JPH1140523A - Substrate cutting device and substrate cutting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate cutting device and a substrate cutting method, which can prevent generation of resin scrap and thermal damage due to delaminataion and cutting between mold resin and a substrate in a semiconductor packing, and can perform discrete dicing for a compact package such as a CSP from a substrate without lowering producibility. SOLUTION: In a division/alignment mechanism part 10 of a substrate 7 having a plurality of packages 8 which contract due to influence of heat treatment in a preceding process, etc., and whose pitch is not constant, a break is formed in an arbitrary position between the packages 8 for correcting a position of the package 8. After a plurality of packages 8 are positioned simultaneously, an area near a peripheral pole of the package 8 is cut by using laser beam 2 and a plurality of packages 8 are continuously subjected to discrete dicing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to, for example, a plurality of ICs formed on a single substrate, particularly, a CSP (Chip Sca).
More specifically, the present invention relates to a substrate cutting apparatus and a cutting method used for separating a small package such as an IE Package).

[0002]

2. Description of the Related Art In recent years, portable devices such as a camera-integrated VTR and a portable telephone have become widespread. In order to meet the demand for downsizing these devices, it is necessary to reduce the size and thickness of LSI packages. Therefore, a CSP (Chip) in which a package is downsized to almost the same size as a bare chip of an LSI.
Scaie Package) is being developed by LSI manufacturers. Especially, connect the chip to the tape substrate such as polyimide or glass epoxy by wire bond, mold,
The manufacturing method of separating the tape substrate into individual pieces after attaching the solder balls is characterized by utilizing the conventional assembly technology and realizing a small package, and is being mass-produced most. 2. Description of the Related Art Conventionally, as a method of separating and separating individual packages from a substrate, there are a roller cutter method, a punching method using a die, a sharing method, a push cutting method using upper and lower flat blades, and the like.

[0003]

As described above, as a method of separating an individual package from a single substrate, several methods have conventionally been proposed. However, in order to prevent delamination in which the mold resin and the substrate are separated from each other in the separated pieces, it is necessary to cut the package at a position away from the end of the package, and the outer shape of the package cannot be sufficiently reduced in size. Further, there is a problem that resin scraps are generated by cutting. In addition, in order to form a large number of small packages in a short time, it is necessary to singulate a substrate on which a plurality of packages are formed with high precision. Because the pitch between the packages is not constant due to the shrinkage of the substrate due to
In order to perform the singulation processing with high accuracy, it is necessary to perform the singulation processing after recognizing the position of each package, and there has been a problem that the productivity is reduced. In addition, in the singulation process using a laser beam, since processing is performed by thermal energy, the package is contaminated by causing thermal damage to the package or attaching dusts such as carbon generated during the processing. There was such a problem.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and can prevent the occurrence of resin debris and thermal damage due to delamination or cutting between a mold resin and a substrate, as well as lowering productivity. CPS without letting
It is an object of the present invention to provide a substrate cutting apparatus capable of processing a small package such as a single package from a substrate. It is another object of the present invention to provide a substrate cutting method suitable for this apparatus.

[0005]

SUMMARY OF THE INVENTION A substrate cutting apparatus according to the present invention corrects the position of a component after forming a cut between each component of a substrate on which a plurality of components are formed or after dividing each component. The apparatus includes an alignment mechanism for aligning, a transporting means for a substrate having a plurality of aligned components, and a laser processing unit for applying a laser beam to the substrate having a plurality of aligned components. The board has holes formed on both sides in the short direction of the board corresponding to each component. The alignment mechanism includes a substrate cutting jig and an alignment jig provided with pins corresponding to holes formed in the substrate at predetermined positions. The substrate cutting jig is a contact-type cutting jig. The pin provided on the alignment jig has a tapered shape with a sharp end. The laser processing unit includes a stage that can be moved horizontally, a holding jig that is set on the stage and holds a substrate having a plurality of aligned components, and a laser on the substrate held by the holding jig. A laser oscillator for emitting a beam,
The apparatus is provided with a nozzle for ejecting a gas to be blown to a laser beam irradiation unit. Further, the holding jig is provided with a projection at a position corresponding to the pin provided on the alignment jig. Further, the substrate has metal wiring formed on one surface and solder balls provided on the other surface, and the surface on which the metal wiring is formed is irradiated with a laser beam from the surface on which the metal wiring is formed. The substrate is configured to be sucked and held by the holding jig from the side. Further, a concave portion corresponding to the solder ball is provided on a contact surface of the holding jig with the solder ball. further,
The contact surface of the holding jig with the solder ball is made of the same material as that of the substrate. Further, the holding jig is cut out in a tapered shape according to the traveling direction of the laser beam so as not to interfere with the laser beam passing through the substrate. In addition, a suction exhaust hole is provided in a peripheral portion of the holding jig, and a mechanism for forcibly discharging dust generated by laser beam irradiation is provided. Further, the nozzle for ejecting the gas to be sprayed to the laser beam irradiation section ejects the gas coaxially with the laser beam. The laser processing unit includes a plurality of nozzles for ejecting a gas to be blown to a peripheral portion of a part to be cut by irradiation with a laser beam. The laser processing unit includes an optical system that divides a laser beam emitted from a laser oscillator into a plurality of laser beams and irradiates the laser beam onto a substrate.

