CN208797041U

CN208797041U - A kind of LED package

Info

Publication number: CN208797041U
Application number: CN201821589964.4U
Authority: CN
Inventors: 李若尧
Original assignee: Individual
Current assignee: Individual
Priority date: 2018-09-28
Filing date: 2018-09-28
Publication date: 2019-04-26
Anticipated expiration: 2028-09-28

Abstract

The utility model relates to a kind of LED packages, including with package support, LED chip and packing colloid, the LED chip die bond is on the package support, the packing colloid covers LED chip, the package support has a cavity formed by plastic-sealed body, there are spaced multiple grooves on the side wall of the cavity, there is a thermally conductive sheet in each groove, the shape of each thermally conductive sheet is identical as the shape of the groove where it, the lateral wall of all thermally conductive sheets and the side wall of cavity collectively form the side wall of the bowl of the package support, to solve the problems, such as that the packing colloid of existing LED package easily occurs to be detached from package support.

Description

A kind of LED package

Technical field

The utility model relates to LED encapsulation fields, are specifically related to a kind of LED package.

Background technique

With the fast development of Light-emitting diode LED technology, the performances such as brightness, service life of LED have all obtained greatly mentioning It rises, so that the application field of LED is more and more extensive, the room lightings such as from outdoor lightings such as street lamps to ornament lamp are numerous and confused to use Or LED is replaced with as light source.Meanwhile LED is with high-efficient, the service life is long, power and energy saving, vibration strength is good, reaction speed is fast, can By property height, Environmental Safety, without the harmful substances such as Hg the advantages that, be more and more widely used every field in illumination.

The encapsulating structure of LED surface pasting type (SMD) applies the advantages such as convenient and small in size to have become master due to it The packing forms wanted.LED surface surface mount package structure commonly used in the prior art generally comprises a bracket, has one in bracket The LED chip being mounted on by die bond technique in bracket.Rack surface is provided with metal lead wire, the metal in LED chip two sides Electrode is provided on lead, the positive and negative electrode of LED chip is electrically connected with the electrode on bracket respectively by gold thread.But due to envelope The thermal expansion coefficient difference filled between bracket and packing colloid is larger, and packing colloid can occur after working long hours for LED lamp bead The phenomenon that being detached between package support can enter to inside package support so as to cause external steam, influence LED lamp bead Service life.

Utility model content

The utility model is intended to provide a kind of LED package, is easily occurred with solving the packing colloid of existing LED package The problem of being detached from package support.

Concrete scheme is as follows:

A kind of LED package, including with package support, LED chip and packing colloid, the LED chip die bond is being sealed It fills on bracket, the packing colloid covers LED chip, and the package support has a cavity formed by plastic-sealed body, should There are spaced multiple grooves on the side wall of cavity, there is a thermally conductive sheet, the shape of each thermally conductive sheet in each groove Identical as the shape of the groove where it, the lateral wall of all thermally conductive sheets and the side wall of cavity collectively form the encapsulation branch The side wall of the bowl of frame.

Further, each thermally conductive sheet all on package support anode or cathode connect.

Further, the anode on each thermally conductive sheet package support all connected to it or cathode are integrally formed.

Further, each thermally conductive sheet all has an extension bent outside toward bowl, the top surface of the extension and encapsulation The top surface of bracket flushes.

Further, also have on the free end of the extension of the thermally conductive sheet and extend in the plastic-sealed body of package support Fixed part.

LED package provided by the utility model has the advantage that the utility model provides compared with prior art LED package multiple thermally conductive sheets are inserted on the side wall of bowl, enable be located at bowl in packing colloid with it is thermally conductive Piece directly contacts, to improve the heat-sinking capability of packing colloid, can reduce because between package support and packing colloid because heat is swollen Swollen difference of coefficients leads to the probability being detached between packing colloid and package support, to improve the service life of LED package.

Detailed description of the invention

Fig. 1 shows the stereoscopic schematic diagram of LED package.

Fig. 2 shows the cross-sectional views of LED package.

Fig. 3 shows the cross-sectional view of another LED package.

Specific embodiment

To further illustrate each embodiment, the utility model is provided with attached drawing.These attached drawings are in the utility model discloses A part of appearance mainly to illustrate embodiment, and can cooperate the associated description of specification former come the running for explaining embodiment Reason.Cooperation refers to these contents, and those of ordinary skill in the art will be understood that other possible embodiments and sheet are practical new The advantages of type.Component in figure is not necessarily to scale, and similar component symbol is conventionally used to indicate similar component.

Now in conjunction with the drawings and specific embodiments, the present invention will be further described.

