member 5 for holding the frame plate 1 and individually cutting each of the packages 2, 2... It is composed of a main member 5a serving as a base and a sub member 5b placed on the upper surface of the main member 5a.

Each of the sub-members 5b has a package 2
, So that all of the pins 2c formed therein can be individually inserted.
. Are penetrated from the front surface to the back surface, and dust collecting holes 7, 7,... Are appropriately formed in portions corresponding to the cut portions of the package 2 (portions corresponding to the cutting marks 4).

The other main member 5a includes all the engaging holes 6 of the pins 2c formed in the sub member 5b at the regular positions of the sub member 5b mounted on the upper surface, and the package is formed by vacuum suction. 2 has a single concave portion 8 having a wide opening area for holding the nozzle 2 and a suction hole 9 communicating with the concave portion, and communicates with a dust collecting hole 7 formed in the sub-member 3b to direct dust downward. A dust collecting hole 10 for sucking the air is separately provided.

Each package 2, 2,...
When cutting the package 2, all the pins 2 c, 2 c,... Formed on the back surface of each package 2 are inserted into the respective engagement holes 6, 6,... Of the sub-member 5 b placed on the main member 5 a. Are inserted individually to hold the frame plate 1 on the sub-member 5b.
When the cutting is performed, the movement in the horizontal direction is mainly regulated at the time of cutting, and is held by the holding member 5.

At the same time, the frame plate 1 is suctioned by a vacuum suction device (not shown) from the recess 8 formed in the main member 5a through the suction hole 9, and is held mainly so that the package 2 does not rise and fall during cutting. You.

After that, the packages 2, 2,... Are cut from the frame plate 1 by the disk-shaped rotary blade 11, and the cutting is performed by the cutting marks 3, 4 formed on the frame plate 1 as described above. Is cut by a camera and cut automatically, so that each package 2 can be cut reliably without damage. The cutting of the package can be achieved by other appropriate means instead of the automatic cutting of the cutting marks 3 and 4 by a camera.

FIG. 2 shows another holding member used in the cutting method of the present invention. The holding member 21 is composed of a single holding member and has a large number of pins 2c formed on the back surface of the package 2. And a pair of engaging pins 23, 23 at the bottom near at least a pair of diagonal corners of the four corners of the concave 22. Is provided.

In the center of the concave portion 22 of the holding member 21, a vacuum suction hole 24 communicating with a vacuum suction device (not shown) is provided.
And a dust collecting groove 25 is formed surrounding the outer periphery of the concave portion 22, and the bottom of the groove 25 communicates with a dust collecting hole (both not shown) connected to the dust collecting device. Is what it is.

As shown in FIG. 3, the engaging pins 23 provided in the recess 22 are formed of four pins 2c near the opposing corners among a large number of pins 2c formed on the back surface of the package 2. .. Are inserted between them.

The package is cut by the holding member 21 such that the pins 2c formed on the back surface of each package 2 of the frame plate 1 face down so that the pins 2c are collectively fitted into the recesses 22. Set the frame board 1 to
By inserting a pair of engaging pins 23 formed in the recessed portion 22 between the four pins 2c, 2c,... In the vicinity of the opposed corners, the package 2 mainly moves in the horizontal direction during cutting. In addition, the vacuum suction through the vacuum suction hole 24 prevents ups and downs mainly in the vertical direction, and the cutting can be surely performed by the same rotary blade as described above.

The movement of the package 2 is regulated by the pins 2c and the engaging pins 23 by inserting the engaging pins 23 between the four pins 2c, 2c as described above. However, the engagement pin 23 may be inserted between the three pins 2c.
May be provided at two or more locations of a large number of pins 2c formed collectively.

Although not shown, as another method similar to the cutting method shown in FIGS. 2 and 3, the holding member 21 shown in FIG.
Can be collectively fitted without forming the engaging pins 23 in the recessed portion 22 of the package 2 shown in FIG. However, by narrowing the inner peripheral wall of the concave portion 22 so as to approach each of the pins 2c, 2c,... Formed on the outermost periphery, the inner peripheral wall depends on the outer periphery of the collectively formed pins 2c. Thereby, the movement of the package at the time of cutting is regulated, and the same cutting as described above can be performed.

In each of these cutting methods, the vacuum suction device for sucking and holding the package is turned on when the package is cut, sucks the package in vacuum, and turned off when the cut product is taken out from the holding member. By performing such an operation, workability can be improved.

[0034]

The method for cutting a package according to the present invention comprises:
When individually cutting and separating each package from a synthetic resin frame plate obtained by taking multiple packages of GA, a plurality of solder balls protrudingly formed on the back surface of each of the packages on a holding member having a specific structure have downward pins. It is placed in such a manner that the movement of the package caused at the time of cutting is regulated by directly or indirectly engaging the holding member and the pin provided on each package,
This enables reliable cutting without complicated work.

In particular, according to the method for cutting a package of the present invention, it is easy to cut a package which is reduced in size in combination with the use of an extremely thin disk-shaped rotating blade, and the electronic device in the age of lighter, thinner and smaller size. It is excellent in that a package used corresponding to the type can be obtained with high yield.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view of a frame plate and a holding member showing an example of a method of cutting a package according to the present invention.

FIG. 2 is a perspective view of a holding member used in another cutting method of the package of the present invention.

FIG. 3 is a rear view showing a part of a frame plate applied to the holding member of FIG. 2;

FIG. 4 is a plan view showing an example of a frame plate applied to the package cutting method of the present invention.

FIG. 5 is a rear view of the frame plate of FIG. 4;

FIG. 6 is a longitudinal sectional view of the frame plate of FIG. 4;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Frame plate 2 Package 5, 21 Holding member 5a Main member 5b Sub member 11 Rotating blade

Claims (6)

[Claims] 1. A package made of a synthetic resin formed by forming a plurality of packages, each having a surface on which a mounting surface of a semiconductor element or the like is mounted and a large number of pins formed of solder balls having a small diameter which can be used as leads for external connection projected on the rear surface. When individually cutting the packages from the frame plate, the frame is placed on a holding member such that the pins formed on the back surface of the package face down, and the movement of each package held by the holding member when cutting is performed. A method for cutting a package, characterized in that cutting is performed while being restricted by pins. 2. The cutting of the packages is such that the movement of each package held by the holding member is regulated by the pins, and each package is cut by vacuum suction through a vacuum suction hole provided in the holding member. The method for cutting a package according to claim 1, wherein: 3. The holding member is formed with insertion holes into which all of the pins formed on each package can be individually inserted, and pins are inserted into these insertion holes to hold each package on the holding member. 3. The method of cutting a package according to claim 1, wherein the movement of the package at the time of cutting is regulated. 4. The package for cutting when the holding member is provided with a recessed portion into which the pins formed in each package are fitted collectively, and the peripheral wall of the recessed portion is brought close to the outer contour of the fitted pin. 3. The method for cutting a package according to claim 1, wherein the movement of the package is regulated. 5. The holding member is provided with a concave portion into which the pins formed in each package are fitted at once, and three or four of the pins near the corners of the pins formed in the package are provided in the concave portions. At least two protrusions that can be inserted between the pins are formed, and these protrusions are inserted between the pins near the corners to regulate the movement of the package at the time of cutting. The method for cutting a package according to claim 1. 6. The package cutting method according to claim 1, wherein the cutting is performed by a disk-shaped rotating blade.