Further, the method of cutting a board according to the present invention includes a step of forming a cut between components of a board on which a plurality of components are formed or a step of dividing each component, and a process of correcting and aligning the positions of the components. Moving the substrate having a plurality of aligned components to a holding jig on a stage capable of horizontal movement at the same time; and blowing a gas onto the substrate held by the holding jig and irradiating the component with a laser beam. It includes a step of singulation. In addition, the position of the component is corrected by forming a cut between the components and fitting holes provided on both sides of the component to pins provided at predetermined positions of the alignment jig. Alternatively, the position of the component is corrected by dividing the components, raising the alignment jig having pins at predetermined positions, and inserting the pins into holes provided on both sides of the component. Alternatively, the position of the component is corrected by inserting the tip of a tapered pin having a pointed end provided at a predetermined position of the alignment jig into a hole provided on both sides of the component. This is performed by dividing the substrate and sliding down the divided substrate along the tapered pins. In addition, the laser beam emitted from the laser oscillator is divided into a plurality of beams, and the substrate is irradiated with the laser beam a plurality of times by an optical system that irradiates the substrate with the laser beam, so that the components are singulated.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1 FIG. Hereinafter, a substrate cutting apparatus according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic diagram showing a configuration of a substrate cutting apparatus according to Embodiment 1 of the present invention. In the figure, 1 is a laser oscillator, 2 is a laser beam emitted from the laser oscillator 1, 3 is a reflection mirror that reflects the laser beam 2 emitted from the laser oscillator 1 to change the traveling direction, 4 is a condenser lens, Is a movable stage,
Reference numeral 6 denotes a holding mechanism on the movable stage 5, reference numeral 7 denotes a substrate on which a package 8, which is a plurality of components, is formed, reference numeral 9 denotes a divided substrate obtained by dividing the substrate 7 into units of packages 8, and reference numeral 10 denotes substrate 7 by units of packages 8. A dividing / aligning mechanism for dividing the package 8 on the divided substrate 9 and aligning the divided substrate 9 so that the package 8 is arranged at a predetermined position, and a nozzle 11 for ejecting gas. . FIG. 2 is a plan view showing the division / alignment mechanism unit 10. In the drawing, reference numeral 12 denotes a holding unit for holding the substrate 7 of the dividing / aligning mechanism unit 10, 13 denotes a contact-type cutting jig such as a roller cutter, 14 denotes a cut formed on the substrate 7 by the cutting jig 13, 15 Is a hole provided in the substrate 7 corresponding to each package 8, 16a is an alignment jig having a plurality of pins 17a at predetermined positions, and the pin 17a is smaller than the diameter of the hole 15 provided in the substrate 7. Have a diameter.

The substrate 7 having a plurality of packages 8 contracts due to the influence of the heat treatment in the previous process, and the pitch between the packages 8 is not constant. Therefore, in order to singulate the package 8 with high precision, first,
It is necessary to correct and align the position of the package 8. In addition, the shrinkage of the substrate 7 due to the influence of the heat treatment in the previous process is generally large in the longitudinal direction of the substrate and small enough to be ignored in the short direction. Therefore, by forming the holes 15 provided corresponding to the respective packages 8 at predetermined positions on the both sides of the package 8 in the short direction of the substrate 7, the positional relationship between the paired package 8 and the hole 15 is improved. , Regardless of the contraction of the substrate 7.

