JP2002001720A - Cutting device for ceramic laminate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve productivity of a cutting step and a dimensional accuracy of a cut piece in steps of manufacturing an electronic component made of a ceramic laminate. SOLUTION: Steel wires for cutting are disposed in a frame having an ultrasonic vibrating mechanism or a heating mechanism, and ultrasonically vibrated or heated to soften a binder contained in the laminate of parts contacted with the wires to facilitate the cutting.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cutting device for a ceramic laminate, and more particularly, to a cutting device for cutting a ceramic laminate using a steel wire to form an electronic component having a predetermined size. .

[0002]

2. Description of the Related Art In a manufacturing process of a laminated ceramic electronic component, a low-resistance metal conductor pattern is formed on a surface of a ceramic sheet made of a dielectric or magnetic powder and a binder, laminated, and pressed. In general, a ceramic laminate is obtained, the ceramic laminate is cut to a predetermined size, sintered, and an external electrode is provided to provide an electrical connection mechanism.

Here, a cutting device for a ceramic laminate is
It is composed of a drive unit having an elevating mechanism to which a thin metal blade for cutting is attached, and a table on which the ceramic laminate is set. The metal blade is pushed into the ceramic laminate and cut into a predetermined size. In addition, after rotating the cutting device that forms the kerf or rotating the circular cutting blade attached to the rotating mechanism and moving the table attached with the laminated body to cut, the table is rotated 90 degrees and cut in the orthogonal direction. There is a cutting device that cuts to a predetermined size.

[0004]

The push-cutting device can cut the cut end face vertically and accurately when the thickness of the ceramic laminate is small. Because it is difficult to cut,
A method has been adopted in which a notch having a depth of about 1/3 of the ceramic laminate is formed, binder removal and sintering are performed, and then the ceramic laminate is cracked to obtain chips of a predetermined size. However, with this method, it is difficult to cut the chip side surface vertically.

[0005] In the method using a rotary blade, clogging due to the adhesion of grinding debris of the ceramic laminate to the cutting blade,
Cutting is performed while cooling water is applied to prevent temperature rise due to frictional heat. In this case, in a ceramic laminate using a water-soluble binder, there is a problem that the ceramic laminate is broken by cooling water. Considering the effect of cooling water, when cutting the ceramic laminate after sintering, it is necessary to reduce the cutting speed than when cutting the unsintered ceramic laminate because the ceramic is hard,
Productivity decreases.

Accordingly, it is an object of the present invention to improve the productivity of a cutting process of a ceramic laminate, and to improve the dimensional accuracy of the ceramic laminate after cutting, whereby a ceramic laminate and an electronic device using the same are improved. The object is to obtain parts at low cost.

[0007]

Means for Solving the Problems In most cases, the binder used in the ceramic laminate and which contributes to shape retention of the laminate is mostly a thermoplastic polymer compound. This is softened by heating, and processing such as cutting becomes easy. The present invention has been made by paying attention to such properties of the binder.

That is, the present invention relates to a cutting apparatus for cutting a laminate of ceramic sheets made of a dielectric or magnetic material on which a low-resistance metal conductor pattern is formed into a predetermined size. A first cutting frame arranged at a predetermined interval, a second cutting frame having a cutting steel wire arranged in a direction orthogonal to the first cutting frame, and a lifting and lowering attachment of the first and second cutting frames. A cutting device for a ceramic laminate, comprising: a mechanism, and a table in which grooves are formed at the same intervals as the cutting steel wires at positions where the cutting steel wires descend by the lifting mechanism of the cutting frame. It is.

The present invention also provides a cutting device for a ceramic laminate, wherein the cutting frame is provided with an ultrasonic vibration mechanism, and the cutting steel wire is ultrasonically vibrated. Device.

Further, the present invention is the ceramic laminate cutting apparatus, wherein the cutting frame is provided with a heating mechanism to heat the cutting steel wire.

The present invention also provides the ceramic laminate cutting device, wherein the table includes a heating device,
An apparatus for cutting a ceramic laminate, comprising a mechanism for controlling a temperature.

Further, according to the present invention, in the ceramic laminate cutting apparatus, the diameter of the cutting steel wire is 0.5 mm.
A cutting device for a ceramic laminate characterized by the following.

[0013]

According to the above-mentioned mechanism, the steel wires for cutting arranged at predetermined intervals can be softened and cut by directly heating or ultrasonically vibrating the binder contained in the ceramic laminate. It is possible, with good dimensional accuracy,
An apparatus for cutting a ceramic laminate excellent in mass productivity can be obtained.

[0014]

Next, an apparatus for cutting a ceramic laminate according to the present invention will be described in detail with reference to the drawings. In this embodiment, the structure of the cutting device is basically the same regardless of whether ultrasonic waves are used for cutting or when direct heating is used.

FIG. 1 is a perspective view of an apparatus for cutting a ceramic laminate according to the present invention. A first cutting frame 1 in which a cutting steel wire 3 having a diameter of 0.2 mm is arranged at an interval corresponding to the chip size of the ceramic laminate after cutting, and the first cutting frame 1
The second cutting frame 2 on which the cutting steel wire 3 is arranged is attached to the four lifting rails 6 so as to be orthogonal to the cutting steel wire 3.

The first cutting frame 1 and the second cutting frame 2 have an ultrasonic vibration mechanism or a cutting steel wire 3 having a built-in ultrasonic vibrator for ultrasonically vibrating the cutting steel wire 3. Is provided on the cutting frame. The arrangement of the cutting steel wires of the first cutting frame 1 and the second cutting frame 2 can be freely changed depending on the chip size of the ceramic laminate.

