CN205039148U - Novel power management chip packaging structure - Google Patents
Novel power management chip packaging structure Download PDFInfo
- Publication number
- CN205039148U CN205039148U CN201520865914.4U CN201520865914U CN205039148U CN 205039148 U CN205039148 U CN 205039148U CN 201520865914 U CN201520865914 U CN 201520865914U CN 205039148 U CN205039148 U CN 205039148U
- Authority
- CN
- China
- Prior art keywords
- power management
- chip
- tube core
- core module
- frame pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model relates to a novel power management chip packaging structure, including the tube core module, the frame, the frame pin, the bonding wire, the tube core module is fixed on the frame through fixed glue, and finally through the whole plastic -sealed body that encapsulates into of shaping colloid, the tube core module can be power management drive circuit chip or audion, also or other chip such as MOS pipe, the frame pin is for flat horizontal so that be applied to SMD automated production, and the number less than or equal to 4 of frame pin is individual, the utility model discloses the innovative chip design technique of passing through is used for power management chip's encapsulation to the encapsulation form of rectifier bridge, initiates in belonging to the trade, under the unaffected condition of power management chip's power, has not only reduced the chip package volume, has reduced the pin to power management chip can use in the paster production of automizing, plays extremely long -pending effect to domestic and international power management chip's encapsulation and application.
Description
Technical field
The utility model relates to application-specific integrated circuit (ASIC), more specifically relates to a kind of novel power supply managing chip encapsulating structure.
Background technology
Now commercially used power management chip packing forms is the encapsulating structure such as SOP8, DIP8, TO-94, SOT23 mainly, SOP8, DIP8 encapsulating structure pin is all greater than 4, and single volume is large, take up room in the place that product space is limited greatly, the cost of encapsulation is high; TO-94 is direct insertion packing forms, can not mass automatic production, uses very inconvenience; Although SOT23 volume is little, power management chip power is restricted.
In view of the shortcoming of above packing forms, what the utility model was innovative passes through chip design art, the packing forms of rectifier bridge is used for the encapsulation of power management chip, belong to pioneering in industry, in the unaffected situation of the power of power management chip, not only reduce chip package volume, decrease pin, and power management chip can be used in automation paster and produce, extremely long-pending effect is played for the encapsulation of domestic and international power management chip and application.
Utility model content
The purpose of this utility model is: provide a kind of novel power supply managing chip encapsulating structure, has that pin is many, cost is high, power is little or can not the problem of automated production to solve prior art power management chip.
The utility model is achieved through the following technical solutions: a kind of novel power supply managing chip encapsulating structure, and comprise tube core module, framework, frame pin, bonding wire, tube core module is fixed on framework by fixing glue, becomes plastic-sealed body eventually through shaping colloid overall package; It is characterized in that:
Described tube core module can be power management drive circuit chip or triode, also or other circuit chip such as metal-oxide-semiconductor;
Further, described tube core module optimization power supply management drive circuit chip.
Described frame pin is stretched out in plastic-sealed body;
Further, described frame pin is horizontal to be applied to SMD automated production.
The number of described frame pin is less than or equal to 4;
Further described pin number preferably 4;
The beneficial aspects that the utility model reaches is: the utility model is compared with other encapsulation mode of conventional power source managing chip, and number of pins obviously tails off, and has extraordinary cost performance, cheap cost advantage, high practical value, high reliability and high efficiency.
Accompanying drawing explanation
Fig. 1: structural representation of the present utility model.
Fig. 2: the utility model frame pin stretches out horizontal schematic diagram one in plastic-sealed body.
Fig. 3: the utility model frame pin stretches out horizontal schematic diagram two in plastic-sealed body.
Fig. 4: the utility model frame pin stretches out horizontal schematic diagram three in plastic-sealed body.
Embodiment
By reference to the accompanying drawings the utility model is described in further detail now.These accompanying drawings are the schematic diagram of simplification, only basic structure of the present utility model are described in a schematic way, and therefore it only shows the formation relevant with the utility model.
Embodiment 1:
With reference to Fig. 1-4, a kind of novel power supply managing chip encapsulating structure, is characterized in that: comprise tube core module 11 ~ 12, framework 21 ~ 24, frame pin 31 ~ 34, bonding wire 41 ~ 46, tube core module 11 ~ 12 is fixed on framework 21 ~ 24 by fixing glue, becomes plastic-sealed body 5 eventually through shaping colloid overall package;
Described tube core module 11 is power management drive circuit chip;
Described tube core module 12 is triode;
Described frame pin 3 is stretched out from the both sides of plastic-sealed body 5 and is horizontal structure;
The number of described frame pin 3 equals 4.
Embodiment 2:
With reference to Fig. 1-4, a kind of novel power supply managing chip encapsulating structure, is characterized in that: comprise tube core module 11 ~ 12, framework 21 ~ 24, frame pin 31 ~ 34, bonding wire 41 ~ 46, tube core module 11 ~ 12 is fixed on framework 21 ~ 24 by fixing glue, becomes plastic-sealed body 5 eventually through shaping colloid overall package;
Described tube core module 11 ~ 12 is power management drive circuit chip;
Described frame pin 31 ~ 34 is stretched out from the both sides of plastic-sealed body 5 and is horizontal structure;
The number of described frame pin 31 ~ 34 equals 3.
Embodiment 3:
With reference to Fig. 1-4, a kind of novel power supply managing chip encapsulating structure, is characterized in that: comprise tube core module 11 ~ 12, framework 21 ~ 24, frame pin 31 ~ 34, bonding wire 41 ~ 46, tube core module 11 ~ 12 is fixed on framework 21 ~ 24 by fixing glue, becomes plastic-sealed body 5 eventually through shaping colloid overall package;
Described tube core module 11 is power management drive circuit chip;
Described frame pin 31 ~ 34 is stretched out from the both sides of plastic-sealed body 5 and is horizontal structure;
The number of described frame pin 31 ~ 34 equals 2.
Embodiment 4:
With reference to Fig. 1-4, a kind of novel power supply managing chip encapsulating structure, is characterized in that: comprise tube core module 11 ~ 12, framework 21 ~ 24, frame pin 31 ~ 34, bonding wire 41 ~ 46, tube core module 11 ~ 12 is fixed on framework 21 ~ 24 by fixing glue, becomes plastic-sealed body 5 eventually through shaping colloid overall package;
Described tube core module 11 is power management drive circuit chip;
Described tube core module 12 is triode;
Described frame pin 3 is stretched out from the exchange premium bottom surface, both sides of plastic-sealed body 5;
The number of described frame pin 3 equals 4.
Embodiment 5:
With reference to Fig. 1-4, a kind of novel power supply managing chip encapsulating structure, is characterized in that: comprise tube core module 11 ~ 12, framework 21 ~ 24, frame pin 31 ~ 34, bonding wire 41 ~ 46, tube core module 11 ~ 12 is fixed on framework 21 ~ 24 by fixing glue, becomes plastic-sealed body 5 eventually through shaping colloid overall package;
Described tube core module 11 ~ 12 is power management drive circuit chip;
Described frame pin 31 ~ 34 is stretched out from the exchange premium bottom surface, both sides of plastic-sealed body 5;
The number of described frame pin 31 ~ 34 equals 3.
Embodiment 6:
With reference to Fig. 1-4, a kind of novel power supply managing chip encapsulating structure, is characterized in that: comprise tube core module 11 ~ 12, framework 21 ~ 24, frame pin 31 ~ 34, bonding wire 41 ~ 46, tube core module 11 ~ 12 is fixed on framework 21 ~ 24 by fixing glue, becomes plastic-sealed body 5 eventually through shaping colloid overall package;
Described tube core module 11 is power management drive circuit chip;
Described frame pin 31 ~ 34 is stretched out from the exchange premium bottom surface, both sides of plastic-sealed body 5;
The number of described frame pin 31 ~ 34 equals 2.
With above-mentioned according to desirable embodiment of the present utility model for enlightenment, by above-mentioned description, relevant staff in the scope not departing from this utility model technological thought, can carry out various change and amendment completely.The technical scope of this utility model is not limited to the content on specification, must determine its technical scope according to right.
Claims (3)
1. a novel power supply managing chip encapsulating structure, comprises tube core module, framework, frame pin, bonding wire, and tube core module is fixed on framework by fixing glue, becomes plastic-sealed body eventually through shaping colloid overall package; It is characterized in that: described tube core module includes power management drive circuit chip.
2. a kind of novel power supply managing chip encapsulating structure as claimed in claim 1, is characterized in that the number of described frame pin is less than or equal to 4.
3. a kind of novel power supply managing chip encapsulating structure as claimed in claim 1, it is characterized in that described frame pin be distributed in plastic-sealed body both sides and for horizontal structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520865914.4U CN205039148U (en) | 2015-11-03 | 2015-11-03 | Novel power management chip packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520865914.4U CN205039148U (en) | 2015-11-03 | 2015-11-03 | Novel power management chip packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205039148U true CN205039148U (en) | 2016-02-17 |
Family
ID=55298023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520865914.4U Expired - Fee Related CN205039148U (en) | 2015-11-03 | 2015-11-03 | Novel power management chip packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205039148U (en) |
-
2015
- 2015-11-03 CN CN201520865914.4U patent/CN205039148U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160217 Termination date: 20201103 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |