CN202796929U - Paster type lead frame - Google Patents
Paster type lead frame Download PDFInfo
- Publication number
- CN202796929U CN202796929U CN 201220394422 CN201220394422U CN202796929U CN 202796929 U CN202796929 U CN 202796929U CN 201220394422 CN201220394422 CN 201220394422 CN 201220394422 U CN201220394422 U CN 201220394422U CN 202796929 U CN202796929 U CN 202796929U
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- China
- Prior art keywords
- lead
- paster
- wire
- dao
- hole
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model relates to a paster type lead frame comprising a first lead, a second lead, and a third lead. The second lead is disposed between the first lead and the third lead. The second lead comprises a second paster substrate. The second paster substrate is provided with a plurality of first through holes close to a non-leading out end of the upper part, and is provided with second through holes close to a leading out end of the lower part. By using the paster type lead frame, the combination force of a packaging body and the paster substrate can be enhanced, therefore the layering of the packaging body can be effectively prevented.
Description
Technical field
The utility model relates to a kind of lead frame, is specifically related to a kind of patch-type lead frame, belongs to technical field of electronic components.
Background technology
Surface and the back side of the paster Ji Dao that existing paster lead frame is included are smooth flat, and after the paster Ji Dao of this kind lead frame and diode chip for backlight unit or triode chip be encapsulated in packaging body, lamination appears in packaging body easily, has reduced the reliability of product.
Summary of the invention
The purpose of this utility model is: provide a kind of and can strengthen paster Ji Dao and packaging body adhesion, prevent the patch-type lead frame of packaging body generation layering, to overcome the deficiencies in the prior art.
In order to achieve the above object, the technical solution of the utility model is: a kind of patch-type lead frame, comprise the first lead-in wire, the second lead-in wire and the 3rd lead-in wire, described the second lead-in wire is between the first lead-in wire and the 3rd lead-in wire, the second lead-in wire comprises the second paster Ji Dao, and its: described the second paster Ji Dao is being provided with several the first through holes near non-exit place, its top, and the second paster Ji Dao is being provided with the second through hole near exit place, its underpart.
In technique scheme, the non-exit of described the second paster Ji Dao is provided with the fin that is connected as a single entity with it.
In technique scheme, the non-exit of described the second paster Ji Dao and close fin place are provided with depression, and described depression is cone tip shape.
In technique scheme, described several first through holes are the formation shape along the Width of the second paster Ji Dao pitch arrangement.
In technique scheme, described the first through hole and the second through hole are manhole or for ellipse hole or for the polygon through hole, perhaps are any two or three combination of described three kinds of shape through holes.
In technique scheme, described the first lead-in wire and the 3rd lead-in wire have respectively the first gap and the second gap, and the first gap and the second gap lay respectively at the first lead-in wire and the 3rd outside that goes between.
The good effect that the utility model has is: because the second paster Ji Dao of the second lead-in wire of the present utility model is provided with several through holes, so that also fill with in the through hole of the paster Ji Dao after the encapsulation packaging body is arranged, not only increased the contact area of paster Ji Dao and packaging body, and strengthened the adhesion of packaging body and paster Ji Dao, thereby can effectively prevent packaging body generation layering, improve the reliability of product.Realized the purpose of this utility model.
Description of drawings
Fig. 1 is the structural representation of a kind of embodiment of the utility model;
Fig. 2 is along the cutaway view of A-A direction among Fig. 1.
Embodiment
Below in conjunction with accompanying drawing and the embodiment that provides, the utility model is further described, but is not limited to this.
As shown in Figure 1, 2, a kind of patch-type lead frame, comprise the first lead-in wire the 1, second lead-in wire the 2 and the 3rd lead-in wire 3, described the second lead-in wire 2 is between the first lead-in wire the 1 and the 3rd lead-in wire 3, the second lead-in wire 2 comprises the second paster base island 2-1, and its: described the second paster base island 2-1 is being provided with 3 the first through hole 2-1-1 near non-exit 2-3 place, its top, and the second paster base island 2-1 is being provided with the second through hole 2-1-2 near exit 2-4 place, its underpart.Described the first through hole 2-1-1 and the second through hole 2-1-2 are manhole.
As shown in Figure 1, in order to improve radiating effect of the present utility model, the non-exit 2-4 of described the second paster base island 2-1 is provided with the fin 2-2 that is connected as a single entity with it.