Next, cutting of a substrate by the substrate cutting apparatus of the present embodiment will be described. First, as shown in FIG. 2, a substrate 7 having a plurality of packages 8 which contract due to the influence of a heat treatment in a previous process and have a non-uniform pitch is arranged on a holding unit 12 of a division / alignment mechanism unit 10 and cut. An arbitrary position between the packages 8 is cut by the jig 13 from both ends in the short direction to sides opposite to each other alternately to a portion leaving a predetermined length from an end of the side, and is held by the holding unit 12. Cuts 14 are formed between the packages 8 on the substrate 7 thus formed. Next, the substrate 7 on which the cuts 14 are formed is vacuum-sucked by a robot or the like (not shown) and transported to an alignment jig 16a having pins 17a, and the holes 17 provided in the substrate 7 are inserted into the pins 17a. By fitting, the divided substrates 9 are aligned. At this time, since the cuts 14 are formed in the substrate 7 and can extend in the longitudinal direction, the holes 15 provided on both sides of the package 8 can be fitted into the pins 17a provided at predetermined positions. Each package 8 is corrected by correcting the shrinkage of the substrate 7 in the longitudinal direction due to the influence of heat treatment or the like.
Can be accurately arranged at predetermined positions. Next, all the divided substrates 9 positioned by the pins 17a of the alignment jig 16a of the division / alignment mechanism unit 10 are simultaneously vacuum-adsorbed by a robot or the like (not shown) in the same state.
It is arranged on the holding mechanism 6 on the movable stage 5. Note that the divided substrate 9 is divided by the holding mechanism 6 into the dividing / aligning mechanism 10.
Is held by a holding jig (not shown) having a protruding portion at a position corresponding to the pin 17a provided on the alignment jig 16a, thereby preventing displacement. The diameter of the projection provided on the holding jig is the same as that of the hole 1 provided on both sides of the package 8.
5 smaller than the diameter.

Next, the laser beam 2 emitted from the laser oscillator 1 and condensed by the condensing lens 4 is applied to the divided substrate 9 positioned and held with high precision by the holding mechanism 6 on the moving stage 5. In this state, the movable substrate 5 is moved in accordance with preprogrammed information, so that the divided substrate 9 is cut in the vicinity of the periphery of the package 8,
A plurality of packages 8 are continuously singulated. When cutting the divided substrate 9 by irradiating the laser beam 2,
By blowing a gas (assist gas) from the nozzle 11 to the cutting portion to remove the combustion melt generated in the cutting portion, the cutting speed is increased. The irradiation of the laser beam 2, the blowing of gas from the nozzle 11, and the movement of the movable stage 5 are controlled by one control system according to information input in advance (the control system is not shown). In addition, as the laser oscillator 1 serving as a heat source for dividing the package 8 into pieces, a CPS (Chip Scaie Package), which has been frequently used as a small package in recent years, has a substrate material such as a polyimide resin or a glass base epoxy resin. A resin tape is used, and a metal wiring made of Cu or the like is formed on the surface thereof. It is necessary to cut the resin tape on which the metal wiring is formed. Wave (wavelength: λ = 0.
532, 0.266 μm, etc.), and a carbon dioxide gas (CO ₂ ) laser (wavelength: λ = 10.6 μm) which can take out a large output power and has a high absorptivity to resin. In FIG. 2, the number of packages 8 provided on the substrate 7 is three for simplification of the drawing, but the number is not limited to three. Further, the cutting jig 1 of the division / position alignment mechanism unit 10
3 may be a knife or a mold.

According to the present invention, the substrate 7 having a plurality of packages 8 which contract due to the influence of the heat treatment in the previous process and have a non-constant pitch can be divided between the packages 8 by the dividing / position alignment mechanism 10. The position of the package 8 is corrected by forming a cut 14 at the position of the package 8, and the plurality of packages 8 are simultaneously positioned. Is continuously singulated. For this reason, in the cutting of the substrate 7 in the division / alignment mechanism unit 10, there is a sufficient space between the adjacent packages 8, and therefore, even if the substrate 7 is cut by the contact method, the mold resin of the package 8 and the substrate are separated. There is no problem such as an adverse effect on the package 8 due to delamination or generation of resin chips.
Further, since the plurality of packages 8 are positioned simultaneously and with high precision, the plurality of packages 8 can be continuously divided into individual pieces, and the individual pieces of the packages 8 can be processed with high precision and in a short time. Can be.

Embodiment 2 FIG. FIG. 3 is a perspective view of a dividing / aligning mechanism of a substrate cutting apparatus according to a second embodiment of the present invention. In the drawing, reference numeral 18 denotes a receiving portion of the cutting jig 13;
Reference numeral b denotes a position alignment jig provided below the substrate 7 held by the holding unit 12 so as to be individually movable in correspondence with each package 8, and all the alignment jigs 16b of the division / alignment mechanism unit 10 Is positioned with high precision. 17b is a pin provided at a predetermined position of the alignment jig 16b, and has a diameter smaller than the diameter of the hole 15 provided on both sides of the package 8. The other configuration is the same as that of the first embodiment, and the description is omitted.

