CN202917462U - Die bonding thimble for die bonder - Google Patents
Die bonding thimble for die bonder Download PDFInfo
- Publication number
- CN202917462U CN202917462U CN 201220521755 CN201220521755U CN202917462U CN 202917462 U CN202917462 U CN 202917462U CN 201220521755 CN201220521755 CN 201220521755 CN 201220521755 U CN201220521755 U CN 201220521755U CN 202917462 U CN202917462 U CN 202917462U
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- CN
- China
- Prior art keywords
- thimble
- die
- utility
- tip part
- model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Length-Measuring Instruments Using Mechanical Means (AREA)
Abstract
The utility model discloses a die bonding thimble for a die bonder. The die bonding thimble comprises a thimble body and a finial portion, wherein the finial portion is connected with one end of the thimble body and made of plastic cement. The employed plastic-cement finial portion does not damage a chip, thereby reducing the reject ratio of products caused by existence of cracks in the center of chips.
Description
Technical field
The utility model relates to the parts that use in the chip package, relates in particular to the load thimble.
Background technology
In the chip load process, need to will stick at wafer jack-up on the blue film by thimble, successfully inhale crystalline substance so that inhale brilliant mechanism, currently used thimble is the steel thimble, but adopt the steel thimble in the load process, to push up and hinder chip, cause chip center that slight crack is arranged, this kind chip in use can aircraft bombing, and this problem is at the TO92/TO126(triode) load in particularly outstanding.
The utility model content
The purpose of this utility model is in order to address the aforementioned drawbacks, a kind of load thimble of hindering chip that can not push up to be provided.
The technical solution adopted in the utility model is: a kind of loader load thimble, comprise thimble body and the top tip part of accepting mutually with thimble body one end, and described top tip part is the plastic cement top tip part.
Wherein, the Length Ratio of described top tip part and thimble body is 1:5.
The beneficial effects of the utility model are: adopt the plastic cement top tip part can not push up and hinder chip, reduction the product fraction defective that slight crack causes occurs because of chip center.
Description of drawings
Fig. 1 shows according to the front view of loader of the present utility model with the load thimble.
Embodiment
As shown in Figure 1, loader of the present utility model comprises thimble body 2 and the top tip part 1 of accepting mutually with thimble body 2 one ends with the load thimble, and this top tip part 1 is the plastic cement top tip part.Wherein, plastic cement can be existing any kind, such as thermoplasticity or thermosetting plastic.
When the Length Ratio of above top tip part and thimble body was 1:5, load thimble of the present utility model can obtain better support performance.
Being preferred embodiment of the present utility model only in sum, is not to limit practical range of the present utility model.Be that all equivalences of doing according to the content of the utility model claim change and modification, all should belong to technical scope of the present utility model.
Claims (2)
1. loader load thimble is characterized in that: comprise thimble body and the top tip part of accepting mutually with thimble body one end, described top tip part is the plastic cement top tip part.
2. loader according to claim 1 load thimble, it is characterized in that: the Length Ratio of described top tip part and thimble body is 1:5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220521755 CN202917462U (en) | 2012-10-12 | 2012-10-12 | Die bonding thimble for die bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220521755 CN202917462U (en) | 2012-10-12 | 2012-10-12 | Die bonding thimble for die bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202917462U true CN202917462U (en) | 2013-05-01 |
Family
ID=48165746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220521755 Expired - Fee Related CN202917462U (en) | 2012-10-12 | 2012-10-12 | Die bonding thimble for die bonder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202917462U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105957829A (en) * | 2016-06-28 | 2016-09-21 | 无锡市玉祁红光电子有限公司 | Nondestructive centre for chip mounting machine |
| CN113113345A (en) * | 2021-03-11 | 2021-07-13 | 湖南奥赛瑞智能科技有限公司 | Bundling thimble system for semiconductor packaging adhesive sheet |
-
2012
- 2012-10-12 CN CN 201220521755 patent/CN202917462U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105957829A (en) * | 2016-06-28 | 2016-09-21 | 无锡市玉祁红光电子有限公司 | Nondestructive centre for chip mounting machine |
| CN113113345A (en) * | 2021-03-11 | 2021-07-13 | 湖南奥赛瑞智能科技有限公司 | Bundling thimble system for semiconductor packaging adhesive sheet |
| CN113113345B (en) * | 2021-03-11 | 2023-08-01 | 湖南奥赛瑞智能科技有限公司 | Bundling thimble system for semiconductor packaging adhesive sheet |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130501 Termination date: 20161012 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |