CN205194696U - Formula chip structure cut straightly - Google Patents
Formula chip structure cut straightly Download PDFInfo
- Publication number
- CN205194696U CN205194696U CN201520879625.XU CN201520879625U CN205194696U CN 205194696 U CN205194696 U CN 205194696U CN 201520879625 U CN201520879625 U CN 201520879625U CN 205194696 U CN205194696 U CN 205194696U
- Authority
- CN
- China
- Prior art keywords
- chip
- tube core
- core module
- frame pin
- power management
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model relates to a formula chip structure cut straightly, including the tube core module, the frame, the frame pin, the bonding wire, the tube core module is fixed on the frame through fixed glue, and finally through the whole plastic -sealed body that encapsulates into of shaping colloid, the tube core module can be power management drive circuit chip or hall element chip, or MOS pipe, also or other chip such as audion, the frame pin is for cuting straightly the formula structure, and the number less than or equal to 4 of frame pin is individual, the utility model discloses the novelty pass through chip design technique, be used for the encapsulation of power management chip or hall element chip to the encapsulation form of rectifier bridge, initiate in belonging to the trade, under the unaffected condition of power of power management chip or hall element chip, not only reduced the chip package volume, reduced the pin, play extremely long -pending effect to the encapsulation application of domestic and international power management chip or hall element chip.
Description
Technical field
The utility model relates to application-specific integrated circuit (ASIC), more specifically relates to a kind of direct insertion chip structure.
Background technology
Now commercially used power management chip packing forms is the encapsulating structure such as SOP8, DIP8, TO-94, SOT23 mainly, SOP8, DIP8 encapsulating structure pin is all greater than 4, and single volume is large, take up room in the place that product space is limited greatly, the cost of encapsulation is high; TO-94 is direct insertion packing forms, can not mass automatic production, uses very inconvenience; Although SOT23 volume is little, power management chip power is restricted.
Now commercially used hall device packing forms mainly TO-94 encapsulating structure, TO-94 is direct insertion and its pin is in the packing forms of packaging body homonymy, can not mass automatic production, uses very inconvenience.In view of the shortcoming of above packing forms, what the utility model was innovative passes through chip design art, the packing forms of rectifier bridge is used for the encapsulation of Hall element chip, belong to pioneering in industry, hall device can be used in automation paster and produce, and plays extremely long-pending effect for the encapsulation of domestic and international Hall element chip and application.
In view of the shortcoming of above packing forms, what the utility model was innovative passes through chip design art, the packing forms of rectifier bridge is used for the encapsulation of power management chip or Hall element chip, the package application for domestic and international power management chip or Hall element chip plays extremely long-pending effect.
Utility model content
The purpose of this utility model is: provide a kind of direct insertion chip structure, has that pin is many, cost is high, power is little or can not the problem of automated production to solve prior art power management chip or hall device.
The utility model is achieved through the following technical solutions: a kind of direct insertion chip structure, comprises tube core module, framework, frame pin, bonding wire, and tube core module is fixed on framework by fixing glue, becomes plastic-sealed body eventually through shaping colloid overall package; It is characterized in that:
Described tube core module can be power management drive circuit chip or Hall element chip, or metal-oxide-semiconductor, also or other circuit chip such as triode;
Further, described tube core module optimization power supply management drive circuit chip.
Further, described tube core module also optional Hall element chip.
Described frame pin is stretched out from both sides in plastic-sealed body;
Described frame pin can be that centre position, both sides is stretched out or stretched out from the position on exchange premium base, both sides in plastic-sealed body;
Further, described frame pin is direct insertion structure.
The number of described frame pin is less than or equal to 4;
Further described pin number preferably 4.
The beneficial aspects that the utility model reaches is: the utility model is compared with other encapsulation mode of conventional power source managing chip or hall device, number of pins obviously tails off or may be used for automated production, there is extraordinary cost performance, cheap cost advantage, high practical value, high reliability and high efficiency.
Accompanying drawing explanation
Fig. 1: the utility model is containing the structural representation of two or more tube core.
Fig. 2: the utility model is containing the direct insertion schematic diagram one of two or more tube core.
Fig. 3: the utility model is containing the direct insertion schematic diagram two of two or more tube core.
Fig. 4: the utility model is containing the structural representation of more than one tube core.
Fig. 5: the utility model is containing a direct insertion schematic diagram one of tube core.
Fig. 6: the utility model is containing a direct insertion schematic diagram two of tube core.
Embodiment
By reference to the accompanying drawings the utility model is described in further detail now.These accompanying drawings are the schematic diagram of simplification, only basic structure of the present utility model are described in a schematic way, and therefore it only shows the formation relevant with the utility model.
