SG90093A1 - Method and apparatus for singulation of electronic devices - Google Patents

Method and apparatus for singulation of electronic devices

Info

Publication number
SG90093A1
SG90093A1 SG200000782A SG200000782A SG90093A1 SG 90093 A1 SG90093 A1 SG 90093A1 SG 200000782 A SG200000782 A SG 200000782A SG 200000782 A SG200000782 A SG 200000782A SG 90093 A1 SG90093 A1 SG 90093A1
Authority
SG
Singapore
Prior art keywords
singulation
electronic devices
electronic
devices
Prior art date
Application number
SG200000782A
Inventor
Choong Whye Kwok
Qiong Chen
Original Assignee
Advanced Systems Automation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to TW89102247A priority Critical patent/TW439107B/en
Application filed by Advanced Systems Automation filed Critical Advanced Systems Automation
Priority to SG200000782A priority patent/SG90093A1/en
Priority to AU2001232606A priority patent/AU2001232606A1/en
Priority to PCT/SG2001/000016 priority patent/WO2001057922A1/en
Publication of SG90093A1 publication Critical patent/SG90093A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
SG200000782A 2000-02-04 2000-02-04 Method and apparatus for singulation of electronic devices SG90093A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW89102247A TW439107B (en) 2000-02-04 2000-02-03 Apparatus for singulating a molded panel with a plurality of IC devices and method for cutting a panel of IC devices connected by a multilayer substrate
SG200000782A SG90093A1 (en) 2000-02-04 2000-02-04 Method and apparatus for singulation of electronic devices
AU2001232606A AU2001232606A1 (en) 2000-02-04 2001-01-31 Method and apparatus for singulation of electronic devices
PCT/SG2001/000016 WO2001057922A1 (en) 2000-02-04 2001-01-31 Method and apparatus for singulation of electronic devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200000782A SG90093A1 (en) 2000-02-04 2000-02-04 Method and apparatus for singulation of electronic devices

Publications (1)

Publication Number Publication Date
SG90093A1 true SG90093A1 (en) 2002-07-23

Family

ID=20430527

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200000782A SG90093A1 (en) 2000-02-04 2000-02-04 Method and apparatus for singulation of electronic devices

Country Status (4)

Country Link
AU (1) AU2001232606A1 (en)
SG (1) SG90093A1 (en)
TW (1) TW439107B (en)
WO (1) WO2001057922A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1030004C2 (en) * 2005-09-21 2007-03-22 Fico Singulation B V Device and method for separating electronic components.
DE102007049160B4 (en) * 2007-10-13 2010-01-28 Carl Baasel Lasertechnik Gmbh & Co. Kg A method of separating grouped into a group, having a Kunststoffvergusskörper chip housings
JP2015184162A (en) * 2014-03-25 2015-10-22 セイコーエプソン株式会社 Electronic component conveyance device and electronic component inspection device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04333299A (en) * 1991-05-08 1992-11-20 Toshiba Corp Cutting method of film board
JPH1140523A (en) * 1997-07-22 1999-02-12 Mitsubishi Electric Corp Substrate cutting device and substrate cutting method
JP2000277550A (en) * 1999-03-25 2000-10-06 Mitsubishi Electric Corp Semiconductor device and its manufacture

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS589360A (en) * 1981-07-10 1983-01-19 Hitachi Ltd Manufacture of hybrid integrated circuit
GB2150360B (en) * 1983-11-21 1987-08-12 Casio Computer Co Ltd A method of manufacturing a small electronic device
JPH11233680A (en) * 1998-02-18 1999-08-27 Mitsubishi Electric Corp Semiconductor device and method and apparatus for chips

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04333299A (en) * 1991-05-08 1992-11-20 Toshiba Corp Cutting method of film board
JPH1140523A (en) * 1997-07-22 1999-02-12 Mitsubishi Electric Corp Substrate cutting device and substrate cutting method
JP2000277550A (en) * 1999-03-25 2000-10-06 Mitsubishi Electric Corp Semiconductor device and its manufacture

Also Published As

Publication number Publication date
WO2001057922A1 (en) 2001-08-09
AU2001232606A1 (en) 2001-08-14
TW439107B (en) 2001-06-07

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