CN201430163Y - Novel LED single-base packaging structure - Google Patents
Novel LED single-base packaging structure Download PDFInfo
- Publication number
- CN201430163Y CN201430163Y CN2009201390574U CN200920139057U CN201430163Y CN 201430163 Y CN201430163 Y CN 201430163Y CN 2009201390574 U CN2009201390574 U CN 2009201390574U CN 200920139057 U CN200920139057 U CN 200920139057U CN 201430163 Y CN201430163 Y CN 201430163Y
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- injection
- molded body
- aluminium base
- injection molding
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Abstract
The utility model provides a novel LED single-base packaging structure, which comprises an aluminum substrate and an insulated injection molding layer which are mutually connected in an injection molding manner, wherein the aluminum substrate is a two-piece structure with two pieces arranged left and right side by side and indirectly connected with each other, one piece is a positive electrode plate, and the other is a negative electrode plate; the insulated injection molding layer includes an injection molding body and a plurality of injection molding connection pins; the injection molding body is positioned above the aluminum substrate; the insulated injection molding body is equipped with a concave reflector which is in the shape of a hemicone and penetrates through the injection molding body; each of the injection molding connection pins is a structure with narrow top and wide bottom, is distributed on the periphery of the reflector, and longitudinally penetrates through the aluminum substrate to be fixedly connected.
Description
[technical field]
The utility model relates to a kind of lighting apparatus, relates in particular to the encapsulating structure of the single base of a kind of New LED.
[background technology]
Traditional LED encapsulating structure generally all utilizes finished aluminium base, and the loss ratio of aluminium base is bigger in the course of processing, and the encapsulation back is bad owing to reasons in structure causes dispelling the heat, and causes luminous efficiency decline and life-span to shorten.
[utility model content]
The technical problems to be solved in the utility model is to provide the encapsulating structure of the single base of a kind of New LED, changes the conventional package structure unfavorable problem of dispelling the heat.
The utility model is achieved in that the encapsulating structure of the single base of a kind of New LED, comprise the aluminium base and the insulation injection molded layers that connect in the injection moulding mode mutually, the two-piece type structure of described aluminium base for being arranged side by side about directly not linking to each other, a slice is a positive plate, another sheet is a negative plate; Described insulation injection molded layers comprises an injection-molded body and a plurality of injection moulding connecting pin, this injection-molded body is positioned at the top of described aluminium base, described insulation injection-molded body is provided with a depression and penetrates the reflector of the half cone bodily form of this injection-molded body, described injection moulding connecting pin is up-narrow and down-wide structure, and what be distributed in described reflector also vertically runs through described aluminium base to be connected and fixed on every side.
Described injection-molded body is a square structure, and the outer rim of described aluminium base is parallel with the outer rim of described injection-molded body, and the left and right sides outer rim of aluminium base is protruded the outer rim of described injection-molded body.
Described aluminium base comprises an aluminium lamination, an insulating barrier, a bronze medal layer and a silver coating that is provided with from bottom to top.
Described positive plate is narrow shape rectangle, the inboard ladder hypotenuse that is provided with the evagination of front and back symmetry again in the middle of this narrow shape is rectangular, and the roundlet arc limit of the subsidiary evagination in the centre of ladder hypotenuse; Described negative plate is wide shape rectangle, and the rectangular middle inboard orthodrome limit that is provided with an evagination again of this wide shape.
Advantage of the present utility model is: adopt direct injection moulding design, effectively reduced the loss of material.Not only easy to use, and cost reduces greatly, and reflecting effect is better, it is superior to get optical property, therefore, will encapsulate integrated bringing great convenience to LED; In addition, the left and right sides outer rim of its aluminium base is protruded the setting of the outer rim structure of injection-molded body, is convenient to very much the series connection side by side of a plurality of LED encapsulation base plates, has greatly saved cost.
[description of drawings]
In conjunction with the embodiments the utility model is further described with reference to the accompanying drawings.
Fig. 1 is the plan structure schematic diagram of the single led encapsulation base plate of the utility model.
Fig. 2 is the cross-sectional schematic of Fig. 1 along the A-A direction.
