JPH019200Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a lead wire cutting device for cutting excess lead wires of electrical components attached to a board.

When electronic components are soldered to a printed wiring board using an automatic soldering machine, the lead wires of the electrical components are inserted into the holes in the board and are moved by a conveyor, flux is applied, temporary soldering is performed, and then, The excess lead wires protruding from the back side of the board are cut to a predetermined length, flux is applied, and then actual soldering is performed.

The lead wire cutting device typically uses a disc-shaped cutter blade made of cemented carbide that rotates horizontally to cut the lead wires of the moving board.

When trying to improve the soldering processing capacity of such automatic soldering equipment,
It is necessary to improve the throughput of the lead wire cutting device, and methods for this include increasing the diameter of the cutter blade or increasing the rotational speed of the cutter blade. However, due to various constraints, it was not possible to expect a dramatic improvement in processing power with this method.

This invention was devised in view of these points, and without changing the diameter or rotation speed of the cutter blade,
This is an attempt to improve the throughput of a lead wire cutting device.

Next, embodiments of the present invention will be described based on the drawings.

1 and 2 respectively show an embodiment of the lead wire cutting device of the present invention, in which a rotating shaft 2 is vertically supported by a bearing 1, and the rotating shaft 2 is vertically supported by a bearing 1.
A disc-shaped cutter blade 3 is horizontally attached to the upper end, and the rotary shaft 2 is connected to a motor 7 via pulleys 4, 5 and an endless belt 6 to rotate the cutter blade 3. ing.

In the present invention, an ultrasonic vibrator is attached to the rotating shaft 2.

That is, in the embodiment shown in FIG.
A magnetostrictive ultrasonic transducer 8 made of nickel (Ni) is attached to the lower end of the oscilloscope with bolts (not shown), a drive coil 9 is arranged around the ultrasonic transducer 8, and the drive coil 9 is connected to a high-frequency oscillator 10. In the embodiment shown in FIG. 2, a Lange-Vant type electrostrictive ultrasonic transducer 11 is attached to the lower end of the rotating shaft 2 with porcelain sandwiched between metal blocks and bolted.
A slip ring 12 connected to this ultrasonic vibrator 11 is attached with bolts (not shown), and a brush 14 connected to a high frequency oscillator 13 is brought into contact with this slip ring 12.

With such a configuration, the rotating shaft 2 is rotated by the motor 7, and the ultrasonic transducers 8, 11 are generated by the high frequency oscillators 10, 13.
For example, when a high frequency of 20 to 50 KHz is applied to the cutter blade 3, the edge of the cutter blade 3 rotating at high speed vibrates in the axial direction with an amplitude of 1 to 3 μ at the above frequency, and in this state, the electrical component P is temporarily soldered. The board B is positioned slightly above the cutter blade 3 and moved horizontally to cut off the excess lead wires L.

When ultrasonic vibration is applied to the cutter blade 3, the cutting resistance is reduced to about 1/3 compared to the conventional case where ultrasonic vibration is not applied, and as a result, the moving speed of the substrate B is reduced. The speed was increased to about three times that of the conventional method, and processing capacity was dramatically improved.

In addition, conventionally, when cutting a lead wire L of 0.5φ or less with the cutter blade 3 worn out, the lead wire L is bent as shown in FIG. 3, which adversely affects the cutting characteristics. However, even in this state, the cutter blade 3 subjected to ultrasonic vibration exhibited good cutting characteristics, as shown in FIG.

As described above, according to the present invention, an ultrasonic vibrator is attached to the rotating shaft to which the cutter blade is attached, and the cutter blade is vibrated, so that the processing capacity can be dramatically improved. The improved cutting properties also extend the service life of the cutter blade.

[Brief explanation of the drawing]

FIGS. 1 and 2 are front views showing an embodiment of the lead wire cutting device of the present invention, in which FIG. 1 uses a magnetostrictive ultrasonic vibrator, and FIG. This uses an electrostrictive type ultrasonic vibrator. In addition, FIG. 3 is a cross-sectional view of a board showing cutting characteristics by a conventional lead wire cutting device, and FIG.
The figure is a sectional view of a substrate showing cutting characteristics by the lead wire cutting device of the present invention. 2...Rotating shaft, 3...Cutter blade, 8,
11... Ultrasonic vibrator, B... Board, P... Electrical component, L... Lead wire.

Claims (1)

[Scope of utility model registration request] 1. A lead wire cutting device for cutting lead wires of electrical components attached to a board, characterized in that an ultrasonic vibrator is attached to a rotating shaft to which a cutter blade for cutting the lead wire is attached.