Next, division of the substrate 7 by the division / alignment mechanism 10 of the substrate cutting apparatus of the present embodiment and division of the substrate 9
Will be described. First, as shown in FIG. 3A, the substrate 7 having a plurality of packages 8 that contract due to the influence of the heat treatment in the previous process and have an irregular pitch.
Is arranged on the holding section 12 of the division / alignment mechanism section 10, and an arbitrary position between the packages 8 is cut by the cutting jig 13. Next, as shown in FIG. 3 (b), the divided substrate 9 divided by the cutting jig 13 is
b is provided at a predetermined position on the divided substrate 9.
Is inserted into the holes 15 provided on both sides of the package 8, the position of the divided substrate 9 is corrected, and the package 8 is positioned with high precision on the alignment jig 16b. Thereafter, all the packages 8 on the substrate 7 held by the holding unit 12 of the division / alignment mechanism unit 10 are sequentially divided and positioned by the pins 17b of the alignment jig 16b. Next, all the divided substrates 9 positioned by the pins 17b of the alignment jig 16b of the division / alignment mechanism section 10 are simultaneously vacuum-adsorbed by a robot or the like (not shown) in the same state, and are placed on the movable stage 5. It is arranged on the holding mechanism 6. After that, the package 8 is singulated by the same method as in the first embodiment.

According to the present embodiment, the substrate 7 having a plurality of packages 8 which are shrunk due to the heat treatment in the previous process and have a non-uniform pitch is divided by the dividing / aligning mechanism 10 between the packages 8. After cutting at an arbitrary position, the position of the package 8 is corrected by inserting the pins 17b provided on the alignment jig 16b into the holes 15 provided at both ends of the package 8, and the plurality of positioned packages 8 are inserted. Can be simultaneously and highly accurately positioned and arranged on the holding mechanism 6 on the movable stage 5 that singulates the package 8 with the laser beam 2, so that the same effect as in the first embodiment is obtained. be able to.

Embodiment 3 FIG. 4 is a perspective view of a dividing / aligning mechanism of a substrate cutting apparatus according to Embodiment 3 of the present invention. FIG. 5 is a perspective view showing an alignment jig of the division / alignment mechanism. In the drawing, reference numeral 16c denotes an alignment jig having a tapered pin 17c at a predetermined position. The alignment jig of the substrate 7 is accurately positioned so that the tip of the pin 17c enters the hole 15 provided in the substrate 7 held by the holding unit 12. It is positioned and positioned below with high precision. The other configuration is the same as that of the first embodiment, and the description is omitted.

Next, division of the substrate 7 by the division / alignment mechanism 10 of the substrate cutting apparatus of the present embodiment and division of the substrate 9
Will be described. First, the substrate 7 having a plurality of packages 8 which are shrunk due to the heat treatment in the previous process and have a non-uniform pitch is separated from the package 7 by a tip of a pin 17c provided on an aligning jig 16c of the dividing / aligning mechanism unit 10. Arranged in the holding portion 12 so as to enter the holes 15 provided on both sides, and an arbitrary position between the packages 8 is cut by the cutting jig 13. The divided substrate 9 divided by the cutting jig 13 slides down along the pins 17c having a tapered shape, and the package 8 on the divided substrate 9 is moved to the position alignment jig 16c.
Is positioned with high precision. Thereafter, all the packages 8 on the substrate 7 held by the holding unit 12 of the division / alignment mechanism unit 10 are sequentially split and positioned by the pins 17c of the alignment jig 16c. Next, the divided substrate 9 positioned by the pins 17c of the alignment jig 16c of the division / alignment mechanism unit 10
Are vacuum-adsorbed simultaneously by a robot or the like (not shown) in the same state, and are arranged in the holding mechanism 6 on the movable stage 5. After that, the package 8 is singulated by the same method as in the first embodiment.

According to the present embodiment, the substrate 7 having a plurality of packages 8 which are shrunk due to the influence of heat treatment in the previous step and have a non-uniform pitch is divided by the division / alignment mechanism 10 between the packages 8. After cutting at an arbitrary position, the divided substrate 9 is cut into the holes 15 provided at both ends of the package 8.
Pin 1 of the alignment jig 16c inserted into the
The position of the package 8 is corrected by sliding the package 8 down along 7c, and the plurality of positioned packages 8 are simultaneously transferred to the holding mechanism 6 on the movable stage 5 that separates the packages 8 by the laser beam 2. In addition, since the positioning can be performed with high accuracy, the same effect as in the first embodiment can be obtained.

