CN207602561U - A kind of rectifier bridge of Ultrathin packaging - Google Patents
A kind of rectifier bridge of Ultrathin packaging Download PDFInfo
- Publication number
- CN207602561U CN207602561U CN201721882420.2U CN201721882420U CN207602561U CN 207602561 U CN207602561 U CN 207602561U CN 201721882420 U CN201721882420 U CN 201721882420U CN 207602561 U CN207602561 U CN 207602561U
- Authority
- CN
- China
- Prior art keywords
- frame
- oxygen
- rectification
- rectifier bridge
- free copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910052802 copper Inorganic materials 0.000 claims abstract description 25
- 239000010949 copper Substances 0.000 claims abstract description 25
- 230000007246 mechanism Effects 0.000 claims abstract description 23
- 238000005538 encapsulation Methods 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 235000012771 pancakes Nutrition 0.000 claims description 5
- 239000011888 foil Substances 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 238000000605 extraction Methods 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- RCCZAUNXYIMXKW-UHFFFAOYSA-N copper;oxolead Chemical compound [Cu].[Pb]=O RCCZAUNXYIMXKW-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005474 detonation Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of rectifier bridge of Ultrathin packaging, including the first frame, the second frame, third frame, the 4th frame, 4 rectification chips, 4 oxygen-free copper leads, packaging mechanisms；First frame is set as inverted L shape structure, and second frame is set as C-shaped configuration, and third frame corresponds to the second frame and is set as reverse c-shape structure, and the 4th frame is set as " Contraband " shape structure；Respectively connect one end of a corresponding rectification chip on second frame, third frame, the rectification chip other end on the second frame, third frame is respectively connect by corresponding oxygen-free copper lead with the first frame；The utility model have the advantages that simple in structure, automation mechanized operation, plastic foil be not easy to draw repeat, plastic foil extraction efficiency is high and production cost is low, and has extensive production and application value in rectifier bridge technical field.
Description
Technical field
The utility model is related to rectifier bridge technical field more particularly to a kind of rectifier bridges of Ultrathin packaging.
Background technology
Existing encapsulation interior design is simply direct, though product function can be realized, because inside only passes through two-layer epitaxial copper
Lead connects, and with epoxy encapsulation, the heat that the product chips after encapsulation generate is conducted to extension copper lead, led to complementary space
The contact area of copper lead and epoxy resin is crossed to radiate, this heat dissipation area contact surface is relatively small, if electric current increases in circuit,
Its temperature rises rapid raising, makes internal temperature excessively high, greatly reduces the chip service life
Utility model content
For above existing defect, the utility model provides a kind of simple in structure, good heat dissipation effect, rectification chip work
Stablize, the rectifier bridge of the Ultrathin packaging of rectification chip long working life.
The technical solution of the utility model is as follows：A kind of rectifier bridge of Ultrathin packaging, including the first frame, the second frame,
Third frame, the 4th frame, 4 rectification chips, 4 oxygen-free copper leads, packaging mechanisms；First frame is set as inverted L shape knot
Structure, second frame are set as C-shaped configuration, and third frame corresponds to the second frame and is set as reverse c-shape structure, and the 4th frame is set as
" Contraband " shape structure；Respectively connect one end of a corresponding rectification chip on second frame, third frame, the second frame, the
A rectification chip other end on three frames, is respectively connect by corresponding oxygen-free copper lead with the first frame；Described
Connect one end of other two rectification chip on four frames, the other end of two rectification chip respectively by oxygen-free copper lead,
It is connected with corresponding third frame, the second frame；4 rectification chips pass through the first frame, the second frame, third frame respectively
Frame, the 4th frame and 4 oxygen-free copper leads are interconnected to constitute a rectifier bridge；The packaging mechanism for encapsulate the first frame,
Second frame, third frame, the 4th frame；First frame, the second frame, third frame, the 4th frame are equipped with from envelope
The pin drawn in mounting mechanism.
Preferably, first frame, the second frame, third frame, the 4th frame are interconnected to square structure, and every
The pin of one frame is pancake pin.
Preferably, each oxygen-free copper lead is set as flat string configuration.
Preferably, the packaging mechanism is made of epoxy resin, and the thickness that the packaging mechanism encapsulates each frame is
0.42mm。
Using the above scheme, the utility model advantageous effect is：
(1), first frame of the utility model, the second frame, third frame, the 4th frame, 4 rectification chips, 4 nothings
Oxygen copper lead, packaging mechanism；First frame is set as inverted L shape structure, and second frame is set as C-shaped configuration, third frame
Corresponding second frame is set as reverse c-shape structure, and the 4th frame is set as " Contraband " shape structure；On second frame, third frame
Respectively connect one end of a corresponding rectification chip, the rectification chip other end on the second frame, third frame, respectively
It is connect by corresponding oxygen-free copper lead with the first frame；One end of other two rectification chip is connected on 4th frame, it should
The other end of two rectification chips respectively by oxygen-free copper lead, is connected with corresponding third frame, the second frame；Described 4
A rectification chip is connected with each other respectively by the first frame, the second frame, third frame, the 4th frame and 4 oxygen-free copper leads
Form a rectifier bridge；The packaging mechanism is for the first frame of encapsulation, the second frame, third frame, the 4th frame；Described first
Frame, the second frame, third frame, the 4th frame are equipped with the pin drawn from packaging mechanism；Such design structure
Simply and by each frame structure good heat dissipation effect, quickly heat can be shed additionally by corresponding pin；
(2), first frame of the utility model, the second frame, third frame, the 4th frame are connected with each other squarely knot
Structure, and the pin of each frame is pancake pin；Such design increases heat dissipation area, and can have when circuital current increases
The heat of the rectification chip that sheds of effect, therefore the working performance of rectification chip can be stablized and improved the service life of rectification chip；
(3), each oxygen-free copper lead of the utility model is set as flat string configuration；The packaging mechanism is epoxy
Resin is made, and the thickness that the packaging mechanism encapsulates each frame is 0.42mm；Such design further increases heat dissipation effect；
Therefore there is the utility model simple in structure, good heat dissipation effect, rectification chip the operation is stable, rectification chip long working life to have
Beneficial effect.
Description of the drawings
Fig. 1 shows structure diagram for cuing open for the utility model；
Fig. 2 is that the detonation configuration of the utility model is intended to.
Specific embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail；
As shown in Figure 1 and Figure 2：A kind of rectifier bridge of Ultrathin packaging is present embodiments provided, including the first frame 1, the second frame
Frame 8, third frame 2, the 4th frame 4,4 rectification chip 5,4 oxygen-free copper lead 6, packaging mechanism 3；First frame 1 is set
For inverted L shape structure, second frame 8 is set as C-shaped configuration, and third frame 2 corresponds to the second frame 8 and is set as reverse c-shape structure, described
4th frame 4 is set as " Contraband " shape structure；A corresponding rectification chip 5 is respectively connected on second frame 8, third frame 2
One end, 5 other end of a rectification chip on the second frame 8, third frame 2, respectively by corresponding oxygen-free copper lead 6 with
First frame 1 connects；Connect one end of other two rectification chip 5 on 4th frame 4, other the one of two rectification chip 5
End connects respectively by oxygen-free copper lead 6 with corresponding third frame 2, the second frame 8；4 rectification chips 5 are distinguished
A rectification is interconnected to constitute by the first frame 1, the second frame 8, third frame 2, the 4th frame 4 and 4 oxygen-free copper leads 6
Bridge；The packaging mechanism 3 is for the first frame 1 of encapsulation, the second frame 8, third frame 2, the 4th frame 4；First frame
1st, the second frame 8, third frame 2, the 4th frame 4 are equipped with the pin 7 drawn from packaging mechanism.
First frame 1, the second frame 8, third frame 2, the 4th frame 4 are interconnected to square structure, and each
The pin of frame is pancake pin.
Each oxygen-free copper lead 6 is set as flat string configuration.
The packaging mechanism 3 is made of epoxy resin, and the thickness that the packaging mechanism 3 encapsulates each frame is 0.42mm.
Embodiment：
As shown in Figure 1 and Figure 2：First frame 1, the second frame 8, third frame 2, the 4th frame 4 of the utility model are mutual
Square structure is connected into, and the pin of each frame is pancake pin；Such design increases heat dissipation area, and in circuit electricity
Can effectively shed the heat of each rectification chip 5 during stream increase, thus can stablize each rectification chip 5 working performance and
Improve the service life of rectification chip；
In addition each oxygen-free copper lead 6 is set as flat string configuration；The packaging mechanism 3 is made of epoxy resin,
The thickness that the packaging mechanism 3 encapsulates each frame is 0.42mm；Such design further increases heat dissipation effect.
The above is only the preferred embodiments of the present utility model only, is not intended to limit the utility model, all in this practicality
All any modification, equivalent and improvement made within novel spirit and principle etc., should be included in the guarantor of the utility model
Within the scope of shield.
Claims (4)
1. a kind of rectifier bridge of Ultrathin packaging, which is characterized in that including the first frame, the second frame, third frame, the 4th frame
Frame, 4 rectification chips, 4 oxygen-free copper leads, packaging mechanisms；First frame is set as inverted L shape structure, second frame
C-shaped configuration is set as, third frame corresponds to the second frame and is set as reverse c-shape structure, and the 4th frame is set as " Contraband " shape structure；It is described
Respectively connect one end of a corresponding rectification chip on second frame, third frame, the rectification on the second frame, third frame
Chip other end is respectively connect by corresponding oxygen-free copper lead with the first frame；It is connected in addition on 4th frame
One end of two rectification chips, the other end of two rectification chip respectively by oxygen-free copper lead, with corresponding third frame,
Second frame connects；4 rectification chips pass through the first frame, the second frame, third frame, the 4th frame and 4 respectively
Oxygen-free copper lead is interconnected to constitute a rectifier bridge；The packaging mechanism is for the first frame of encapsulation, the second frame, third frame
Frame, the 4th frame；First frame, the second frame, third frame, the 4th frame are equipped with one drawn from packaging mechanism
Pin.
2. the rectifier bridge of Ultrathin packaging according to claim 1, it is characterised in that：First frame, the second frame,
Three frames, the 4th frame are interconnected to square structure, and the pin of each frame is pancake pin.
3. the rectifier bridge of Ultrathin packaging according to claim 2, it is characterised in that：Each oxygen-free copper lead is set as flat
Flat string configuration.
4. the rectifier bridge of Ultrathin packaging according to claim 3, it is characterised in that：The packaging mechanism is epoxy resin system
Into the thickness that the packaging mechanism encapsulates each frame is 0.42mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721882420.2U CN207602561U (en) | 2017-12-28 | 2017-12-28 | A kind of rectifier bridge of Ultrathin packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721882420.2U CN207602561U (en) | 2017-12-28 | 2017-12-28 | A kind of rectifier bridge of Ultrathin packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207602561U true CN207602561U (en) | 2018-07-10 |
Family
ID=62769225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721882420.2U Active CN207602561U (en) | 2017-12-28 | 2017-12-28 | A kind of rectifier bridge of Ultrathin packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207602561U (en) |
-
2017
- 2017-12-28 CN CN201721882420.2U patent/CN207602561U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 518000 South District, Block A, 3801, World Trade Plaza, No. 9 Fuhong Road, Futian Street, Futian District, Shenzhen City, Guangdong Province Patentee after: Qiangyuan Core Electronics (Guangdong) Co., Ltd. Address before: 518000 Room 2312, Dingcheng International Building, Zhonghangyuan, Zhenhua Road, Futian District, Shenzhen City, Guangdong Province Patentee before: Shenzhen strong yuan core Electronics Co., Ltd. |
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| CP03 | Change of name, title or address |