Embodiment 1:
With reference to Fig. 1-3, a kind of direct insertion chip structure, is characterized in that: comprise tube core module 11 ~ 12, framework 21 ~ 24, frame pin 31 ~ 34, bonding wire 41 ~ 46, tube core module 11 ~ 12 is fixed on framework 21 ~ 24 by fixing glue, becomes plastic-sealed body 5 eventually through shaping colloid overall package;
Described tube core module 11 is power management drive circuit chip;
Described tube core module 12 is triode;
Described frame pin 3 is stretched out from the both sides of plastic-sealed body 5 and is direct insertion structure;
The number of described frame pin 3 equals 4.
Embodiment 2:
With reference to Fig. 1-3, a kind of direct insertion chip structure, is characterized in that: comprise tube core module 11 ~ 12, framework 21 ~ 24, frame pin 31 ~ 34, bonding wire 41 ~ 46, tube core module 11 ~ 12 is fixed on framework 21 ~ 24 by fixing glue, becomes plastic-sealed body 5 eventually through shaping colloid overall package;
Described tube core module 11 ~ 12 is power management drive circuit chip;
Described frame pin 31 ~ 34 is stretched out from the both sides of plastic-sealed body 5 and is direct insertion structure;
The number of described frame pin 31 ~ 34 equals 3.
Embodiment 3:
With reference to Fig. 1-3, a kind of direct insertion chip structure, is characterized in that: comprise tube core module 11 ~ 12, framework 21 ~ 24, frame pin 31 ~ 34, bonding wire 41 ~ 46, tube core module 11 ~ 12 is fixed on framework 21 ~ 24 by fixing glue, becomes plastic-sealed body 5 eventually through shaping colloid overall package;
Described tube core module 11 is power management drive circuit chip;
Described frame pin 31 ~ 34 is stretched out from the both sides of plastic-sealed body 5 and is direct insertion structure;
The number of described frame pin 31 ~ 34 equals 2.
Embodiment 4:
With reference to Fig. 1-3, a kind of direct insertion chip structure, is characterized in that: comprise tube core module 11 ~ 12, framework 21 ~ 24, frame pin 31 ~ 34, bonding wire 41 ~ 46, tube core module 11 ~ 12 is fixed on framework 21 ~ 24 by fixing glue, becomes plastic-sealed body 5 eventually through shaping colloid overall package;
Described tube core module 11 is power management drive circuit chip;
Described tube core module 12 is triode;
Described frame pin 3 is stretched out from the exchange premium bottom surface, both sides of plastic-sealed body 5;
The number of described frame pin 3 equals 4.
Embodiment 5:
With reference to Fig. 1-3, a kind of direct insertion chip structure, is characterized in that: comprise tube core module 11 ~ 12, framework 21 ~ 24, frame pin 31 ~ 34, bonding wire 41 ~ 46, tube core module 11 ~ 12 is fixed on framework 21 ~ 24 by fixing glue, becomes plastic-sealed body 5 eventually through shaping colloid overall package;
Described tube core module 11 ~ 12 is power management drive circuit chip;
Described frame pin 31 ~ 34 is stretched out from the exchange premium bottom surface, both sides of plastic-sealed body 5;
The number of described frame pin 31 ~ 34 equals 3.
Embodiment 6:
With reference to Fig. 1-3, a kind of direct insertion chip structure, is characterized in that: comprise tube core module 11 ~ 12, framework 21 ~ 24, frame pin 31 ~ 34, bonding wire 41 ~ 46, tube core module 11 ~ 12 is fixed on framework 21 ~ 24 by fixing glue, becomes plastic-sealed body 5 eventually through shaping colloid overall package;
Described tube core module 11 is power management drive circuit chip;
Described frame pin 31 ~ 34 is stretched out from the exchange premium bottom surface, both sides of plastic-sealed body 5;
The number of described frame pin 31 ~ 34 equals 2.
Embodiment 7:
With reference to Fig. 4-6, a kind of direct insertion chip structure 1-3, is characterized in that: comprise tube core module 1, framework 21 ~ 24, frame pin 31 ~ 34, bonding wire 41 ~ 44, tube core module 1 is fixed on framework 21 ~ 24 by fixing glue, becomes plastic-sealed body 5 eventually through shaping colloid overall package;
Described tube core module 1 is Hall element chip;
Described frame pin 3 is stretched out from the both sides of plastic-sealed body 5 and is direct insertion structure;
The number of described frame pin 3 equals 4.
