CN105185893A - Light-emitting diode (LED) package structure - Google Patents
Light-emitting diode (LED) package structure Download PDFInfo
- Publication number
- CN105185893A CN105185893A CN201510642591.7A CN201510642591A CN105185893A CN 105185893 A CN105185893 A CN 105185893A CN 201510642591 A CN201510642591 A CN 201510642591A CN 105185893 A CN105185893 A CN 105185893A
- Authority
- CN
- China
- Prior art keywords
- reflector
- reflecting surface
- electrode block
- encapsulation structure
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005538 encapsulation Methods 0.000 claims description 30
- 238000004806 packaging method and process Methods 0.000 claims description 20
- 238000005452 bending Methods 0.000 claims description 5
- 238000002955 isolation Methods 0.000 claims description 2
- 239000012212 insulator Substances 0.000 abstract description 6
- 238000002347 injection Methods 0.000 abstract description 4
- 239000007924 injection Substances 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 238000005192 partition Methods 0.000 abstract 1
- 238000004020 luminiscence type Methods 0.000 description 6
- 238000007493 shaping process Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to a light-emitting diode (LED) package structure, which comprises a metal bracket, an insulated reflector cup, an LED chip and a package body, wherein the insulated reflector cup is combined with the metal bracket; the LED chip is arranged on the metal bracket and is located in the reflector cup; the package body is located in the reflector cup and covers the LED chip; a first reflection surface, a step surface and a second reflection surface are arranged in the reflector cup; the step surface partitions the first reflection surface and the second reflection surface; the first reflection surface is closer to the bottom of the reflector cup than the second reflection surface; the package body covers the first reflection surface; and the second reflection surface is exposed outside the package body. The package body covers the first reflection surface which is close to the bottom of the reflector cup while the second reflection surface which is relatively far away from the bottom of the reflector cup is exposed, so that excessive losses of light caused by the package body can be avoided; and the brightness of the LED chip can be improved under the condition that other conditions are consistent. Therefore, the brightness requirements are met; the reflector cup can be molded by an insulator in an injection manner; and the LED package structure has the advantage of low cost.
Description
Technical field
The present invention relates to light-emitting diode field, particularly relate to a kind of LED encapsulation structure.
Background technology
LED, as the emerging light source of one, has been widely used in the fields such as illumination, display.Before LED is used to the fields such as illumination, display, needs encapsulate, and to protect, LED luminescence chip is not contaminated, damage.General LED encapsulation structure comprises the light transmission package of metallic support and coated metal support.LED luminescence chip to be arranged on metallic support and to reach electric connection with metallic support, and light transmission package encapsulates LED luminescence chip with isolated external environment condition.Metallic support is connected the electric energy for providing needed for the luminescence of LED luminescence chip with external power source.
Existing a kind of computer indicating lamp that is applied to is to provide the LED encapsulation structure of signal designation, and adopt metallic support as reflector, the light reflection sent by LED luminescence chip is to encapsulating structure.But it is comparatively large that metallic support makes reflector cost, is unfavorable for market competition.Also have and arrange insulator on metallic support, using insulator as reflector, but the light reflection performance of insulator is not as good as metallic support, can not meet environment that LED encapsulation structure applies to the requirement of brightness.
Summary of the invention
Based on this, be necessary for the problems referred to above, provide a kind of cost lower, there is the LED encapsulation structure compared with high brightness simultaneously.
A kind of LED encapsulation structure, comprise metallic support, the dielectric reflective cup be combined with metallic support, to be arranged on metallic support and to be positioned at the LED chip of reflector, and be positioned at reflector and cover the packaging body of LED chip, the first reflecting surface, step surface and the second reflecting surface is provided with in described reflector, described step surface separates described first reflecting surface and the second reflecting surface, described first reflecting surface is compared with the bottom of the second reflecting surface near reflector, described packaging body covers described first reflecting surface, and described second reflecting surface is exposed to outside packaging body.