Fig. 3 is the cross-sectional schematic of Fig. 1 along the B-B direction.
Fig. 4 is the schematic diagram that a plurality of LED encapsulation base plates are connected side by side.
[embodiment]
See also illustrated in figures 1 and 2, it is LED encapsulation base plate 10 of the present utility model, comprise the aluminium base 1 and the insulation injection molded layers 2 that connect in the injection moulding mode mutually, the two-piece type structure of described aluminium base 1 for being arranged side by side about directly not linking to each other, a slice is a positive plate 11, another sheet is a negative plate 12, in order to conduction.Described positive plate 11 is wide shape rectangle, and the rectangular middle inboard orthodrome limit 111 that is provided with an evagination again of this wide shape; Described negative plate 12 is narrow shape rectangle, the inboard ladder hypotenuse 121 that is provided with the evagination of front and back symmetry again in the middle of this narrow shape is rectangular, and the roundlet arc limit 122 of the subsidiary evagination in the centre of ladder hypotenuse 121.Be roughly rectangle owing to positive plate 11 with for negative plate 12, the waste of material in the course of processing is less.
Described insulation injection molded layers 2 comprises an injection-molded body 21 and a plurality of injection moulding connecting pin 22, this injection-molded body 21 is positioned at the top of described aluminium base 1, described insulation injection-molded body 21 is provided with a depression and penetrates the reflector 23 of the half cone bodily form of this injection-molded body 21, described injection moulding connecting pin 22 is up-narrow and down-wide structure, described aluminium base 1 be provided with several the perforation 13 be distributed in described reflector 23 around, described injection moulding connecting pin 22 can vertically run through the perforation 13 of described aluminium base 1 to be connected and fixed with this aluminium base 1, and perforation 13 and injection moulding connecting pin 22 connect firm more more at most.
Described aluminium base 1 comprises an aluminium lamination, an insulating barrier, a bronze medal layer and a silver coating that is provided with from bottom to top, and aluminium lamination plays thermolysis, and insulating barrier plays the effect of branch both positive and negative polarity, and the copper layer is as electrode, and silver layer mainly plays reflection action.The direct injection moulding of above-mentioned employing design has effectively reduced the loss of material, and is not only easy to use, and cost reduces greatly, and reflecting effect is better, directly dispels the heat by aluminium base 1, good heat dissipation effect, and the life-span is long, and it is superior to get optical property.
Described injection-molded body 21 is a square structure, and the outer rim 14 of described aluminium base 1 is parallel with the outer rim 24 of described injection-molded body 21, and the left and right sides outer rim 14 of aluminium base 1 is protruded the outer rim 24 of described injection-molded body 21.The purpose of this protrusion setting is convenient a plurality of LED encapsulation base plate 10 platoons series connection, as shown in Figure 4, when a plurality of LED encapsulation base plates 10 carry out the platoon series connection, only need the negative plate 12 of the positive plate 11 of a certain aluminium base 1 and adjacent aluminium base 1 is pushed against side by side, two aluminium bases 1 of outermost end are used a spring (figure do not show) etc. to push against again respectively and are got final product, the cascaded structure of so reaching is simple, also can free-handly operate, and is very convenient.
Claims (4)
1, the encapsulating structure of the single base of a kind of New LED, comprise the aluminium base and the insulation injection molded layers that connect in the injection moulding mode mutually, it is characterized in that: the two-piece type structure of described aluminium base for being arranged side by side about directly not linking to each other, a slice is a positive plate, another sheet is a negative plate; Described insulation injection molded layers comprises an injection-molded body and a plurality of injection moulding connecting pin, this injection-molded body is positioned at the top of described aluminium base, described insulation injection-molded body is provided with a depression and penetrates the reflector of the half cone bodily form of this injection-molded body, described injection moulding connecting pin is up-narrow and down-wide structure, and what be distributed in described reflector also vertically runs through described aluminium base to be connected and fixed on every side.
2, the encapsulating structure of the single base of a kind of New LED according to claim 1, it is characterized in that: described injection-molded body is a square structure, the outer rim of described aluminium base is parallel with the outer rim of described injection-molded body, and the left and right sides outer rim of aluminium base is protruded the outer rim of described injection-molded body.