At the center of the pedestal 10 on which the four lifting rails are planted, there is a table 8 for fixing the ceramic laminate 12. The fixed table 8 includes a ceramic laminate 12
Positioning guide pins 9 for positioning, a cutting steel wire guide groove 8 for releasing the cutting steel wires 3 of the first cutting frame 1 and the second cutting frame 2 that have descended, and a ceramic laminate 12 However, after positioning, a suction hole 10 is provided so as not to shift. As a material of the table, a hard metal or ceramic that does not absorb the ultrasonic vibration is used.

FIG. 2 shows a ceramic laminate 1 according to the present invention.
2 shows a flowchart of an operation of the cutting apparatus using ultrasonic vibrations of No. 2. The cutting step using the cutting apparatus according to the present invention will be specifically described with reference to FIG. First, the ceramic laminate 12 is pressed against the positioning guide pins 9 of the table 4 to determine the position. After the positioning, the ceramic laminate 12 is suctioned from the suction holes 10 using an oil rotary pump.

Subsequently, while the ultrasonic vibration mechanism 4 attached to the first cutting frame 1 and the second cutting frame 2 on which the cutting steel wires 3 are arranged is operated, the second cutting frame is operated. 2 is lowered to cut the ceramic laminate 12. Next, the first cutting frame 1 in which the arrangement direction of the second cutting frame 2 and the cutting steel wire 3 is orthogonal to each other is lowered, and a chip component of a required size is obtained from the ceramic laminate 12.

FIG. 3 shows a ceramic laminate 1 according to the present invention.
2 is a flowchart of an operation of the cutting apparatus using direct heating of FIG. As in the case of FIG. 2, the cutting step will be described with reference to FIG. First, the ceramic laminate 12 is pressed against the positioning guide pins 9 of the table 4 to determine the position.
After the positioning, the ceramic laminate 12 is suctioned from the suction holes 10 using an oil rotary pump.

Next, the ceramic laminate fixed table 7
Is heated to near the softening point of the binder contained in the ceramic laminate to soften the ceramic laminate. Subsequently, the heating mechanism 4 attached to the first cutting frame 1 and the second cutting frame 2 on which the cutting steel wires 3 are arranged is operated to heat the cutting steel wires 3 to near the binder softening point. .

After the temperature of the cutting steel wire 3 reaches the set temperature, the second cutting frame 2 is lowered and the ceramic laminated body 12
Disconnect. Next, the first cutting frame 1 in which the arrangement direction of the second cutting frame 2 and the cutting steel wire 3 is orthogonal to each other is lowered, and a chip component of a required size is obtained from the ceramic laminate 12.

Here, the diameter of the cutting steel wire 3 is 0.5 mm.
What is limited to the following is that when the diameter is larger than 0.5 mm, the variation in the cutting dimension increases due to an increase in the contact area between the cutting steel wire 3 and the ceramic laminate 12,
This is because the amount of cutting waste of the ceramic laminate 12 increases and material loss increases.

In the present invention, as described above, even when the thickness of the ceramic laminate 12 is large, the temperature is increased to near the softening point of the binder contained in the ceramic laminate 12, and cutting is performed in a softened state. , Making the cutting operation easier. Further, since cooling water is not used, even when a water-soluble binder is used, cutting can be performed without damaging the shape of the ceramic laminate. Further, since the configuration and operation of the apparatus are simple and the cutting speed can be made higher than before, the productivity is excellent.

[0025]

As explained in detail above, the cutting apparatus according to the present invention cuts the ceramic laminate at predetermined intervals by using a cutting steel wire which is ultrasonically vibrated or a cutting steel wire which is directly heated. By using such a mechanism, a cutting device for a ceramic laminate having good dimensional accuracy and excellent productivity can be obtained.

[Brief description of the drawings]

FIG. 1 is a view showing an apparatus for cutting a ceramic laminate according to the present invention.

FIG. 2 is a flowchart of an operation of the ceramic laminate cutting apparatus of the present invention.

FIG. 3 is a flowchart of the operation of the ceramic laminate cutting apparatus of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 1st cutting frame 2 2nd cutting frame 3 Cutting steel wire 4 Ultrasonic vibration mechanism or heating mechanism 5 Power supply line for operating an ultrasonic vibration mechanism or heating mechanism 6 Elevating rail 7 Table Reference Signs List 8 steel wire guide groove for cutting 9 positioning guide pin 10 suction hole 11 pedestal 12 ceramic laminate

Claims (5)

[Claims] An apparatus for cutting a laminated body of a ceramic sheet made of a dielectric or magnetic material on which a low-resistance metal conductor pattern is formed into a predetermined size using a cutting steel wire. A first cutting frame disposed at an interval of: a second cutting frame having a cutting steel wire disposed in a direction orthogonal to the cutting steel wire disposed on the first cutting frame;
And a lifting mechanism to which a second cutting frame is attached, and a position where the cutting steel wire is lowered by the lifting mechanism of the cutting frame,
An apparatus for cutting a ceramic laminate, comprising a table having grooves formed at the same intervals as the cutting steel wire. 2. An apparatus for cutting a ceramic laminate according to claim 1, wherein said cutting frame is provided with an ultrasonic vibration mechanism, and said cutting steel wire is ultrasonically vibrated. . 3. The cutting apparatus for a ceramic laminate according to claim 1, wherein the cutting frame is provided with a heating mechanism to heat the cutting steel wire. 4. The ceramic laminate cutting apparatus according to claim 1, wherein the table has a heating device and a mechanism for controlling a temperature. 5. The ceramic laminate cutting device according to claim 1, wherein the cutting steel wire has a diameter of 0.5 mm or less.