CN204067312U - Electronic package shell sintering mold - Google Patents
Electronic package shell sintering mold Download PDFInfo
- Publication number
- CN204067312U CN204067312U CN201420372438.8U CN201420372438U CN204067312U CN 204067312 U CN204067312 U CN 204067312U CN 201420372438 U CN201420372438 U CN 201420372438U CN 204067312 U CN204067312 U CN 204067312U
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- die
- sieve
- counterdie
- groove
- filling
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Abstract
The utility model relates to a kind of sintering mold, is specially electronic package shell sintering mold, comprises upper die and lower die and die-filling sieve; Counterdie has groove; Die-filling sieve having the sieve aperture of back taper, often arranging sieve aperture according to putting corresponding with the every bar slot on counterdie; The lower end of sieve aperture is opening shape, and the diameter of opening is greater than the diameter of glass insulator; Semi-finished product after glass insulator and lead-in wire assembling are placed on die-filling sieve, and die-filling sieve vibrates under external force, and half-finished short leg one end slides in sieve aperture because of gravity eccentricity effect; Semi-finished product drop into from the opening of sieve aperture in the groove counterdie again.The electronic package shell sintering mold that the utility model provides, utilize V-shaped groove structure, glass insulator is without the restriction of graphite counterdie, can not bias be there is in lead-in wire, decrease the phenomenon of glass insulator bonding graphite simultaneously, and utilize die-filling sieve to realize loading semi-finished product fast, automation mechanized operation can be realized and improve operating efficiency.
Description
Technical field
The utility model relates to a kind of sintering mold, is specially electronic package shell sintering mold.
Background technology
Electronic package shell sinters, the mainly sealing-in of shell, lead-in wire and glass insulator, first will go between and glass insulator composition semi-finished product, glass insulator is enclosed within lead-in wire, and lead-in wire is divided into two sections, be respectively long lead and short leg, then be inserted on shell, in sealing-in process, graphite jig is the most general aid, is placed on by semi-finished product on the graphite counterdie in sintering mold, then cover shell, and patrix is closed.Principle owing to expanding with heat and contract with cold in sintering process, shell size when high temperature can become large, and during cooling, size can diminish.Such shell can by glass insulator to lead-in wire generation displacement effect.And due to the graphite jig coefficient of expansion and shell inconsistent, therefore mould will produce certain constraint effect to lead-in wire, causes lead-in wire eccentric; Existing graphite counterdie, has multiple circular hole above in addition, for laying glass insulator.Because graphite jig is repeatedly calcined in the atmosphere of high temperature, oxidation, the easily oxidation of its surface, loose, form tiny powdered graphite, easily glass insulator is polluted in sintering process.
Existing mould needs to be put into one by one on counterdie by insulator by hand in addition, and efficiency of assembling is low.
Utility model content
For above-mentioned technical problem, the utility model provides a kind of lead-in wire not easily eccentric and reduces the phenomenon of glass insulator bonding graphite, and concrete technical scheme is:
Electronic package shell sintering mold, comprises upper die and lower die and die-filling sieve;
Described counterdie has groove, and the Lower Half of groove is the short leg groove of rectangle, and the first half is V-shaped groove; Also an overall V-shaped groove can only be opened.
Described die-filling sieve having the sieve aperture of back taper, often arranging sieve aperture according to putting corresponding with the every bar slot on counterdie.The upper surface aperture of sieve aperture is less than the height of lead-in wire, is greater than the height of glass insulator; The lower end of sieve aperture is opening shape, and the diameter of opening is greater than the diameter of glass insulator; Semi-finished product after glass insulator and lead-in wire assembling are placed on die-filling sieve, and die-filling sieve vibrates under external force, and half-finished short leg one end slides in sieve aperture because of gravity eccentricity effect; Semi-finished product drop into from the opening of sieve aperture in the groove counterdie again.
Die-filling sieve is first placed on counterdie, and sieve aperture is embedded in the groove of counterdie, and die-filling sieve has vibrated and loaded half-finished operation together with counterdie.
Be preferably designed for, the two ends of die-filling sieve have front link plate and rear link plate respectively, have pumping board bottom die-filling sieve, and front link plate has protruding fixture block, rear link plate has slot, the top of pumping board through slot, and is inserted into above fixture block, the first Independent Vibration of die-filling sieve, semi-finished product are encased in sieve aperture, then be placed in the groove of counterdie by the bottom of die-filling sieve, when pumping board is extracted out, semi-finished product drop into from the opening of sieve aperture in the groove counterdie.
The groove of counterdie is the kerve of two ends all opening, and the bottom of die-filling sieve is placed in the groove of counterdie, and die-filling sieve is placed on counterdie, utilizes one end of die-filling sieve to be stuck on counterdie and positions, and pumping board is extracted out, and semi-finished product drop into from the opening of sieve aperture in the groove counterdie.
Be preferably designed for, the edge that groove one end of described counterdie extends to counterdie is opening-like, and the other end has fixture block groove, and when in the groove that the bottom of die-filling sieve is placed on counterdie, fixture block is embedded in fixture block groove.Fixture block and fixture block groove is utilized to position.