Above-mentioned LED encapsulation structure, packaging body is covered the first reflecting surface bottom reflector, and make relatively exposed away from the second reflecting surface bottom reflector, packaging body can be avoided the too much loss of light, when other are consistent, the luminosity of LED chip can be made to promote, thus meet brightness requirement, and reflector by insulator injection mo(u)lding, can have advantage with low cost, thus LED encapsulation structure provided by the invention has the advantage of low cost and high brightness concurrently.
Accompanying drawing explanation
The schematic top plan view of the LED encapsulation structure that Fig. 1 provides for one embodiment of the invention.
Fig. 2 is the elevational schematic view of LED encapsulation structure shown in Fig. 1.
Fig. 3 is the generalized section of LED encapsulation structure shown in Fig. 1.
Embodiment
As shown in Figure 1, a kind of LED encapsulation structure that one embodiment of the invention provides, comprise metallic support 10, the dielectric reflective cup 20 be combined with metallic support 10, to be arranged on metallic support 10 and to be positioned at the LED chip 30 of reflector 20, and be positioned at reflector 20 and cover the packaging body (not shown) of LED chip 30.
Simultaneously referring to figs. 2 and 3, described metallic support 10 comprises the first electrode block 11 and the second electrode block 12 of mutual electrical isolation, and described LED chip 30 to be fixed on the first electrode block 11 and to be electrically connected with first, second electrode block 11,12 respectively by wire 31.First electrode block 11 and the second electrode block 12 are made up of the metal material such as copper etc. with high thermal conductivity coefficient and good electrical conductivity.First electrode block 11 and the second electrode block 12, simultaneously also can the heats that produce when working of Quick diffusing LED chip 30 for providing passage for LED chip 30 is connected external power source.First electrode block 11 and the second electrode block 12 are all roughly in plate-like.First electrode block 11 has a upper surface 111 and relative a lower surface 112.Second electrode block 12 has a upper surface 121 and relative a lower surface 122.Wherein the upper surface 111 of the first electrode block 11 and the upper surface 121 of the second electrode block 12 flush, and the lower surface 112 of the first electrode block 11 and the lower surface 122 of the second electrode block 12 flush.The upper surface 111 of the first electrode block 11 and the upper surface 121 of the second electrode block 12 part exposed in reflector 20 forms the bottom of reflector 20, LED chip 30 is fixed on the bottom of this reflector 20, is in particular the upper surface 111 being fixed on the first electrode block 11.Understandably, in other embodiments, LED chip 30 also can be fixed on the upper surface 121 of the second electrode block 12.
Described metallic support 10 is usually one-body molded by injection molding process with reflector 20.That is, be placed in mould by the metallic support 10 with both shaped, the shaping described reflector 20 of recycling Shooting Technique, makes reflector 20 be combined with metallic support 10.In order to improve the binding ability of metallic support 10 and reflector 20, the shape of the present invention to metallic support 10 makes improvements.Particularly, in one embodiment, described first electrode block 11 extends to form a projection 13 towards the second electrode block 12, and described reflector 20 is combined with described projection 13 and has bending joint face.By arranging projection 13, the joint face that reflector 20 is combined with the first electrode block 11 is flexure plane, both bonding strengths can be reinforced, also linkage interface can be extended simultaneously, promote packaging air tightness, delay external moisture etc. and enter reflector 20 inside from the bottom of LED encapsulation structure along joint face negative effect is caused to LED chip 30.
Further, described second electrode 12 is towards the first electrode block 11 also extensible formation one projection 14, and described reflector 20 is combined with described projection 14 and has bending joint face.
In certain embodiments, when working to prevent LED encapsulation structure further, it is inner that external moisture etc. enter reflector 20 along metallic support 10 and the joint face of reflector 20, also can arrange depression 113 on the upper surface 111 of described first electrode block 11, described reflector 20 is combined with described depression 113 and has the joint face of bending indentation.
Similarly, also can arrange depression 123 on the upper surface 121 of the second electrode block 12, described reflector 20 is combined with described depression 123 and has the joint face of bending indentation.
