CN202752167U - Glue-dipping probe needle - Google Patents
Glue-dipping probe needle Download PDFInfo
- Publication number
- CN202752167U CN202752167U CN 201220409268 CN201220409268U CN202752167U CN 202752167 U CN202752167 U CN 202752167U CN 201220409268 CN201220409268 CN 201220409268 CN 201220409268 U CN201220409268 U CN 201220409268U CN 202752167 U CN202752167 U CN 202752167U
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- China
- Prior art keywords
- glue
- pit
- dipping
- utility
- model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility mode relates to a glue-dipping probe needle which comprises a needle body. The glue-dipping probe needle is characterized in that a pit is arranged on the head portion of the needle body. The glue-dipping probe needle has the advantages of being reasonable in structure, much in glue-dipping quantity, and the like.
Description
Technical field
The utility model relates to a kind of probe, and what be specifically related to a kind of glue dipping machine dips in the glue probe.
Background technology
In existing semiconductor chip and the framework assembling process, be that dipping in of glue dipping machine is bonded on the semiconductor chip after the glue probe is moistened with adhesive, and then equipped mutually with framework.The existing head that dips in the glue probe is plane, not only dips in the glue amount less, and semiconductor chip is because the external impacts that is subject to dipping in the glue probe, and the phenomenon such as can cause that product chips is broken directly affects the quality of product.
Summary of the invention
The purpose of this utility model is: provide a kind of rational in infrastructure, and dip in the glue amount many dip in the glue probe, to overcome the deficiencies in the prior art.
In order to achieve the above object, the technical solution of the utility model: a kind of glue probe that dips in, comprise needle body, and its: the head of described needle body has pit.
In technique scheme, the pit of described needle body is the spheroidal pit.
The good effect that the utility model has is: because after adopting the utility model said structure, during use, the head that dips in the glue probe dips in the glue amount owing to there being pit to increase, and when after being moistened with adhesive, adhering semiconductor chip, reduced the external impacts to semiconductor chip, thereby guaranteed product quality, reliability and the product qualified rate of product all are improved, and have reduced production cost.Realized the purpose of this utility model.
Description of drawings
Fig. 1 is the structural representation of a kind of specific embodiment of the utility model;
Fig. 2 is the upward view of Fig. 1.
The specific embodiment
Below in conjunction with accompanying drawing and the embodiment that provides, the utility model is further described, but is not limited to this.
As shown in Figure 1, 2, a kind of glue probe that dips in comprises needle body 1, and the head of described needle body 1 has pit 1-1.The pit 1-1 of described needle body 1 is the spheroidal pit.The utility model special recommendation be the semicircle spherical pit.
The utility model lab scale effect shows, during use, the glue amount of dipping in of the utility model needle body 1 head pit 1-1 is that the plane glue probe that dips in has obtained improving greatly than head in the prior art, has reduced the suffered external impacts of semiconductor chip, has improved reliability and the qualification rate of product.Realized original intention of the present utility model.
Claims (2)
1. one kind is dipped in the glue probe, comprises needle body (1), it is characterized in that: the head of described needle body (1) has pit (1-1).
2. the glue probe that dips in according to claim 1, it is characterized in that: the pit (1-1) of described needle body (1) is the spheroidal pit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220409268 CN202752167U (en) | 2012-08-17 | 2012-08-17 | Glue-dipping probe needle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220409268 CN202752167U (en) | 2012-08-17 | 2012-08-17 | Glue-dipping probe needle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202752167U true CN202752167U (en) | 2013-02-27 |
Family
ID=47731362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220409268 Expired - Lifetime CN202752167U (en) | 2012-08-17 | 2012-08-17 | Glue-dipping probe needle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202752167U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103551275A (en) * | 2013-10-22 | 2014-02-05 | 昆山邦琪盛电子材料有限公司 | Spring glue dipping probe |
| CN105903639A (en) * | 2016-05-20 | 2016-08-31 | 中国电子科技集团公司第十研究所 | Full-automatic X-shaped adhesive dispensing and dipping head for chip bonding |
| CN107159533A (en) * | 2017-06-30 | 2017-09-15 | 深圳赛意法微电子有限公司 | The dispensing method and point glue equipment of wafer |
-
2012
- 2012-08-17 CN CN 201220409268 patent/CN202752167U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103551275A (en) * | 2013-10-22 | 2014-02-05 | 昆山邦琪盛电子材料有限公司 | Spring glue dipping probe |
| CN105903639A (en) * | 2016-05-20 | 2016-08-31 | 中国电子科技集团公司第十研究所 | Full-automatic X-shaped adhesive dispensing and dipping head for chip bonding |
| CN105903639B (en) * | 2016-05-20 | 2018-06-26 | 中国电子科技集团公司第十研究所 | Full-automatic chip attachment X-shaped point dips in rubber head |
| CN107159533A (en) * | 2017-06-30 | 2017-09-15 | 深圳赛意法微电子有限公司 | The dispensing method and point glue equipment of wafer |
| CN107159533B (en) * | 2017-06-30 | 2020-11-20 | 深圳赛意法微电子有限公司 | Glue dispensing method and glue dispensing device for wafer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 213022 Changzhou, North New District, Jiangsu Yangtze River Road, No. 19 Patentee after: CHANGZHOU GALAXY CENTURY MICROELECTRONICS CO.,LTD. Address before: 213022 Changzhou, North New District, Jiangsu Yangtze River Road, No. 19 Patentee before: CHANGZHOU GALAXY CENTURY MICRO-ELECTRONICS Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130227 |