CN202196769U - Ceramic lead structure for hermetic package casing - Google Patents
Ceramic lead structure for hermetic package casing Download PDFInfo
- Publication number
- CN202196769U CN202196769U CN2011203391691U CN201120339169U CN202196769U CN 202196769 U CN202196769 U CN 202196769U CN 2011203391691 U CN2011203391691 U CN 2011203391691U CN 201120339169 U CN201120339169 U CN 201120339169U CN 202196769 U CN202196769 U CN 202196769U
- Authority
- CN
- China
- Prior art keywords
- ceramic
- metal
- hole
- lead
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The utility model discloses a ceramic lead structure for a hermetic package casing. The ceramic lead structure comprises a ceramic sheet and metal leads, ceramic holes are formed on the ceramic sheet for the metal leads to penetrate, a metalization area is arranged around the surface at one end of each ceramic hole, a metal washer is connected to the metalization area, and each metal lead penetrates the corresponding metal washer and the corresponding ceramic hole to be connected with the ceramic sheet. By adopting the structure for brazing ceramics and the metal leads together, adverse effects caused by metalization in the ceramic holes are avoided, mass production of hermetic package casing with ceramic leads can be realized, and meanwhile, the product leads have high welding strength, good housing airtightness, and elegant structural appearance.
Description
Technical field
The utility model relates to electronic product and photoelectricity electronic product air-tight packaging field, is specifically related to the metal lead wire of air-tightness metal-packaged shell and the braze-welded structure of potsherd.
Background technology
Sometimes in order to satisfy some specific (special) requirements, need use ceramic spare and accessory parts in the electronic product air-tight packaging shell, and on ceramic spare and accessory parts input/output structure such as soldering lead-in wire.Conventional wire and ceramic braze-welded structure realize and wire bonds that through metallization in the ceramic hole there are many shortcomings such as cost is high, technology difficulty is big, can't produce in enormous quantities in metallization in the ceramic hole.And metallization process can only be less relatively to hole number in the ceramic hole, and the relatively large situation in aperture could be produced, if ceramic hole quantity is more, metallization is difficult to realize in the less relatively then hole, aperture.Simultaneously, in order to guarantee the air-tightness of soldering with back casing, the metallization welding manner is all very high to the dimension precision requirement of ceramic hole, lead-in wire and soldering mould in the hole, and this will become the maximum bottleneck of housing volume production.
Summary of the invention
The utility model has overcome the deficiency of above technology, provide a kind of new, efficiently, be applicable to the lead-in wire and the ceramic braze-welded structure of air-tight packaging case body volume production.
The ceramic lead structure of the air-tightness metal-packaged shell of the utility model; Comprise potsherd, metal washer and metal lead wire; Said potsherd is provided with the ceramic hole that is used to connect metal lead wire; Be provided with metallized area around the surface of said ceramic hole one end, be connected with metal washer on the said metallized area, said metal lead wire passes metal washer and ceramic hole is connected with potsherd.
Said metal washer can be rule or irregular circular or polygon ring-type, and it is to be used for being connected between linear pattern metal lead wire and the potsherd.
The utility model when Production of Ceramics with holes, only need on one end face surface of hole, to establish metallized area so that with the lead-in wire soldering; Need not in ceramic hole, to do metal layer; Dimensional accuracy to ceramic hole has not just had too high requirement like this, has reduced the difficulty of ceramic processing.
Pottery in the utility model can be a packaging ceramic housing independently, also can be the part in the metallic packaging housing.If can not carry out carrying out soldering again after preplating is handled to it earlier when metal washer or lead-in wire and scolder do not soak into.
Adopt the pottery of the utility model and the structure of metal lead wire soldering; Avoided the adverse effect that metallization brings in the ceramic hole, can realize the volume production with the air-tight packaging housing of ceramic lead, products obtained therefrom wire bonds intensity is high simultaneously; The housing air-tightness is good, the structure exquisite appearance.
Description of drawings
Fig. 1 is the ceramic lead structural representation of the air-tight packaging shell of the utility model;
Fig. 2 shelves the decomposition texture sketch map for Fig. 1's.
Embodiment
The ceramic lead structure of the air-tightness metal-packaged shell of the utility model; Comprise potsherd 5 and linear pattern metal lead wire 1; Potsherd 5 is provided with the ceramic hole that is used to connect metal lead wire 1; Be provided with the metallized area 4 that is used to connect metal washer 2 around the surface of ceramic hole one end, wherein the shape of metal washer can be rule or irregular circular or polygon ring-type.Metal lead wire 1 passes metal washer 2 and ceramic hole is connected with potsherd 5.During production, scolder 3 is placed on metallized area 4 surfaces, push down scolder 3 with metal washer 2 again; The linear pattern of packing into then metal lead wire 1; This moment, scolder and metal washer were accomplished the location through lead-in wire, had reached the fixedly purpose of scolder and metal washer, with the soldering mould whole structure of shelving were positioned at last and fixed; Shelve and put into the soldering sintering furnace after the completion and carry out the sintering soldering; The soldering all-in-one-piece lead-in wire-ceramic structure that the soldering mould promptly obtains the utility model is removed in the intact back of sintering, further, it is carried out other technologies relevant with the package casing requirement carry out post-processed and just formed final air-tight packaging shell finished product.The utility model only needs on one end face surface of hole, to establish metallized area and gets final product when Production of Ceramics with holes, need not in ceramic hole, to do metal layer, and the dimensional accuracy to ceramic hole has not just had too high requirement like this, has reduced the difficulty of ceramic processing.