Embodiment 4 FIG. 6 is a cross-sectional view of a mechanism for holding a divided substrate in a laser processing unit of a substrate cutting apparatus according to Embodiment 4 of the present invention. In the drawing, reference numeral 6b denotes a holding jig for holding the divided substrate 9 of the holding mechanism 6, reference numeral 20 denotes a metal wiring formed on the divided substrate 9, and reference numeral 21 denotes the divided substrate 9.
The resin substrate 22 is a solder ball provided on the back side of the divided substrate 9 (the side opposite to the surface on which the package 8 and the metal wiring 20 are formed), and 23 is a holding jig for vacuum-sucking the divided substrate 9. It is a pipe provided in the tool 6b. Note that the other configuration is the same as any one of the first, second, and third embodiments, and a description thereof will not be repeated.

The divided substrate 9 having the package 8 positioned with high precision in the division / alignment mechanism section 10 is provided with a metal wiring on a holding jig 6b on the movable stage 5, which is singulated by irradiation with the laser beam 2. The surface on which the substrate 20 is formed is arranged upward, vacuum-adsorbed, and
Is held only at the central portion on the rear surface side of the divided substrate 9 so as not to damage the substrate. In this state, the laser beam 2 is irradiated from above, and the divided substrate 9 is cut in the vicinity of the periphery of the package 8 to singulate the package 8. When the phenomenon in the depth direction of the cutting at the time of cutting the divided substrate 9 is microscopically observed, the resin substrate 21 is cut after cutting the metal wiring 20 that requires more cutting energy by the laser beam 2 than the resin substrate 21. The package 8 can be singulated from the divided substrate 9 with less irradiation energy than when the metal wiring 20 is cut after the substrate 21 is cut.

According to the present embodiment, the divided substrate 9 is cut by irradiating the laser beam 2 from the side on which the metal wiring 20 is formed while holding the surface on which the solder balls 22 are provided by suction. With this, the package 8 can be divided into individual pieces with less irradiation energy.
Thermal damage to the substrate can be reduced.

Embodiment 5 In the fourth embodiment, the divided board 9 is held by the holding jig 6b only at the central portion on the back side of the divided board 9 so as not to damage the solder balls 22.
As shown in FIG. 7, by providing a concave portion 24 corresponding to the solder ball 22 on a contact surface of the holding jig 6c with the solder ball 22 provided on the divided substrate 9, the divided substrate 9 and the holding jig are provided. Since the contact surface with the solder ball 22 is not limited to the position where the solder ball 22 is formed, the divided substrate 9 can be connected without depending on the number and the formation area of the solder ball 22 provided on the package 8 and without damaging the solder ball 22. Since the contact surface with the holding jig 6c can be secured and the divided substrate 9 can be held by the holding jig 6c from the solder ball 22 side, the same effect as in the fourth embodiment can be obtained. The recess 2 shown in FIG.
The number of 4 and the formation region are not limited thereto.

Embodiment 6 FIG. In the fourth embodiment, the divided board 9 is held by the holding jig 6b only at the central portion on the back side of the divided board 9 so as not to damage the solder balls 22.
As shown in FIG. 8, by providing a member 25 of the same material as the resin substrate 21 which is the substrate material of the divided substrate 9 on the contact surface of the holding jig 6 d with the solder ball 22 provided on the divided substrate 9, Since the contact surface between the divided substrate 9 and the holding jig 6d is not limited to the position where the solder ball 22 is formed, the solder ball 2
Even when 2 is formed on the entire surface, the divided substrate 9 can be held by the holding jig 6d from the solder ball 22 side without damaging the solder ball 22, and the same effect as in the fourth embodiment can be obtained. Can be Note that the member 25 may be provided with a concave portion 24 corresponding to the solder ball 22.

Embodiment 7 FIG. 9 is a sectional view of a holding mechanism of a laser processing section of a substrate cutting apparatus according to Embodiment 7 of the present invention. In the figure, reference numeral 6e denotes a holding jig which is cut out in the lower direction so as not to interfere with the laser beam 26 penetrating the divided substrate 9 when the laser beam 2 is irradiated. Note that the other configuration is the same as any one of the first, second, and third embodiments, and a description thereof will not be repeated.

In the step of cutting the divided substrate 9 by the laser beam 2, the laser beam 2 condensed by the condensing lens 4 cuts through the divided substrate 9 and, when the light advances, its beam diameter increases as the light progresses. . By using the holding jig 6e that is cut out downward so as not to hit the expanded laser beam 26, it is possible to prevent the temperature of the holding jig 6e from rising due to the laser beam 26 hitting. In addition,
Solder ball 22 provided on divided substrate 9 and holding jig 6e
The structure of the contact portion with the holding jig may be any of the holding jigs 6b, 6c and 6d shown in the fourth, fifth and sixth embodiments.

According to the present embodiment, the holding jig 6e is cut downward so as not to hit the laser beam 26 that has cut and pierced the divided substrate 9, thereby preventing the temperature of the holding jig 6e from rising. Thermal damage of the package 8 in contact with the holding jig 6e can be reduced. Further, a cooling mechanism provided for the purpose of reducing thermal damage to the package 8 due to a rise in the temperature of the holding jig 6e can be omitted.

Embodiment 8 FIG. FIG. 10 is a sectional view of a holding mechanism of a laser processing unit of a substrate cutting apparatus according to Embodiment 8 of the present invention. In the figure, reference numeral 27 denotes a frame installed so as to surround the periphery of the holding jig 6e, and has a through hole 28 for evacuation. Note that the other configuration is the same as any one of the first, second, and third embodiments, and a description thereof will not be repeated. Further, holding jig 6e may have any structure of holding jigs 6b, 6c and 6d shown in the fourth, fifth and sixth embodiments.

In the step of cutting the divided substrate 9 by the laser beam 2, when cutting the metal wiring 20 or the resin substrate 21 by the laser beam 2, dust such as carbon is generated. The frame 27 is placed so as to surround the periphery of the holding jig 6e, and a vacuum is drawn through a through hole 28 formed in the frame 27, and these dusts are discharged from the area where the cutting process is performed.

According to the present embodiment, the frame 27 is provided so as to surround the holding jig 6e for holding the divided substrate 9 during the laser processing, and the through hole 28 formed in the frame 27 is provided.
By discharging the dust generated when cutting the divided substrate 9 through the, the dust can be prevented from adhering to the package 8 and contaminating the package 8.

Embodiment 9 FIG. 11 is a sectional view of a laser processing part of a substrate cutting apparatus according to Embodiment 9 of the present invention. In the drawing, reference numeral 29 denotes a nozzle which is coaxial with the laser beam 2 and blows an assist gas 30 to the cut portion of the divided substrate 9 by the laser beam 2, and 31 denotes an end of the package 8 near the cut portion of the divided substrate 9 by the laser beam 2. The nozzle blows the gas 32 in the direction. The other configuration is the same as that of the eighth embodiment, and the description is omitted.

In the step of cutting the divided substrate 9 by the laser beam 2, an assist gas 30 that contributes to a high-speed cutting process is blown from a nozzle 29 to the cut portion of the divided substrate 9. Since the assist gas 30 needs to be blown perpendicular to the cut surface so as not to have anisotropy, and needs to be blown to the cutting portion by the laser beam 2,
The nozzle 29 is configured so that the assist gas 30 can be ejected coaxially with the laser beam 2. In addition, the nozzle 31
Are installed corresponding to the periphery of the package 8 and only from the nozzle 31 corresponding to the portion where the cutting process is performed.
The gas 32 is blown out toward the end of the package 8 in the vicinity of the cutting portion to prevent the dust from adhering to the package 8 due to the cutting process. Further, the gas 3 ejected from the nozzle 31
The dust particles blown out by 2 are discharged through a through-hole 28 formed in a frame 27 provided to surround the periphery of the holding jig 6e.

According to this embodiment, at the time of laser processing,
By ejecting the assist gas 30 from the nozzle 29 coaxially with the laser beam 2, it is possible to remove the combustion melt generated in the cutting portion and to increase the cutting speed. Also,
A plurality of nozzles 31 for ejecting the gas 32 toward the end of the package 8 in the vicinity of the cutting portion are provided in correspondence with the periphery of the package 8 to prevent dust from adhering to the package 8 due to the cutting process. I do. Further, the nozzle 31
The dust particles blown off by the gas 32 ejected from the
By discharging the dust through a through hole 28 formed in a frame 27 provided so as to surround the holding jig 6e, the dust is more effectively prevented from adhering to the package 8.

Embodiment 10 FIG. FIG. 12 is a sectional view of a laser processing portion of a substrate cutting apparatus according to Embodiment 10 of the present invention. In the figure, 3a reflects the laser beam 2 emitted from the laser oscillator 1 by 50% and the remaining 50%.
%, A total reflection mirror for reflecting the transmitted light from the partial reflection mirror 3a, a condensing lens for condensing the laser beam 2a reflected by the partial reflection mirror 3a on the cutting portion, Reference numeral 4b denotes a condenser lens for condensing the laser beam 2b reflected by the total reflection mirror 3b on the cutting portion, and the reflection mirrors 3a, 3b and the condenser lenses 4a, 4b are fixed and condensed at predetermined positions. The irradiated laser beams 2a and 2b are irradiated. , 9
Reference numerals a and 9b denote divided substrates on which the packages 8a and 8b are formed, and reference numeral 33 denotes a dummy substrate. The other configuration is the same as that of any of the above embodiments, and the description is omitted.

