CN102760642A - Metallic packaging shell sintering mould capable of controlling uniformity of leads in height - Google Patents
Metallic packaging shell sintering mould capable of controlling uniformity of leads in height Download PDFInfo
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- CN102760642A CN102760642A CN2011101101805A CN201110110180A CN102760642A CN 102760642 A CN102760642 A CN 102760642A CN 2011101101805 A CN2011101101805 A CN 2011101101805A CN 201110110180 A CN201110110180 A CN 201110110180A CN 102760642 A CN102760642 A CN 102760642A
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- leads
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- cover plate
- height
- lead
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Abstract
The invention discloses a metallic packaging shell sintering mould capable of controlling uniformity of leads in height. A cover plate is added on a bottom mould of a conventionally positive sintered graphite mould and corresponding counter bored holes are formed on the cover plate. A product to be sintered is mounted on the bottom mould of the graphite mould and then covered by the cover plate, and the mould is placed in a high temperature furnace for sintering after being overturned upside down. During the sintering process, the positions of the leads and a bottom plate are controlled by the bottom mould, and the heights of the leads are controlled by the counter bored holes of the cover plate, thus dimensional accuracy of leads heights is guaranteed, and quality of the product is improved since errors of the leads in length are gathered at the other end.
Description
Technical field
The present invention relates to a kind of mould of metal-packaged shell sintering, particularly a kind of Sintering Die for Metallic Packages of controlling consistency of lead height property.
Background technology
In the manufacture process of metal-packaged shell, the base plate of metal-packaged shell needs they to be sintered into one in the high temperature furnace of nitrogen protection with glass insulator with lead-in wire.In this sintering process, the base plate of shell, glass insulator and lead-in wire must relative fixed place high temperature furnace to carry out sintering in graphite jig again.To the direct insertion shell that goes between, a kind of method is also to be simultaneously that the bonding face of lead-in wire is positioned over up to be placed in the graphite jig and carries out sintering in the high temperature furnace with the chip installed surface of housing.At this moment the bonding face that goes between decides by wire length, graphite jig thickness and housing baseplane thickness with the height of laying the housing baseplane of chip.In this way during sintering, if the inconsistent lead-in wire of bonding region that will directly cause of wire length is highly inconsistent.And along with becoming more meticulous of electronics industry require to increase, wire length with and the fineness on surface, quality, the performance that evenness directly influences electronic product.
Another kind method is that the chip installed surface is loaded in the graphite jig down, owing to inserting in the die hole with going between and making lead-in wire unlikely crooked, so necessarily require graphite mo(u)ld to have certain thickness.And this thickness is general all many greatly to the height of housing bottom surface than the lead-in wire bonding face, so must behind sintering, unnecessary lead-in wire be cut away with special equipment, also will the bonding face that go between be polished down to then and meet specification requirement.Owing in the process of cutting and polishing, being easy to cause damage to reduce the technical performances such as mechanical strength and air-tightness of product, so also must product being reentered in the high temperature furnace and handling glass.If higher also usually employing of lead-in wire requirement for height added long lead earlier during a kind of sintering method before the employing, the method for excising the redundance lead-in wire again after to be sintered.
More than two kinds of sintering processings, first kind is caused lead-in wire bonding face height inconsistent and improved the difficulty to the lead-in wire preparation easily.Second method need increase equipment and operation, has improved the cost of product, in fact also is difficult to control cutting and fineness, the evenness of polishing back lead-in wire section.
Summary of the invention
Goal of the invention: The present invention be directed to the deficiency of prior art, a kind of Sintering Die for Metallic Packages that can control consistency of lead height property is provided.
Technical scheme: the Sintering Die for Metallic Packages of control consistency of lead height property of the present invention, comprise bed die, coupling is provided with a cover plate on this bed die, on this cover plate, is provided with the consistent fairlead of the degree of depth.
Comparing with formal dress sintering graphite mould has increased a graphite cover plate that is drilled with counterbore, and the degree of depth of counterbore is the height of bonding end lead-in wire.After being installed on product on the graphite jig by the formal dress sintering processing, cover plate is covered, then with graphite jig turn upside down the upset after put into the stove sintering.The cover plate of this moment has become the mould supporting plate, and bonding end lead-in wire height determines that by the degree of depth of counterbore the consistency of lead-in wire height just is under control like this.After using this invention mould; Because the counterbore size of cover plate is easy to processing and control; Just guaranteed dimensional accuracy and the consistency of lead-in wire height, and lead-in wire adds the inconsistent error of the length that causes man-hour and will all be accumulated in the other end, and the error of this end is to the not influence of quality of product.And, adopt this invention again need not cut the technology that unnecessary lead-in wire and polishing are melted down.
Beneficial effect: the present invention compared with prior art, its remarkable advantage is: lead-in wire is controlled by bed die with the position of base plate when sintering, and the height of lead-in wire is controlled by the fairlead degree of depth on the cover plate, like this, lead-in wire height dimension precision just is guaranteed.
Description of drawings
Fig. 1 is a structural representation of the present invention.
Embodiment
Of Fig. 1, the invention discloses a kind of Sintering Die for Metallic Packages of controlling consistency of lead height property, comprise bed die 1, coupling is provided with a cover plate 2 on this bed die 1, on this cover plate 2, is provided with the consistent fairlead 3 of the degree of depth; In use, graphite jig bed die 1 is placed on die holder or the work top; Lead-in wire is through in the glass insulator hole, and the lead-in wire that will put on glass insulator is again worn and is put on the graphite jig bed die 1 in the corresponding hole, or will go between respectively with special equipment and be sieved in the corresponding hole of mould with glass insulator; The base plate that metal-packaged shell is plate places corresponding position on the graphite jig bed die 1; Cover plate 2 is covered on base plate 1, be drilled with counterbore on the said cover plate 2, the degree of depth of counterbore is the height of bonding end lead-in wire.Lead-in wire is controlled by bed die 1 with the position of base plate when sintering, and the height of lead-in wire is controlled by 3 degree of depth of the fairlead on the cover plate.Like this, lead-in wire height dimension precision just is guaranteed, and lets the error of wire length all focus on the other end and improved the quality of metal-packaged shell.
Claims (1)
1. a Sintering Die for Metallic Packages of controlling consistency of lead height property comprises bed die (1), it is characterized in that: go up coupling at this bed die (1) cover plate (2) is set, on this cover plate (2), be provided with the consistent fairlead (3) of the degree of depth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101101805A CN102760642A (en) | 2011-04-29 | 2011-04-29 | Metallic packaging shell sintering mould capable of controlling uniformity of leads in height |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101101805A CN102760642A (en) | 2011-04-29 | 2011-04-29 | Metallic packaging shell sintering mould capable of controlling uniformity of leads in height |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102760642A true CN102760642A (en) | 2012-10-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101101805A Pending CN102760642A (en) | 2011-04-29 | 2011-04-29 | Metallic packaging shell sintering mould capable of controlling uniformity of leads in height |
Country Status (1)
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| CN (1) | CN102760642A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104117747A (en) * | 2014-07-08 | 2014-10-29 | 宜兴市吉泰电子有限公司 | Electronic packaging outer shell and lead welding method |
| CN106229789B (en) * | 2016-08-31 | 2018-03-27 | 山东云特信息科技有限公司 | A kind of metallic pin connector working plate |
| CN112705809A (en) * | 2020-12-31 | 2021-04-27 | 合肥圣达电子科技实业有限公司 | Rack mounting method and rack mounting die for needle grid type infrared detector shell |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101527267A (en) * | 2009-03-13 | 2009-09-09 | 宜兴市吉泰电子有限公司 | Metallic packaging shell sintering method for controlling consistency of lead height |
| CN202067780U (en) * | 2011-04-29 | 2011-12-07 | 宜兴市吉泰电子有限公司 | Metallic packaging shell sintering die for controlling high consistency of leads |
-
2011
- 2011-04-29 CN CN2011101101805A patent/CN102760642A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101527267A (en) * | 2009-03-13 | 2009-09-09 | 宜兴市吉泰电子有限公司 | Metallic packaging shell sintering method for controlling consistency of lead height |
| CN202067780U (en) * | 2011-04-29 | 2011-12-07 | 宜兴市吉泰电子有限公司 | Metallic packaging shell sintering die for controlling high consistency of leads |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104117747A (en) * | 2014-07-08 | 2014-10-29 | 宜兴市吉泰电子有限公司 | Electronic packaging outer shell and lead welding method |
| CN106229789B (en) * | 2016-08-31 | 2018-03-27 | 山东云特信息科技有限公司 | A kind of metallic pin connector working plate |
| CN112705809A (en) * | 2020-12-31 | 2021-04-27 | 合肥圣达电子科技实业有限公司 | Rack mounting method and rack mounting die for needle grid type infrared detector shell |
| CN112705809B (en) * | 2020-12-31 | 2024-03-15 | 合肥圣达电子科技实业有限公司 | Method and die for mounting needle grid type infrared detector shell |
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Application publication date: 20121031 |