As depicted in figs. 1 and 2, the utility model provides a kind of LED package, which includes having bowl Package support 1, LED chip 2 and packing colloid 3, wherein package support 1 include insulation plastic-sealed body 10 and be fixed on plastic packaging The first metallic support 12 and the second metallic support 14 on body 10 and as positive and negative electrode, the first metallic support 12 and the second gold medal Belong in the electric isolution passed through between bracket 14 realization of insulation river 16 between the two and insulation river 16 filled with plastic-sealed body 10, institute It states and also forms a cavity 18 on plastic-sealed body 10, wherein plastic-sealed body 10 can be made of materials such as PPA, EMC, and described here first Metallic support 12 and the second metallic support 14 are usually copper as rack body, in outer plating nickel on surface and mirror surface silver layer.At this In embodiment, the section of cavity 18 is rectangle, and but not limited to this, can also be other shapes, such as round, polygon Deng.In the present embodiment, LED chip 2 is packed LED chip, therefore LED chip 2 is fixed in cavity 18 by crystal-bonding adhesive, and It is electrically connected by bonding line 20 and the first metallic support 12 and the realization of the second metallic support 14, but not limited to this, can also be with LED chip 2 is also possible to flip-chip or vertical chip.Packing colloid 3 covers LED chip 2, to prevent extraneous water Vapour enters in cavity 18.

It is between package support and existing package support in the present embodiment the difference is that, with reference to Fig. 1 and Fig. 2, this is recessed There are spaced multiple grooves on the side wall of chamber 18, there is a thermally conductive sheet 40 in each groove, each thermally conductive sheet 40 Shape is identical as the shape of the groove where it, i.e., thermally conductive sheet 40 is just complementary with groove, so that all thermally conductive sheets 40 is outer The side wall 180 of side wall 400 and cavity 18 collectively forms the side wall of the bowl of the package support, i.e. encapsulation in the present embodiment The bowl of bracket is collectively formed by thermally conductive sheet 40 and cavity 18.

It is encapsulated with reference to Fig. 1 and Fig. 2 since the packing colloid 3 being located in bowl can directly be contacted with thermally conductive sheet 40 The heat of colloid 3 can be conducted to outside by thermally conductive sheet 40 and be radiated, therefore the heat radiation energy of packing colloid 3 can be improved Power, to reduce the temperature of packing colloid 3, and since the adhesive force between packing colloid 3 (usually silica gel) and metal is wanted It is got well than the adhesive force between package support, even if the temperature of thermally conductive sheet 40 can be higher than plastic-sealed body, it is existing to be also less likely to occur removing As, thus the probability removed between packing colloid and package support is also reduced, extend the service life of the LED package.

With reference to Fig. 1 and Fig. 2, each thermally conductive sheet 40 all on package support as first metallic support 12 of anode or It is connected with the second metallic support 14 as cathode, so as to conduct a part of heat on thermally conductive sheet 40 to the first metal Bracket 12 is perhaps finally conducted via to printed circuit board or radiator to the external world on the second metallic support 14, to improve 3 heat-sinking capability of packing colloid.

Wherein, it is preferred that the first metallic support on each package support all connected to it of thermally conductive sheet 40 as anode 12 or with as cathode the second metallic support 14 integrated molding.For example, thermally conductive sheet 40 and the firstth metallic support 12 or Second metallic support 14 can be once punched by stamping forming mode.

With reference to Fig. 3, as the preferred embodiment of thermally conductive sheet 40, what each thermally conductive sheet 40 was all bent with one toward bowl outside Extension 402, the top surface of the extension 402 are flushed with the top surface of package support, i.e. the top surface of extension 402 is exposed in the external world In, therefore a part of heat of thermally conductive sheet 40 can be distributed directly into outside air, to improve dissipating for the thermally conductive sheet 40 Thermal energy power, the final temperature for reducing packaging body 3.

It is further preferred that also having on the free end of the extension 402 of the thermally conductive sheet 40 toward encapsulation with reference to Fig. 3 The fixed part 404 extended in the plastic-sealed body 10 of bracket, to guarantee that thermally conductive sheet 40 can be stably fixed in plastic-sealed body 10.

Although specifically showing and describing the utility model in conjunction with preferred embodiment, those skilled in the art is answered This is understood, in the spirit and scope for not departing from the utility model defined by the appended claims, in form and details On the utility model can be made a variety of changes, be the protection scope of the utility model.

Claims

1. a kind of LED package, including with package support, LED chip and packing colloid, the LED chip die bond is being encapsulated On bracket, the packing colloid covers LED chip, it is characterised in that: the package support has one to be formed by plastic-sealed body Cavity, there are on the side wall of the cavity spaced multiple grooves, there is a thermally conductive sheet in each groove, it is each thermally conductive The shape of piece is identical as the shape of the groove where it, and the lateral wall of all thermally conductive sheets and the side wall of cavity collectively form institute State the side wall of the bowl of package support.

2. LED package according to claim 1, it is characterised in that: each thermally conductive sheet all with the anode on package support Or cathode connection.

3. LED package according to claim 2, it is characterised in that: each thermally conductive sheet package support all connected to it On anode or cathode be integrally formed.

4. LED package according to claim 1, it is characterised in that: each thermally conductive sheet all has one to bend outside toward bowl Extension, the top surface of the extension is flushed with the top surface of package support.

5. LED package according to claim 4, it is characterised in that: on the free end of the extension of the thermally conductive sheet Also there is the fixed part extended in the plastic-sealed body of package support.