3, the encapsulating structure of the single base of a kind of New LED according to claim 2 is characterized in that: described aluminium base comprises an aluminium lamination, an insulating barrier, a bronze medal layer and a silver coating that is provided with from bottom to top.
4, the encapsulating structure of the single base of a kind of New LED according to claim 2, it is characterized in that: described positive plate is narrow shape rectangle, the inboard ladder hypotenuse that is provided with the evagination of front and back symmetry again in the middle of this narrow shape is rectangular, and the roundlet arc limit of the subsidiary evagination in the centre of ladder hypotenuse; Described negative plate is wide shape rectangle, and the rectangular middle inboard orthodrome limit that is provided with an evagination again of this wide shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201390574U CN201430163Y (en) | 2009-06-25 | 2009-06-25 | Novel LED single-base packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201390574U CN201430163Y (en) | 2009-06-25 | 2009-06-25 | Novel LED single-base packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201430163Y true CN201430163Y (en) | 2010-03-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201390574U Expired - Fee Related CN201430163Y (en) | 2009-06-25 | 2009-06-25 | Novel LED single-base packaging structure |
Country Status (1)
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| CN (1) | CN201430163Y (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101894833A (en) * | 2010-06-21 | 2010-11-24 | 深圳市瑞丰光电子股份有限公司 | LED module and LED lighting device |
| CN102163663A (en) * | 2011-03-11 | 2011-08-24 | 深圳市瑞丰光电子股份有限公司 | Manufacturing process of low-power TOP LED (light-emitting diode) support, and product and LED module thereof |
| WO2011140940A1 (en) * | 2010-05-13 | 2011-11-17 | Shen Lihao | Led encapsulation structure with simple structure |
| CN105185893A (en) * | 2015-09-29 | 2015-12-23 | 广东长盈精密技术有限公司 | Light-emitting diode (LED) package structure |
| WO2019095542A1 (en) * | 2017-11-20 | 2019-05-23 | 湖南粤港模科实业有限公司 | Package structure for led light source |
| CN110061117A (en) * | 2019-05-08 | 2019-07-26 | 福建天电光电有限公司 | A kind of emitting semiconductor package support moulding process |
-
2009
- 2009-06-25 CN CN2009201390574U patent/CN201430163Y/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011140940A1 (en) * | 2010-05-13 | 2011-11-17 | Shen Lihao | Led encapsulation structure with simple structure |
| CN101894833A (en) * | 2010-06-21 | 2010-11-24 | 深圳市瑞丰光电子股份有限公司 | LED module and LED lighting device |
| CN102163663A (en) * | 2011-03-11 | 2011-08-24 | 深圳市瑞丰光电子股份有限公司 | Manufacturing process of low-power TOP LED (light-emitting diode) support, and product and LED module thereof |
| CN105185893A (en) * | 2015-09-29 | 2015-12-23 | 广东长盈精密技术有限公司 | Light-emitting diode (LED) package structure |
| CN105185893B (en) * | 2015-09-29 | 2018-02-06 | 东莞智昊光电科技有限公司 | LED encapsulation structure |
| WO2019095542A1 (en) * | 2017-11-20 | 2019-05-23 | 湖南粤港模科实业有限公司 | Package structure for led light source |
| CN110061117A (en) * | 2019-05-08 | 2019-07-26 | 福建天电光电有限公司 | A kind of emitting semiconductor package support moulding process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: FUJIAN WANBAN OPTOELECTRONICS TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: FUJIAN ZHONGKE WANBAN OPTRONICS CO., LTD. Effective date: 20110322 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20110322 Address after: Gao Village of Huating town of Putian city in 351100 in Fujian Province, Chengxiang District Patentee after: Fujian Wanban optoelectronic Technology Co., Ltd. Address before: Gao Village of Huating town of Putian city in 351100 in Fujian Province, Chengxiang District Patentee before: Fujian Zhongkewanbang Photoelectric Shares Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100324 Termination date: 20150625 |
|
| EXPY | Termination of patent right or utility model |