As shown in Figure 1, 2, in order further to increase the contact area of paster Ji Dao and packaging body, the non-exit 2-4 of described the second paster base island 2-1 and close fin 2-2 place are provided with depression 2-2-1, and described depression 2-2-1 is cone tip shape.
As shown in Figure 1, more reasonable, compact in order to guarantee the utility model, described 3 the first through hole 2-1-1 are the formation shape along the Width of the second paster base island 2-1 pitch arrangement.And described the first through hole 2-1-1 can have 3 ~ 5.
As shown in Figure 1, described the first through hole 2-1-1 and the second through hole 2-1-2 are manhole or for ellipse hole or for the polygon through hole, perhaps are any two or three combination of described three kinds of shape through holes.
As shown in Figure 1, in order further to improve the adhesion of the utility model and packaging body, described the first lead-in wire the 1 and the 3rd lead-in wire 3 has respectively the first gap 1-1 and the second gap 3-1, and the first gap 1-1 and the second gap 3-1 lay respectively at the outside of the first lead-in wire the 1 and the 3rd lead-in wire 3.
The utility model lab scale effect shows, after the utility model and diode or triode be encapsulated in packaging body, increase the contact area of paster Ji Dao and packaging body, strengthened simultaneously the adhesion of packaging body and paster Ji Dao, thereby can effectively prevent packaging body generation layering.Realized original intention of the present utility model.
Certainly, the first through hole 2-1-1 of the present utility model and the second through hole 2-1-2 are not limited to the disclosed several difformities of the application, also can adopt the through hole of other geometry.
Claims (6)
1. patch-type lead frame, comprise the first lead-in wire (1), the second lead-in wire (2) and the 3rd lead-in wire (3), described the second lead-in wire (2) is positioned between the first lead-in wire (1) and the 3rd lead-in wire (3), the second lead-in wire (2) comprises the second paster Ji Dao (2-1), it is characterized in that: described the second paster Ji Dao (2-1) is locating to be provided with several the first through holes (2-1-1) near the non-exit in its top (2-3), and the second paster Ji Dao (2-1) is locating to be provided with the second through hole (2-1-2) near its underpart exit (2-4).
2. patch-type lead frame according to claim 1, it is characterized in that: the non-exit (2-4) of described the second paster Ji Dao (2-1) is provided with the fin (2-2) that is connected as a single entity with it.
3. patch-type lead frame according to claim 2 is characterized in that: the non-exit (2-4) of described the second paster Ji Dao (2-1) and locate to be provided with depression (2-2-1) near fin (2-2), described depression (2-2-1) is cone tip shape.
4. patch-type lead frame according to claim 1 is characterized in that: described several first through holes (2-1-1) are the formation shape along the Width of the second paster Ji Dao (2-1) pitch arrangement.
5. patch-type lead frame according to claim 1, it is characterized in that: described the first through hole (2-1-1) and the second through hole (2-1-2) be for manhole or for ellipse hole or for the polygon through hole, perhaps is any two or three combination of described three kinds of shape through holes.
6. patch-type lead frame according to claim 1, it is characterized in that: described the first lead-in wire (1) and the 3rd lead-in wire (3) have respectively the first gap (1-1) and the second gap (3-1), and the first gap (1-1) and the second gap (3-1) lay respectively at first and go between (1) and the 3rd outside that goes between (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220394422 CN202796929U (en) | 2012-08-10 | 2012-08-10 | Paster type lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220394422 CN202796929U (en) | 2012-08-10 | 2012-08-10 | Paster type lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202796929U true CN202796929U (en) | 2013-03-13 |
Family
ID=47824132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220394422 Expired - Lifetime CN202796929U (en) | 2012-08-10 | 2012-08-10 | Paster type lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202796929U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102738110A (en) * | 2012-08-10 | 2012-10-17 | 常州银河世纪微电子有限公司 | Surface-mounted type lead frame |
-
2012
- 2012-08-10 CN CN 201220394422 patent/CN202796929U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102738110A (en) * | 2012-08-10 | 2012-10-17 | 常州银河世纪微电子有限公司 | Surface-mounted type lead frame |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 213022 Changzhou, North New District, Jiangsu Yangtze River Road, No. 19 Patentee after: CHANGZHOU GALAXY CENTURY MICROELECTRONICS CO.,LTD. Address before: 213022 Changzhou, North New District, Jiangsu Yangtze River Road, No. 19 Patentee before: CHANGZHOU GALAXY CENTURY MICRO-ELECTRONICS Co.,Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20130313 |
|
| CX01 | Expiry of patent term |