Further, also can arrange perforation 114 on described first electrode block 11, described reflector 20 is combined with described perforation 114.By arranging perforation 114, can be filled in when making reflector 20 shaping in this perforation 114, the bond strength of reflector 20 and the first electrode block 11 can be promoted.In addition in certain embodiments, the structures such as fixed leg when described perforation 114 also can be used for shaping in mould plug and enter, to locate described first electrode block 11.Thus in forming process, except a part of space of the perforation 114 occupied except mould dependency structure, other segment space is filled by reflector 20, and in performance LED encapsulation structure after shaping, namely reflector 20 is combined with 114 parts of boring a hole.
Similarly, in other embodiments, the second electrode block 12 also can arrange perforation 124, described reflector 20 is combined with described perforation 124.Be appreciated that reflector 20 also can be combined with perforation 124 part.
Described reflector 20 is for reflecting LED chip 30 isolychns being positioned at reflector 20, to reach the demand such as brightness and shooting angle.The first reflecting surface 21, step surface 23 and the second reflecting surface 22 is provided with in described reflector 20, described step surface 23 separates described first reflecting surface 21 and the second reflecting surface 22, described first reflecting surface 21 compared with the second reflecting surface 22 near the bottom of reflector 20, described packaging body covers described first reflecting surface 21, and described second reflecting surface 22 is exposed to outside packaging body.
In the present invention, packaging body is covered the first reflecting surface 21 bottom reflector 20, and make relatively exposed away from the second reflecting surface 22 bottom reflector 20, packaging body can be avoided the too much loss of light, when other are consistent, the luminosity of LED chip 30 can be made to promote, thus meet brightness requirement, and reflector 20 is by insulator injection mo(u)lding, have advantage with low cost, thus LED encapsulation structure provided by the invention has the advantage of low cost and high brightness concurrently.LED encapsulation structure provided by the invention is preferred for the indicator light on computer, such as electric power starting instruction, hard disk running instruction etc.
Further, the angle a between described first reflecting surface 21 and the bottom of reflector 20 is larger than the angle b between described second reflecting surface 22 and the bottom of reflector 20.Particularly, the angle a between the first reflecting surface 21 and the bottom of reflector 20,5-10 degree larger than the angle b between described second reflecting surface 22 and the bottom of reflector 20.
In one embodiment, the angle a between described first reflecting surface 21 and the bottom of reflector 20 is 115-120 degree, and the angle b between described second reflecting surface 22 and the bottom of reflector 20 is 105-110 degree.
By the angle a between the first reflecting surface 21 and the bottom of reflector 20, larger than the angle b between described second reflecting surface 22 and the bottom of reflector 20, the light of preliminary injection from packaging body can be made to be had the second reflecting surface 22 gathering effect reflect further, make light be concentrated focusing, thus be conducive to the luminance raising of LED encapsulation structure.
In certain embodiments, the width D of described step surface 23 is 0.5-1.5mm.If the width of step surface 23 is excessive, the volume of whole LED encapsulation structure can be caused to become large, product real needs can not be met, if the width of step surface 23 is too small, does not reach the requirement of fiber line conversion, can not embody the change of light luminance.
Further, in certain embodiments, described step surface 23 is also exposed to outside packaging body.Particularly, step surface 23 is for being parallel to the plane bottom reflector 20.Packaging body can be made up of materials such as the resins of printing opacity.Packaging body can be the flat surface flushing in step surface 23, also can be protruding cambered surface.
Further, described LED chip 30, wire are all positioned under step surface 23, packaging body is encapsulated completely, covers described LED chip 30 and wire.
Each technical characteristic of the above embodiment can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, be all considered to be the scope that this specification is recorded.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be construed as limiting the scope of the patent.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a LED encapsulation structure, comprise metallic support, the dielectric reflective cup be combined with metallic support, to be arranged on metallic support and to be positioned at the LED chip of reflector, and be positioned at reflector and cover the packaging body of LED chip, it is characterized in that, the first reflecting surface, step surface and the second reflecting surface is provided with in described reflector, described step surface separates described first reflecting surface and the second reflecting surface, described first reflecting surface is compared with the bottom of the second reflecting surface near reflector, described packaging body covers described first reflecting surface, and described second reflecting surface is exposed to outside packaging body.