The electronic package shell sintering mold that the utility model provides, utilize V-shaped groove structure, glass insulator and counterdie only have two point cantact, glass insulator is without the restriction of graphite counterdie, can not bias be there is in lead-in wire, decrease the phenomenon of glass insulator bonding graphite simultaneously, and utilize die-filling sieve to realize loading semi-finished product fast, automation mechanized operation can be realized and improve operating efficiency.
Accompanying drawing explanation
Fig. 1 is counterdie plan structure schematic diagram of the present utility model;
Fig. 2 is counterdie cross-sectional structure schematic diagram of the present utility model;
Fig. 3 is counterdie cross-sectional view of the present utility model;
Fig. 4 is one of counterdie of the present utility model and die-filling sieve embodiment structural representation;
Fig. 5 is two structural representations of counterdie of the present utility model and die-filling sieve embodiment.
Embodiment
Embodiment of the present utility model is described in conjunction with the embodiments, and as shown in Figure 4, electronic package shell sintering mold, comprises upper die and lower die 1 and die-filling sieve 2;
As depicted in figs. 1 and 2, described counterdie 1 has groove, the Lower Half of groove is the short leg groove 11 of rectangle, and the first half is V-shaped groove 12; The bottom being directly greater than V-shaped groove 12 of glass insulator 200, when glass insulator 200 puts into groove, bottom is stuck on V-shaped groove 12, glass insulator 200 and counterdie 1 only have two point cantact, reduce glass insulator 200 in sintering, be stained with the phenomenon of graphite, also only can open an overall V-shaped groove.
As shown in Figure 3, described die-filling sieve 2 having the sieve aperture 21 of back taper, often arranging sieve aperture 21 according to putting corresponding with the every bar slot on counterdie 1; Groove in embodiment has two, and the sieve aperture 21 on die-filling sieve 2 is just to there being two rows.
The upper surface aperture of sieve aperture 21 is less than the height of lead-in wire 100, is greater than the height of glass insulator 200; The lower end of sieve aperture 21 is opening shape, and the diameter of opening is greater than the diameter of glass insulator 200; Semi-finished product after glass insulator 200 and lead-in wire 100 assembling are placed on die-filling sieve 2, die-filling sieve 2 vibrates under external force, because glass insulator 200 is arranged on one end of lead-in wire 100, lead-in wire is divided into short leg and long lead, half-finished centre-of gravity shift, in vibration processes, the upper surface aperture of sieve aperture 21 is less than the height of lead-in wire 100, so lead-in wire 100 can not be fallen in sieve aperture 21 sidewards, short leg one end slides in sieve aperture 21 because of gravity eccentricity reason; Semi-finished product drop in the groove counterdie 1 from the opening of sieve aperture 21 again.
As shown in Figure 4, first can be placed on counterdie 1 by die-filling sieve 2, sieve aperture 21 is embedded in the groove of counterdie 1, and die-filling sieve 2 has vibrated and loaded half-finished operation together with counterdie.
In order to alleviate the load of vibration, also can the first Independent Vibration of die-filling sieve 2, be encased in by semi-finished product in sieve aperture 21, and then put in the groove of counterdie 1, this mode operates, and the structure of die-filling sieve 2 is:
As shown in Figure 3, the two ends of die-filling sieve 2 have front link plate 22 and rear link plate 23 respectively, pumping board 3 is had bottom die-filling sieve 2, front link plate 22 has protruding fixture block 24, and rear link plate 23 has slot, and the top of pumping board 3 is through slot, and be inserted into above fixture block 24, be placed in the groove of counterdie 1 by the bottom of die-filling sieve 2, when pumping board 3 is extracted out, semi-finished product drop in the groove counterdie 1 from the opening of sieve aperture 21.
The groove of counterdie 1 is the kerve of two ends all opening, the bottom of die-filling sieve 2 is placed in the groove of counterdie 1, and die-filling sieve 2 is placed on counterdie, utilizes one end of die-filling sieve 2 to be stuck on counterdie 1 and positions, pumping board 3 is extracted out, and semi-finished product drop in the groove counterdie 1 from the opening of sieve aperture 21.
As shown in Figure 5, the locate mode of die-filling sieve 2 can also be designed to: the edge that groove one end of described counterdie 1 extends to counterdie 1 is opening-like, the other end has fixture block groove 13, and when the bottom of die-filling sieve 2 is placed in the groove of counterdie 1, fixture block 24 is embedded in fixture block groove 13.Fixture block 24 and fixture block groove 13 is utilized to position.
Claims (5)
1. electronic package shell sintering mold, comprises upper die and lower die (1), it is characterized in that: also comprise die-filling sieve (2); Described counterdie (1) has groove.
