CN211045476U

CN211045476U - L ED lamp bead of die bond paster

Info

Publication number: CN211045476U
Application number: CN202020064550.0U
Authority: CN
Inventors: 刘奇
Original assignee: Zhongshan Shenglang Electronic Technology Co ltd
Current assignee: Zhongshan Shenglang Electronic Technology Co ltd
Priority date: 2020-01-13
Filing date: 2020-01-13
Publication date: 2020-07-17
Anticipated expiration: 2030-01-13

Abstract

The utility model belongs to the technical field of L ED lamp, especially, L ED lamp pearl of solid brilliant paster, including the mounting panel, install the packaging body on the mounting panel and encapsulate luminous element inside the packaging body, the radiating piece is installed at the top of mounting panel, the radiating piece includes radiating disc and a plurality of fin, the radiating disc is ring shape, through setting up the radiating piece at the top of mounting panel, wherein the radiating piece includes annular radiating disc to and fix the fin of the inboard vertical distribution of a plurality of radiating disc, the top at the mounting panel is installed to the radiating disc, the fin inlays and establishes in the outer wall a week of packaging body, the radiating piece is the copper product, metallic copper's thermal conductivity will be good for epoxy, the heat that the radiating piece can send L ED lamp pearl when using derives, the radiating piece is bigger with the contact surface of air, can increase thermal exchange degree, thereby for current structure, can accelerate the heat dissipation of lamp pearl, improve the radiating efficiency of lamp pearl.

Description

L ED lamp bead of die bond paster

Technical Field

The utility model belongs to the technical field of L ED lamp, concretely relates to L ED lamp pearl of solid brilliant paster.

Background

L ED is a chip of electroluminescent semiconductor material, which is solidified on the bracket by silver glue or white glue, then the chip and the circuit board are connected by silver wire or gold thread, then the periphery is sealed by epoxy resin, which protects the inner core wire, finally the shell is installed, so the L ED lamp has good anti-seismic performance.

Current L ED lamp pearl basically can be sealed at L ED chip's outside encapsulation epoxy, and the lens shape is made to epoxy's tip simultaneously, can be with the light gathering, but in the spotlight, the heat also can gather on the packaging body, and the heat is difficult to dissipate, leads to the temperature of present L ED lamp pearl higher when luminous.

SUMMERY OF THE UTILITY MODEL

The utility model provides an L ED lamp pearl of solid brilliant paster to solve the problem that proposes in the above-mentioned background art.

In order to achieve the purpose, the utility model provides a L ED lamp pearl of solid brilliant paster, including the mounting panel, install the packaging body on the mounting panel and encapsulate in the inside light-emitting component of packaging body, the heat dissipation piece is installed at the top of mounting panel, the heat dissipation piece includes heat dissipation dish and a plurality of fin, the heat dissipation dish is ring shape, the fin is the rectangle slice, and is a plurality of the fin evenly distributed is in the inboard of heat dissipation dish, just the fin with heat dissipation dish fixed connection, the packaging body is the cylinder, the height of fin is greater than the height of packaging body, the top fixed mounting of fin has lens, lens with the heat dissipation window has between the packaging body, the bottom of mounting panel is equipped with two pins, the pin with light-emitting component fixed connection.

Preferably, the heat sink is embedded in the outer side wall of the package body, and the heat sink is fixedly connected with the package body.

Preferably, light emitting component includes first support and second support, the top of second support has set firmly the chip mounting bracket, install L ED chip in the chip mounting bracket, the both ends of L ED chip all are equipped with the gold thread, L ED chip passes through the gold thread with first support and second support fixed connection.

Preferably, the inner side wall of the chip mounting rack is a pyramid-shaped reflecting surface.

Preferably, a fluorescent packaging body is arranged at the top of the chip mounting frame, and the L ED chip is fixed in the chip mounting frame through the fluorescent packaging body.

Preferably, the lens is a convex lens, and the lens is made of colorless and transparent epoxy resin.

Preferably, the top surface of the package body is a plane or a convex arc surface.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses in, set up the radiating piece through the top at the mounting panel, wherein the radiating piece includes annular heat dissipation dish, and fix the fin at the vertical distribution of a plurality of heat dissipation dish inboard, the top at the mounting panel is installed to the heat dissipation dish, the fin inlays and establishes outer wall a week at the packaging body, the radiating piece is the copper product, metallic copper's thermal conductivity will be good for epoxy, the heat that the radiating piece can send L ED lamp pearl when using is derived, the radiating piece is bigger with the contact surface of air, can increase thermal exchange degree, thereby for current structure, can accelerate the heat dissipation of lamp pearl, improve the radiating efficiency of lamp pearl.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic perspective view of the present invention;

FIG. 3 is a schematic sectional view of the present invention;

fig. 4 is a schematic structural diagram of the present invention.