Embodiment 8:
With reference to Fig. 4-6, a kind of direct insertion chip structure 1-3, is characterized in that: comprise tube core module 1, framework 21 ~ 24, frame pin 31 ~ 34, bonding wire 41 ~ 44, tube core module 1 is fixed on framework 21 ~ 24 by fixing glue, becomes plastic-sealed body 5 eventually through shaping colloid overall package;
Described tube core module 1 is Hall element chip;
Described frame pin 3 is stretched out from the both sides of plastic-sealed body 5 and is direct insertion structure;
The number of described frame pin 3 equals 3.
Embodiment 9:
With reference to Fig. 4-6, a kind of direct insertion chip structure 1-3, is characterized in that: comprise tube core module 1, framework 21 ~ 24, frame pin 31 ~ 34, bonding wire 41 ~ 44, tube core module 1 is fixed on framework 21 ~ 24 by fixing glue, becomes plastic-sealed body 5 eventually through shaping colloid overall package;
Described tube core module 1 is Hall element chip;
Described frame pin 3 is stretched out from the both sides of plastic-sealed body 5 and is direct insertion structure;
The number of described frame pin 3 equals 2.
With above-mentioned according to desirable embodiment of the present utility model for enlightenment, by above-mentioned description, relevant staff in the scope not departing from this utility model technological thought, can carry out various change and amendment completely.The technical scope of this utility model is not limited to the content on specification, must determine its technical scope according to right.
Claims (2)
1. a direct insertion chip structure, comprises tube core module, framework, frame pin, bonding wire, and tube core module is fixed on framework by fixing glue, becomes plastic-sealed body eventually through shaping colloid overall package; It is characterized in that:
Described frame pin is distributed in the both sides of plastic-sealed body and is direct insertion structure;
Described tube core module include power management drive circuit chip or Hall element chip any one.
2. a kind of direct insertion chip structure as claimed in claim 1, is characterized in that the number of described frame pin is less than or equal to 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520879625.XU CN205194696U (en) | 2015-11-06 | 2015-11-06 | Formula chip structure cut straightly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520879625.XU CN205194696U (en) | 2015-11-06 | 2015-11-06 | Formula chip structure cut straightly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205194696U true CN205194696U (en) | 2016-04-27 |
Family
ID=55787657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520879625.XU Expired - Fee Related CN205194696U (en) | 2015-11-06 | 2015-11-06 | Formula chip structure cut straightly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205194696U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105355607A (en) * | 2015-11-06 | 2016-02-24 | 常州顶芯半导体技术有限公司 | Direct-insertion type integrated circuit packaging body |
-
2015
- 2015-11-06 CN CN201520879625.XU patent/CN205194696U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105355607A (en) * | 2015-11-06 | 2016-02-24 | 常州顶芯半导体技术有限公司 | Direct-insertion type integrated circuit packaging body |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205194696U (en) | Formula chip structure cut straightly | |
| CN103759228A (en) | Surface-mount Piranha LED lamp | |
| CN205039148U (en) | Novel power management chip packaging structure | |
| CN205039180U (en) | Novel hall device packaging structure | |
| CN204696126U (en) | Based on the COB structure white light LED light source of ceramic phosphor encapsulation | |
| CN203411148U (en) | Adhesive tape adhering device for leather connection | |
| CN105226041A (en) | A kind of power management chip packing forms | |
| CN105355607A (en) | Direct-insertion type integrated circuit packaging body | |
| CN203850287U (en) | Plastic-sealed lead frame in full packaging manner | |
| CN203553212U (en) | Composable wafer direct packaging COB support | |
| CN202977524U (en) | A surface-mounted LED lamp bead | |
| CN202917462U (en) | Die bonding thimble for die bonder | |
| CN105206740A (en) | Encapsulation mode of Hall device | |
| CN204668297U (en) | A kind of rectangular array SMBF lead frame | |
| CN205319143U (en) | Be packaged with a plurality of audio power amplifier chip's circuit structure | |
| CN203553141U (en) | Interactive lead frame unit and interactive lead frame | |
| CN203218252U (en) | EMSOP8 integrated circuit packaging lead frame structure | |
| CN202977521U (en) | A surface-mounted LED lamp bead with double gold threads | |
| CN204257601U (en) | A kind of semiconductor die package magazine of anti-collapse silk | |
| CN201623155U (en) | Veneer SMA diode | |
| CN202058728U (en) | Chip combination type semiconductor integrated device | |
| CN203300644U (en) | Double-base island packaging form structure based on gate-associated transistor | |
| CN203277366U (en) | J-shaped surface-mounted pin circuit module | |
| CN203631536U (en) | Simple self-packaged substrate suitable for laboratory | |
| CN203707128U (en) | Combined COB packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160427 Termination date: 20201106 |