CN202752109U - Dispensing needle - Google Patents
Dispensing needle Download PDFInfo
- Publication number
- CN202752109U CN202752109U CN201220414136.3U CN201220414136U CN202752109U CN 202752109 U CN202752109 U CN 202752109U CN 201220414136 U CN201220414136 U CN 201220414136U CN 202752109 U CN202752109 U CN 202752109U
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- Prior art keywords
- needle body
- plastic pin
- utility
- model
- head
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Abstract
The utility model relates to a dispensing needle which comprises a needle body, and the needle body is of a cone frustum shape. The dispensing needle is characterized in that a plurality of bar-type protrusions are arranged on the periphery of the head portion of the needle body along the axial direction. The dispensing needle has the advantages of being reasonable in structure and capable of guaranteeing the uniformity of dispensing shape and glue quantity.
Description
Technical field
The utility model relates to a kind of some plastic pin, is specifically related to a kind of some plastic pin of glue dipping machine.
Background technology
In existing semiconductor chip and the framework assembling process, be to be bonded on the semiconductor chip after some plastic pin with glue dipping machine is moistened with adhesive, and then equipped mutually with framework.At present glue dipping machine the glue type pointed out of the head of matching used some plastic pin differ, not only the glue amount is inhomogeneous, and uniformity is poor; General dispensing needle head section commonly used is several concentric structures, although the point gum machine of this structure and the contact-making surface of colloid are large, but the center and uneven thickness not only after the colloid at edge contacts, and be easy to when load, cause the height sheet, the too high phenomenon of glue also can appear climbing, cause the serious waste of adhesive, thus more difficult production control cost.
Summary of the invention
The purpose of this utility model is: provide a kind of not only rational in infrastructure, and can guarantee point glue shape and conforming some plastic pin of viscose glue amount, to overcome the deficiencies in the prior art.
In order to achieve the above object, the technical solution of the utility model: a kind of some plastic pin, comprise the needle body that is circular cone shape, and its: the periphery of the head of described needle body has several strip bulges vertically.
In technique scheme, several strip bulges of described needle body are cross along the needle body periphery to be arranged, perhaps is M shape and arranges.
In technique scheme, the head center place of described needle body also has hemispherical projections.
The good effect that the utility model has is: because the periphery of the head of described needle body has several strip bulges vertically, therefore, guaranteed the colloid shape that the some plastic pin is pointed out and the uniformity of dipping in the glue amount, the zone of head beyond slot of namely putting plastic pin do not have colloid; In assembling semiconductor chips, colloid is owing to be subject to the extruding at the semiconductor chip back side, and can fill the faying face that contacts between the paster base island of complete chip and framework; So both guarantee the Ohmic contact that semiconductor chip and paster Ji Dao are good, and can reduce greatly again askew pipe, height sheet and excessive glue equivalent risk, can also save the consumption of colloid, effectively reduced production cost.Realized the purpose of this utility model.
Description of drawings
Fig. 1 is the structural representation of a kind of specific embodiment of the utility model, and 2 are and needle body 1 mutual all-in-one-piece shank shown in the figure;
Fig. 2 is the upward view (amplification) of Fig. 1;
Fig. 3 is the A section enlarged drawing of Fig. 1.
The specific embodiment
Below in conjunction with accompanying drawing and the embodiment that provides, the utility model is further described, but is not limited to this.
As shown in Figure 1, 2, 3, a kind of some plastic pin comprises the needle body 1 that is circular cone shape, and the periphery of the head of described needle body 1 has several strip bulges 1-1 vertically.Several strip bulges 1-1 of described needle body 1 is cross along needle body 1 periphery and arranges, perhaps is M shape and arranges.
As shown in Figure 1, 2, 3, dip in the uniformity of glue in order to guarantee the utility model, prevent the head crushing semiconductor chip of needle body 1, the head center place of described needle body 1 also has hemispherical projections 1-2.
The formed shape of several strip bulges 1-1 of the utility model needle body 1 is not limited to described shape, also can form the projection of other geometry.
The utility model lab scale effect shows, during use, it is cross that the utility model needle body 1 head is the glue type that cross strip bulge 1-1 points out, the colloid shape that the some plastic pin is pointed out and the uniformity of dipping in the glue amount have been guaranteed, that the some plastic pin of several concentric structures has obtained improving greatly than head in the prior art, can fill the faying face that contacts between the paster base island of complete chip and framework, guarantee the Ohmic contact that semiconductor chip and paster Ji Dao are good.Realized original intention of the present utility model.
Claims (3)
1. a some plastic pin comprises the needle body (1) that is circular cone shape, and it is characterized in that: the periphery of the head of described needle body (1) has several strip bulges (1-1) vertically.
2. according to claim 1 some plastic pin is characterized in that: several strip bulges (1-1) of described needle body (1) are cross along needle body (1) periphery to be arranged, perhaps is M shape and arranges.
3. according to claim 1 and 2 some plastic pin, it is characterized in that: the head center place of described needle body (1) also has hemispherical projections (1-2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220414136.3U CN202752109U (en) | 2012-08-21 | 2012-08-21 | Dispensing needle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220414136.3U CN202752109U (en) | 2012-08-21 | 2012-08-21 | Dispensing needle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202752109U true CN202752109U (en) | 2013-02-27 |
Family
ID=47731304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201220414136.3U Expired - Lifetime CN202752109U (en) | 2012-08-21 | 2012-08-21 | Dispensing needle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202752109U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104384066A (en) * | 2014-10-30 | 2015-03-04 | 昆山迈致治具科技有限公司 | Dispensing jig |
| CN107979970A (en) * | 2017-11-13 | 2018-05-01 | 北京七星华创微电子有限责任公司 | A kind of chip chip mounter and chip pasting method |
| CN110252581A (en) * | 2019-07-19 | 2019-09-20 | 中电科仪器仪表有限公司 | A kind of conductive glue is with dipping in rubber head |
-
2012
- 2012-08-21 CN CN201220414136.3U patent/CN202752109U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104384066A (en) * | 2014-10-30 | 2015-03-04 | 昆山迈致治具科技有限公司 | Dispensing jig |
| CN107979970A (en) * | 2017-11-13 | 2018-05-01 | 北京七星华创微电子有限责任公司 | A kind of chip chip mounter and chip pasting method |
| CN110252581A (en) * | 2019-07-19 | 2019-09-20 | 中电科仪器仪表有限公司 | A kind of conductive glue is with dipping in rubber head |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 213022 Changzhou, North New District, Jiangsu Yangtze River Road, No. 19 Patentee after: CHANGZHOU GALAXY CENTURY MICROELECTRONICS CO.,LTD. Address before: 213022 Changzhou, North New District, Jiangsu Yangtze River Road, No. 19 Patentee before: CHANGZHOU GALAXY CENTURY MICRO-ELECTRONICS Co.,Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20130227 |
|
| CX01 | Expiry of patent term |