Claims (2)
1. the ceramic lead structure of air-tight packaging shell; Comprise potsherd and metal lead wire; Said potsherd is provided with the ceramic hole that is used to connect metal lead wire; It is characterized in that: be provided with metallized area around the surface of said ceramic hole one end, be connected with metal washer on the said metallized area, said metal lead wire passes metal washer and ceramic hole is connected with potsherd.
2. the ceramic lead structure of air-tight packaging shell as claimed in claim 1 is characterized in that: said metal washer is circular or the polygon ring-type.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203391691U CN202196769U (en) | 2011-09-13 | 2011-09-13 | Ceramic lead structure for hermetic package casing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203391691U CN202196769U (en) | 2011-09-13 | 2011-09-13 | Ceramic lead structure for hermetic package casing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202196769U true CN202196769U (en) | 2012-04-18 |
Family
ID=45951668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203391691U Expired - Fee Related CN202196769U (en) | 2011-09-13 | 2011-09-13 | Ceramic lead structure for hermetic package casing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202196769U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107946248A (en) * | 2017-11-14 | 2018-04-20 | 中国电子科技集团公司第五十五研究所 | A kind of ceramic contact pin shell mechanism and its manufacture method |
| WO2021208828A1 (en) * | 2020-04-14 | 2021-10-21 | 福建欧中电子有限公司 | Feedthrough capacitor not packaged by glass and applicable to airtight device |
| CN113727543A (en) * | 2021-09-02 | 2021-11-30 | 合肥圣达电子科技实业有限公司 | Ceramic metal packaging shell for electronic component and preparation of ceramic material |
-
2011
- 2011-09-13 CN CN2011203391691U patent/CN202196769U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107946248A (en) * | 2017-11-14 | 2018-04-20 | 中国电子科技集团公司第五十五研究所 | A kind of ceramic contact pin shell mechanism and its manufacture method |
| CN107946248B (en) * | 2017-11-14 | 2020-07-24 | 中国电子科技集团公司第五十五研究所 | Ceramic contact pin shell structure and manufacturing method thereof |
| WO2021208828A1 (en) * | 2020-04-14 | 2021-10-21 | 福建欧中电子有限公司 | Feedthrough capacitor not packaged by glass and applicable to airtight device |
| CN113727543A (en) * | 2021-09-02 | 2021-11-30 | 合肥圣达电子科技实业有限公司 | Ceramic metal packaging shell for electronic component and preparation of ceramic material |
| CN113727543B (en) * | 2021-09-02 | 2023-02-10 | 合肥圣达电子科技实业有限公司 | Ceramic metal packaging shell for electronic component and preparation method of ceramic material |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202196769U (en) | Ceramic lead structure for hermetic package casing | |
| CN204067312U (en) | Electronic package shell sintering mold | |
| CN102865763A (en) | Capillary forming method and capillary forming structure for uniform temperature plate | |
| CN103949792A (en) | Integrated solder and electronic packaging case brazing mounting tool | |
| CN203887228U (en) | Mold for preparing powder metallurgy sintering materials of various ratios | |
| CN202196767U (en) | Brazing structure for ceramic and lead wire of air-impermeable encapsulating housing | |
| CN104008990B (en) | A kind of self-align rack mounting method of package casing pottery pipe cap | |
| CN202067780U (en) | Metallic packaging shell sintering die for controlling high consistency of leads | |
| JP2015050450A (en) | Terminal manufacturing method, and manufacturing method for terminal and electronic component core | |
| CN202229593U (en) | Vanadium-nitrogen alloy firing sagger | |
| CN206614036U (en) | A kind of titanium alloy powder injection moulding sinters tool | |
| CN205140942U (en) | Metal encapsulation shell | |
| CN201252519Y (en) | Metal-packaged SMD quartz resonator | |
| CN203843385U (en) | Connected welding flux and electronic packaging shell match assemble welding tool | |
| CN102339776A (en) | Axial soldering and pickling dual-purpose tool for diode | |
| CN101150916A (en) | Wave crest welding production line for simultaneously processing different products and its production method | |
| TW201436899A (en) | Manufacturing method of display frame border | |
| CN202308231U (en) | TEM die coaxial medium ceramic filter | |
| CN102254875A (en) | Ceramic package and manufacturing method thereof | |
| CN211605117U (en) | Positioning fixture combination suitable for high-power hybrid integrated circuit chip | |
| CN206779457U (en) | The SMD tantalum electrolytic capacitor ultrasound antifriction mould of piezoelectric patches | |
| CN202196768U (en) | Lead casing plate for metal encapsulation casing | |
| CN106826162A (en) | A kind of dot matrix Universal mold preparation method | |
| CN206807889U (en) | A kind of LDS attachment structures | |
| CN201927532U (en) | Ceramic vacuum switch tube integrating flange plate and locating ring |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120418 Termination date: 20170913 |