2. LED encapsulation structure according to claim 1, is characterized in that, the angle between described first reflecting surface and the bottom of reflector is 115-120 degree, and the angle between described second reflecting surface and the bottom of reflector is 105-110 degree.
3. LED encapsulation structure according to claim 1, is characterized in that, the angle between described first reflecting surface and the bottom of reflector, 5-10 degree larger than the angle between described second reflecting surface and the bottom of reflector.
4. LED encapsulation structure according to claim 1, is characterized in that, the width of described step surface is 0.5-1.5mm.
5. LED encapsulation structure according to claim 1, is characterized in that, described step surface is exposed to outside packaging body.
6. LED encapsulation structure according to claim 1, it is characterized in that, described metallic support comprises the first electrode block and second electrode block of mutual electrical isolation, and described LED chip to be fixed on the first electrode block and to be electrically connected with first, second electrode block respectively by wire.
7. LED encapsulation structure according to claim 6, is characterized in that, described LED chip, wire are all positioned under step surface.
8. LED encapsulation structure according to claim 6, it is characterized in that, described first electrode block extends to form a projection towards the second electrode block, and/or described second electrode extends to form a projection towards the first electrode block, and described reflector is combined with described projection and has bending joint face.
9. LED encapsulation structure according to claim 6, is characterized in that, described first electrode block and/or the second electrode block arrange perforation, and described reflector and described perforation combine or partly combine.
10. LED encapsulation structure according to claim 6, is characterized in that, described first electrode block and/or the second electrode block arrange depression, and described reflector and described depression combine and have jagged joint face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510642591.7A CN105185893B (en) | 2015-09-29 | 2015-09-29 | LED encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510642591.7A CN105185893B (en) | 2015-09-29 | 2015-09-29 | LED encapsulation structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105185893A true CN105185893A (en) | 2015-12-23 |
| CN105185893B CN105185893B (en) | 2018-02-06 |
Family
ID=54907860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510642591.7A Active CN105185893B (en) | 2015-09-29 | 2015-09-29 | LED encapsulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105185893B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106328642A (en) * | 2016-10-18 | 2017-01-11 | 深圳成光兴光电技术股份有限公司 | Chip LED for mixed light source |
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|---|---|---|---|---|
| CN201429032Y (en) * | 2009-06-25 | 2010-03-24 | 福建中科万邦光电股份有限公司 | Novel LED parallel module packaging structure |
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| US20110278601A1 (en) * | 2010-05-14 | 2011-11-17 | Advanced Optoelectronic Technology, Inc. | Light emitting diode package |
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| CN102569600A (en) * | 2011-11-11 | 2012-07-11 | 深圳市瑞丰光电子股份有限公司 | LED (light emitting diode) packaging structure and reflection cup thereof |
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| CN204651351U (en) * | 2015-04-29 | 2015-09-16 | 吴玉霞 | There is the light-emitting diode of high light-emitting rate |
| CN205016561U (en) * | 2015-09-29 | 2016-02-03 | 广东长盈精密技术有限公司 | Led packaging structure |
-
2015
- 2015-09-29 CN CN201510642591.7A patent/CN105185893B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201429032Y (en) * | 2009-06-25 | 2010-03-24 | 福建中科万邦光电股份有限公司 | Novel LED parallel module packaging structure |
| CN201430163Y (en) * | 2009-06-25 | 2010-03-24 | 福建中科万邦光电股份有限公司 | Novel LED single-base packaging structure |
| US20110278601A1 (en) * | 2010-05-14 | 2011-11-17 | Advanced Optoelectronic Technology, Inc. | Light emitting diode package |
| CN102227011A (en) * | 2011-05-13 | 2011-10-26 | 华中科技大学 | Reflector cup and method for controlling geometric shape of fluorescent powder layer in LED (light-emitting diode) packaging by using same |
| CN102569600A (en) * | 2011-11-11 | 2012-07-11 | 深圳市瑞丰光电子股份有限公司 | LED (light emitting diode) packaging structure and reflection cup thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106328642A (en) * | 2016-10-18 | 2017-01-11 | 深圳成光兴光电技术股份有限公司 | Chip LED for mixed light source |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105185893B (en) | 2018-02-06 |
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