2. electronic package shell sintering mold according to claim 1, is characterized in that: the sieve aperture (21) described die-filling sieve (2) having back taper, often arranges sieve aperture (21) according to putting corresponding with the every bar slot on counterdie (1);
The upper surface aperture of sieve aperture (21) is less than the height of lead-in wire (100), is greater than the height of glass insulator (200); The lower end of sieve aperture (21) is opening shape, and the diameter of opening is greater than the diameter of glass insulator (200); Semi-finished product after glass insulator (200) and lead-in wire (100) assembling are placed on die-filling sieve (2), and die-filling sieve (2) vibrates under external force, and half-finished short leg one end slides in sieve aperture (21) because of gravity eccentricity reason; Semi-finished product drop in the groove counterdie (1) from the opening of sieve aperture (21) again.
3. electronic package shell sintering mold according to claim 2, it is characterized in that: the two ends of described die-filling sieve (2) have front link plate (22) and rear link plate (23) respectively, pumping board (3) is arranged at die-filling sieve (2) bottom, front link plate (22) has protruding fixture block (24), rear link plate (23) has slot, the top of pumping board (3) is through slot, and be inserted into fixture block (24) top, the bottom of die-filling sieve (2) is placed in the groove of counterdie (1), when pumping board (3) is extracted out, semi-finished product drop in the groove counterdie (1) from the opening of sieve aperture (21).
4. electronic package shell sintering mold according to claim 3, it is characterized in that: the edge that groove one end of described counterdie (1) extends to counterdie (1) is opening-like, the other end has fixture block groove (13), when the bottom of die-filling sieve (2) is placed in the groove of counterdie (1), fixture block (24) is embedded in fixture block groove (13).
5. the electronic package shell sintering mold according to any one of claim 1 to 4, is characterized in that: the Lower Half of described groove is the short leg groove (11) of rectangle, and the first half is V-shaped groove (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420372438.8U CN204067312U (en) | 2014-07-08 | 2014-07-08 | Electronic package shell sintering mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420372438.8U CN204067312U (en) | 2014-07-08 | 2014-07-08 | Electronic package shell sintering mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204067312U true CN204067312U (en) | 2014-12-31 |
Family
ID=52208769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420372438.8U Expired - Fee Related CN204067312U (en) | 2014-07-08 | 2014-07-08 | Electronic package shell sintering mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204067312U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105458701A (en) * | 2016-01-13 | 2016-04-06 | 宜兴市吉泰电子有限公司 | Metal shell assembly mould for electronic packaging |
| CN106475556A (en) * | 2016-11-06 | 2017-03-08 | 合肥圣达电子科技实业有限公司 | A kind of method of use graphite jig sintered microwave metal-packaged shell |
| CN108990347A (en) * | 2018-09-20 | 2018-12-11 | 上海科发电子产品有限公司 | A kind of insulation subassembly device for hydrid integrated circuit shell |
| CN109244015A (en) * | 2018-09-20 | 2019-01-18 | 上海科发电子产品有限公司 | A kind of sintering mold for more pin hydrid integrated circuit shells |
| CN109586138A (en) * | 2018-12-19 | 2019-04-05 | 西安赛尔电子材料科技有限公司 | A kind of multi-pin connector glass sintering mold |
| CN109712920A (en) * | 2019-02-21 | 2019-05-03 | 安徽晶格尔电子有限公司 | A kind of diode die device |
| CN112863788A (en) * | 2021-01-14 | 2021-05-28 | 中电国基南方集团有限公司 | Glass insulator manufacturing device and method |
-
2014
- 2014-07-08 CN CN201420372438.8U patent/CN204067312U/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105458701A (en) * | 2016-01-13 | 2016-04-06 | 宜兴市吉泰电子有限公司 | Metal shell assembly mould for electronic packaging |
| CN106475556A (en) * | 2016-11-06 | 2017-03-08 | 合肥圣达电子科技实业有限公司 | A kind of method of use graphite jig sintered microwave metal-packaged shell |
| CN108990347A (en) * | 2018-09-20 | 2018-12-11 | 上海科发电子产品有限公司 | A kind of insulation subassembly device for hydrid integrated circuit shell |
| CN109244015A (en) * | 2018-09-20 | 2019-01-18 | 上海科发电子产品有限公司 | A kind of sintering mold for more pin hydrid integrated circuit shells |
| CN109244015B (en) * | 2018-09-20 | 2024-03-15 | 上海科发电子产品有限公司 | Sintering mold for multi-pin hybrid integrated circuit shell |
| CN109586138A (en) * | 2018-12-19 | 2019-04-05 | 西安赛尔电子材料科技有限公司 | A kind of multi-pin connector glass sintering mold |
| CN109586138B (en) * | 2018-12-19 | 2024-06-04 | 西安赛尔电子材料科技有限公司 | Glass sintering die for multi-pin connector |
| CN109712920A (en) * | 2019-02-21 | 2019-05-03 | 安徽晶格尔电子有限公司 | A kind of diode die device |
| CN109712920B (en) * | 2019-02-21 | 2024-03-19 | 安徽晶格尔电子有限公司 | Diode die filling device |
| CN112863788A (en) * | 2021-01-14 | 2021-05-28 | 中电国基南方集团有限公司 | Glass insulator manufacturing device and method |
| CN112863788B (en) * | 2021-01-14 | 2022-07-22 | 中电国基南方集团有限公司 | Glass insulator manufacturing device and method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141231 Termination date: 20190708 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |