CN205039180U - Novel hall device packaging structure - Google Patents
Novel hall device packaging structure Download PDFInfo
- Publication number
- CN205039180U CN205039180U CN201520865878.1U CN201520865878U CN205039180U CN 205039180 U CN205039180 U CN 205039180U CN 201520865878 U CN201520865878 U CN 201520865878U CN 205039180 U CN205039180 U CN 205039180U
- Authority
- CN
- China
- Prior art keywords
- hall device
- tube core
- core module
- utility
- model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Packaging Frangible Articles (AREA)
Abstract
The utility model relates to a novel hall device packaging structure, including tube core module, frame, frame pin, bonding wire, the tube core module is fixed on the frame through fixing to glue, and finally through the whole plastic -sealed body that encapsulates into of shaping colloid, the tube core module includes the hall element chip, and the frame pin stretches out in the plastic -sealed body, and the frame pin is horizontal so that be applied to SMD automated production for putting down, the utility model discloses the innovative chip design technique of passing through is used for hall device's encapsulation to the encapsulation form of rectifier bridge, initiates in belonging to the trade, and can not automize mass production's drawback of more traditional hall device, the utility model discloses can use in the production of automatic paster, processing production price ratio is high, improves production efficiency, to domestic and international hall device's encapsulation and use the extremely long -pending effect of playing.
Description
Technical field
The utility model relates to application-specific integrated circuit (ASIC), more specifically relates to a kind of novel hall device encapsulating structure.
Background technology
Now commercially used hall device packing forms mainly TO-94 encapsulating structure, TO-94 is direct insertion packing forms, can not mass automatic production, uses very inconvenience.In view of the shortcoming of above packing forms, what the utility model was innovative passes through chip design art, the packing forms of rectifier bridge is used for the encapsulation of hall device, belong to pioneering in industry, hall device can be used in automation paster and produce, and plays extremely long-pending effect for the encapsulation of domestic and international hall device and application.
Utility model content
The purpose of this utility model is: provide a kind of novel hall device encapsulating structure, with solve prior art hall device exist cost of labor high, can not the problem of automated production.
The utility model is achieved through the following technical solutions: a kind of novel hall device encapsulating structure, and comprise tube core module, framework, frame pin, bonding wire, tube core module is fixed on framework by fixing glue, becomes plastic-sealed body eventually through shaping colloid overall package; It is characterized in that:
Described tube core module includes Hall element chip;
Described frame pin is stretched out in plastic-sealed body;
Further, described frame pin is horizontal to be applied to SMD automated production.
The number of described frame pin is less than or equal to 4;
The beneficial aspects that the utility model reaches is: the utility model is compared with other encapsulation mode of conventional Hall device, and processing cost performance is high, may be used for automation paster and produces, enhance productivity.
Accompanying drawing explanation
Fig. 1: structural representation of the present utility model.
Fig. 2: the utility model frame pin stretches out horizontal schematic diagram one in plastic-sealed body.
Fig. 3: the utility model frame pin stretches out horizontal schematic diagram two in plastic-sealed body.
Fig. 4: the utility model frame pin stretches out horizontal schematic diagram three in plastic-sealed body.
Embodiment
By reference to the accompanying drawings the utility model is described in further detail now.These accompanying drawings are the schematic diagram of simplification, only basic structure of the present utility model are described in a schematic way, and therefore it only shows the formation relevant with the utility model.
Embodiment 1:
With reference to Fig. 1-3, a kind of novel hall device encapsulating structure, is characterized in that: comprise tube core module 1, framework 21 ~ 24, frame pin 31 ~ 34, bonding wire 41 ~ 44, tube core module 1 is fixed on framework 21 ~ 24 by fixing glue, becomes plastic-sealed body 5 eventually through shaping colloid overall package;
Described tube core module 1 is Hall element chip;
Described frame pin 3 is stretched out from the both sides of plastic-sealed body 5 and is horizontal structure;
The number of described frame pin 3 equals 4.
Embodiment 2:
With reference to Fig. 1-3, a kind of novel hall device encapsulating structure, is characterized in that: comprise tube core module 1, framework 21 ~ 24, frame pin 31 ~ 34, bonding wire 41 ~ 44, tube core module 1 is fixed on framework 21 ~ 24 by fixing glue, becomes plastic-sealed body 5 eventually through shaping colloid overall package;
Described tube core module 1 is Hall element chip;
Described frame pin 3 is stretched out from the both sides of plastic-sealed body 5 and is horizontal structure;
The number of described frame pin 3 equals 3.
Embodiment 3:
With reference to Fig. 1-3, a kind of novel hall device encapsulating structure, is characterized in that: comprise tube core module 1, framework 21 ~ 24, frame pin 31 ~ 34, bonding wire 41 ~ 44, tube core module 1 is fixed on framework 21 ~ 24 by fixing glue, becomes plastic-sealed body 5 eventually through shaping colloid overall package;
Described tube core module 1 is Hall element chip;
Described frame pin 3 is stretched out from the both sides of plastic-sealed body 5 and is horizontal structure;
The number of described frame pin 3 equals 2.
With above-mentioned according to desirable embodiment of the present utility model for enlightenment, by above-mentioned description, relevant staff in the scope not departing from this utility model technological thought, can carry out various change and amendment completely.The technical scope of this utility model is not limited to the content on specification, must determine its technical scope according to right.
Claims (2)
1. a novel hall device encapsulating structure, comprises tube core module, framework, frame pin, bonding wire, and tube core module is fixed on framework by fixing glue, becomes plastic-sealed body eventually through shaping colloid overall package; It is characterized in that: described tube core module includes Hall element chip.
2. a kind of novel hall device encapsulating structure as claimed in claim 1, it is characterized in that described frame pin be distributed in plastic-sealed body both sides and for horizontal structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520865878.1U CN205039180U (en) | 2015-11-03 | 2015-11-03 | Novel hall device packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520865878.1U CN205039180U (en) | 2015-11-03 | 2015-11-03 | Novel hall device packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205039180U true CN205039180U (en) | 2016-02-17 |
Family
ID=55298054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520865878.1U Expired - Fee Related CN205039180U (en) | 2015-11-03 | 2015-11-03 | Novel hall device packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205039180U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105206740A (en) * | 2015-11-03 | 2015-12-30 | 常州顶芯半导体技术有限公司 | Encapsulation mode of Hall device |
-
2015
- 2015-11-03 CN CN201520865878.1U patent/CN205039180U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105206740A (en) * | 2015-11-03 | 2015-12-30 | 常州顶芯半导体技术有限公司 | Encapsulation mode of Hall device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205039180U (en) | Novel hall device packaging structure | |
| CN106784031A (en) | A kind of packaging part of novel photoelectric sensor | |
| CN103759228A (en) | Surface-mount Piranha LED lamp | |
| CN205194696U (en) | Formula chip structure cut straightly | |
| CN205039148U (en) | Novel power management chip packaging structure | |
| CN202977524U (en) | A surface-mounted LED lamp bead | |
| CN203871320U (en) | Packaging structure of AC-DC power supply circuit | |
| CN203411148U (en) | Adhesive tape adhering device for leather connection | |
| CN105206740A (en) | Encapsulation mode of Hall device | |
| CN202977521U (en) | A surface-mounted LED lamp bead with double gold threads | |
| CN203850287U (en) | Plastic-sealed lead frame in full packaging manner | |
| CN208767293U (en) | A kind of QFN lead frame piece | |
| CN203085519U (en) | A chip leading wire frame | |
| CN105226041A (en) | A kind of power management chip packing forms | |
| CN209515733U (en) | A kind of LED core chip package | |
| CN204668297U (en) | A kind of rectangular array SMBF lead frame | |
| CN204257601U (en) | A kind of semiconductor die package magazine of anti-collapse silk | |
| CN203850283U (en) | Plastic-sealed lead frame with pressing marks | |
| CN105355607A (en) | Direct-insertion type integrated circuit packaging body | |
| CN202917480U (en) | Multi-chip integrated circuit leading wire framework for increasing plastic packaging binding force | |
| CN205069626U (en) | Integrated encapsulated circuit of single slide glass | |
| CN202231006U (en) | SMA integrated circuit punching moulded product and SMA multi-row lead frame | |
| CN202120882U (en) | Semiconductor packaging mold construction having no pins all around | |
| CN203536376U (en) | Novel cushion block used for semiconductor packaging push-pull effort machine | |
| CN204361083U (en) | The direct insertion product encapsulating structure of a kind of stitch |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160217 Termination date: 20201103 |