Divided substrate 9 by laser beams 2a, 2b
a and 9b, first, the partial reflection mirror 3a
When the laser beam 2a reflected by the laser beam and condensed by the condenser lens 4a is irradiated on the dummy substrate 33,
The laser beam 2b reflected by the total reflection mirror 3b and condensed by the condenser lens 4b is applied to a divided substrate 9a arranged next to the dummy substrate 33, and the divided substrates 9a, 9
By moving the movable stage 5 on which b is mounted,
A laser beam 2b is irradiated around the package 8a.
Next, the movable stage 5 on which the divided substrate 9 is mounted is moved,
The divided substrate 9a is irradiated with the laser beam 2a reflected by the partial reflection mirror 3a and collected by the condenser lens 4a, and the laser beam 2b reflected by the total reflection mirror 3b and collected by the condenser lens 4b is The laser beams 2a and 2b are irradiated around the packages 8a and 8b by moving the movable stage 5 on which the divided substrates 9a and 9b are mounted, and irradiating the divided substrates 9b arranged next to the divided substrate 9a. Divided board 9
a is cut by two irradiations of the laser beams 2a and 2b, and the package 8a is singulated. The movable stage 5 is moved, the cutting process is repeated, and the package 8 is successively irradiated with the laser beams 2a and 2b twice.
Is singulated.

In this embodiment, two laser beams 2
Is shown, the divided substrate 9 is cut, and the package 8 is singulated. However, the number is not limited to two. The laser beam 2 necessary to singulate all the divided substrates 9 held by the holding mechanism 6 of the laser processing unit
The number of scans n is: n = k + (m−1) k: the number of packages 8 held by the holding mechanism 6 m: the number of irradiations necessary to cut the divided substrate 9

According to the present embodiment, the energy required for cutting the divided substrate 9 and dividing the package 8 into a plurality of pieces is applied a plurality of times, so that thermal damage to the package 8 can be reduced. Can be.

[0036]

As described above, according to the present invention, the pitch of the package of a substrate having a plurality of packages having a non-constant pitch is contracted due to the influence of the heat treatment in the previous step and the like. After positioning the package at the same time, laser beam is used to cut the vicinity of the periphery of the package and cut the package into individual pieces, which prevents delamination and resin debris that separates the mold resin from the substrate. In addition, a small package such as a CSP can be singulated with high accuracy and in a short time. According to claims 8, 9, 10, 11, 13 and 15, thermal damage to a package can be reduced. Claims 12, 14 and 2
According to 0, adhesion of dust and the like to the package can be prevented.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a substrate cutting device according to a first embodiment of the present invention.

FIG. 2 is a plan view showing a division / alignment mechanism according to the first embodiment of the present invention.

FIG. 3 is a perspective view showing a division / alignment mechanism according to a second embodiment of the present invention.

FIG. 4 is a perspective view showing a division / alignment mechanism according to a third embodiment of the present invention.

FIG. 5 is a perspective view showing a division / alignment mechanism according to a third embodiment of the present invention.

FIG. 6 is a sectional view showing a substrate holding mechanism of a substrate cutting apparatus according to a fourth embodiment of the present invention.

FIG. 7 is a sectional view showing a substrate holding mechanism of a substrate cutting apparatus according to a fifth embodiment of the present invention.

FIG. 8 is a sectional view showing a substrate holding mechanism of a substrate cutting apparatus according to a sixth embodiment of the present invention.

FIG. 9 is a sectional view showing a substrate holding mechanism of a substrate cutting apparatus according to a seventh embodiment of the present invention.

FIG. 10 is a sectional view showing a substrate holding mechanism of a substrate cutting apparatus according to an eighth embodiment of the present invention.

FIG. 11 is a sectional view showing a laser processing part of a substrate cutting device according to a ninth embodiment of the present invention.

FIG. 12 is a perspective view showing a laser processing unit of a substrate cutting device according to a tenth embodiment of the present invention.

[Explanation of symbols]

1 laser oscillator, 2, 2a, 2b laser beam, 3
Reflection mirror, 3a Partial reflection mirror, 3b Total reflection mirror, 4, 4a, 4b Condensing lens, 5 movable stage, 6 holding mechanism, 7 substrate, 8 package, 9
Divided substrate, 10 division / alignment mechanism, 11 nozzles, 1
2 Holder, 13 Cutting jig, 14 Cut, 15 hole, 16a, 16b, 16c, 16d, 16e Alignment jig, 17a, 17b, 17c Pin, 18 Receiving part, 2
0 metal wiring, 21 resin substrate, 22 solder ball, 2
3 piping, 24 concave portions, 25 members, 26 laser beams, 27 frames, 28 through holes, 29 nozzles, 30 assist gases, 31 nozzles, 32 gases, 33 dummy substrates.

Claims (20)

[Claims] An alignment mechanism for correcting and aligning the position of each component after forming a cut between each component of the substrate on which a plurality of components are formed or dividing each component; and What is claimed is: 1. A substrate cutting apparatus, comprising: a substrate conveying means having a plurality of components; and a laser processing unit for irradiating a laser beam to the substrate having a plurality of aligned components. 2. The substrate cutting apparatus according to claim 1, wherein holes are formed on both sides of the substrate in the lateral direction of the substrate corresponding to each component. 3. An alignment mechanism comprising: a substrate cutting jig; and an alignment jig provided with pins corresponding to holes formed in the substrate at predetermined positions. 3. The apparatus for cutting a substrate according to 2. 4. The substrate cutting apparatus according to claim 3, wherein the substrate cutting jig is a contact type cutting jig. 5. The substrate cutting device according to claim 3, wherein the pin provided on the alignment jig has a tapered shape with a sharp end. 6. A laser processing unit, comprising: a stage capable of horizontal movement; a holding jig installed on the stage and holding a substrate having the plurality of aligned components; and a holding jig held by the holding jig. The substrate according to any one of claims 1 to 5, further comprising a laser oscillator that emits a laser beam onto the substrate, and a nozzle that ejects a gas that is blown to an irradiation unit of the laser beam. Cutting equipment. 7. The substrate cutting apparatus according to claim 6, wherein the holding jig is provided with a projection at a position corresponding to a pin provided on the alignment jig. 8. The substrate has a metal wiring formed on one surface and a solder ball provided on the other surface, and is irradiated with a laser beam from the surface on which the metal wiring is formed. The substrate cutting apparatus according to claim 6, wherein the substrate is configured to be suction-held by a holding jig from the side where the surface is provided. 9. The contact surface of the holding jig with the solder ball includes:
The substrate cutting device according to claim 8, wherein a concave portion corresponding to the solder ball is provided. 10. A contact surface of a holding jig with a solder ball,
10. The apparatus for cutting a substrate according to claim 8, wherein the substrate is made of the same material as the constituent material of the substrate. 11. The holding jig according to claim 6, wherein the holding jig is cut out in a tapered shape in accordance with a traveling direction of the laser beam so as not to interfere with the laser beam passing through the substrate. 3. The substrate cutting device according to claim 1. 12. The laser processing part has a suction and exhaust hole in the periphery of the holding jig and a mechanism for forcibly discharging dust generated by laser beam irradiation. The apparatus for cutting a substrate according to any one of claims 6 to 11. 13. The substrate cutting apparatus according to claim 6, wherein the nozzle for ejecting the gas to be applied to the laser beam irradiation unit ejects the gas coaxially with the laser beam. apparatus. 14. The laser processing unit according to claim 6, wherein a plurality of nozzles for jetting a gas to be blown to a peripheral portion of a part to be cut by laser beam irradiation are provided.
14. The apparatus for cutting a substrate according to any one of claims 13 to 13. 15. The substrate according to claim 6, wherein the laser processing unit includes an optical system that divides a laser beam emitted from a laser oscillator into a plurality of laser beams and irradiates the laser beam onto the substrate. Cutting equipment. 16. A step of forming a cut between each component of the substrate on which a plurality of components are formed or a process of dividing each component, a process of correcting and aligning the positions of the components, Moving a substrate having a plurality of parts to a holding jig on a stage capable of moving horizontally at the same time; and blowing a gas onto the substrate held by the holding jig and irradiating a laser beam to separate the parts. A method for cutting a substrate, comprising a step of performing a fragmentation process. 17. The position of a component is corrected by forming a cut between the components and then setting a pin provided at a predetermined position of an alignment jig.
17. The method according to claim 16, wherein the cutting is performed by fitting holes provided on both sides of the component. 18. The position of a component is corrected by dividing a space between the components, raising an alignment jig having pins at predetermined positions, and inserting the pins into holes provided on both sides of the component. 17. The method for cutting a substrate according to claim 16, wherein: 19. The position of the component is corrected by inserting the tip of a tapered pin having a pointed end provided at a predetermined position of the alignment jig into holes provided on both sides of the component. 17. The method for cutting a board according to claim 16, wherein the cutting is performed by dividing the parts in the separated state and sliding down the divided board along the tapered pins. 20. An optical system which divides a laser beam emitted from a laser oscillator into a plurality of laser beams and irradiates the substrate with the laser beam, and irradiates the substrate with the laser beam a plurality of times to singulate the parts. Claims 16 to 19
The method for cutting a substrate according to any one of the preceding claims.