In the figure, the LED packaging structure comprises a mounting board 1, a mounting board 11, pins 2, a packaging body 201, a heat dissipation window 3, a heat dissipation piece 31, a heat dissipation disc 32, a heat dissipation piece 4, a lens 5, a light emitting component 51, a first support 52, a second support 53, a chip mounting support 54, a fluorescent packaging body 55, an L ED chip 56 and gold wires.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the utility model provides a L ED lamp bead of solid crystal paster, including mounting panel 1, install packaging body 2 and the luminescent component 5 of packaging body 2 inside on mounting panel 1, the top of mounting panel 1 is installed and is dispelled heat piece 3, heat piece 3 includes radiating disc 31 and a plurality of fin 32, radiating disc 31 is the ring shape, fin 32 is the rectangular sheet, a plurality of fin 32 evenly distributed is in the inboard of radiating disc 31, and fin 32 and radiating disc 31 fixed connection, through set up radiating piece 3 at the top of mounting panel 1, radiating piece 3 includes annular radiating disc 31, and fix a plurality of vertical radiating fin 32 of distributing in radiating disc 31 inboard, radiating disc 31 installs at the top of mounting panel 1, fin 32 inlays and establishes in the outer wall of packaging body 2 a week, radiating piece 3 is the copper material, the heat conductivility of metal copper is good for epoxy, radiating piece 3 can derive the heat that L ED sent out when using, radiating piece 3 is bigger with the contact surface of air, can increase the exchange degree of heat, thereby compared with the existing structure, the lamp bead of lamp bead that can accelerate the radiating efficiency;

the packaging body 2 is a cylinder, the height of the radiating fin 32 is larger than that of the packaging body 2, the lens 4 is fixedly mounted at the top of the radiating fin 32, and the radiating window 201 is arranged between the lens 4 and the packaging body 2, so that a certain distance is formed between the packaging body 2 and the lens 4, the radiating fin 32 plays a supporting role, the contact area of the lens 4, the packaging body 2, the radiating fin 32 and air is increased, and the radiating capacity can be improved.

Specifically, the bottom of mounting panel 1 is equipped with two pins 11, and

11 and 5 fixed connection of light-emitting component can utilize pin 11 to be connected with the circuit board through setting up two pins 11, make lamp pearl circular telegram work.

Specifically, fin 32 inlays to be established on the lateral wall of packaging body 2, fin 32 and packaging body 2 fixed connection, heat dissipation piece 3 is the copper product, metallic copper's thermal conductivity will be good for epoxy, heat that heat dissipation piece 3 can send L ED lamp pearl when using is derived, heat dissipation piece 3 is bigger with the contact surface of air, can increase thermal exchange degree, thereby for current structure, can accelerate the heat dissipation of lamp pearl, improve the radiating efficiency of lamp pearl.

Specifically, light-emitting component 5 includes first support 51 and second support 52, the top of second support 52 has set firmly chip-mounting bracket 53, install L ED chip 55 in the chip-mounting bracket 53, L ED chip 55's both ends all are equipped with gold thread 56, L ED chip 55 passes through gold thread 56 and first support 51 and second support 52 fixed connection, when using, import to L ED chip 55 by two gold threads 56 with the electric current on the pin 11 on, it is luminous to make L ED chip 55 circular telegram, thereby send the effect of converting the electric energy into light energy.

Specifically, the inner side wall of the chip mounting frame 53 is a pyramid-shaped light reflecting surface, so that light emitted by the L ED chip 55 can be refracted to the lens 4 through the packaging body 2, and the light is condensed.

Specifically, the fluorescent package 54 is disposed on the top of the chip mounting bracket 53, and the L ED chip 55 is fixed in the chip mounting bracket 53 through the fluorescent package 54, so that the brightness of the L ED chip 55 during power-on and light-emitting operations can be enhanced.

Specifically, the lens 4 is a convex lens, the lens 4 is made of colorless transparent epoxy resin, and the convex lens made of colorless transparent material can collect light, so that light loss is reduced.

Specifically, the top surface of the package body 2 is a plane or a convex arc surface, and light can be guided onto the lens 4 to be collected.

The utility model discloses a theory of operation and use flow are when using, by two gold threads 56 with the leading-in L ED chip 55 of the electric current on the pin 11 on, make L ED chip 55 circular telegram luminous, thereby send the effect of turning into light energy with the electric energy, through setting up radiating piece 3 at the top of mounting panel 1, radiating piece 32 inlays and establishes outer wall a week at packaging body 2, radiating piece 3 is the copper product, metallic copper's thermal conductivity will be good for epoxy, radiating piece 3 can derive the heat that L ED lamp pearl sent when using, radiating piece 3 is bigger with the contact surface of air, can increase thermal exchange degree, thereby for current structure, can accelerate the heat dissipation of lamp pearl, improve the radiating efficiency of lamp pearl.

In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a L ED lamp pearl of solid brilliant paster, its characterized in that includes mounting panel (1), installs packaging body (2) and encapsulation on mounting panel (1) the inside light emitting component (5) of packaging body (2), radiating piece (3) are installed at the top of mounting panel (1), radiating piece (3) are including heat dissipation dish (31) and a plurality of fin (32), heat dissipation dish (31) are the ring shape, fin (32) are the rectangle piece, and are a plurality of fin (32) evenly distributed is in the inboard of heat dissipation dish (31), just fin (32) with heat dissipation dish (31) fixed connection, packaging body (2) are the cylinder, the height of fin (32) is greater than the height of packaging body (2), the top fixed mounting of fin (32) has lens (4), lens (4) with heat dissipation window (201) have between packaging body (2), the bottom of mounting panel (1) is equipped with two pins (11), pin (11) with light emitting component (5) fixed connection.

2. The L ED lamp bead of die attach patch according to claim 1, wherein the heat sink (32) is embedded on an outer sidewall of the package body (2), and the heat sink (32) is fixedly connected with the package body (2).

3. The L ED lamp bead of die attach patch according to claim 1, wherein the light emitting component (5) comprises a first support (51) and a second support (52), a chip mounting bracket (53) is fixedly arranged at the top of the second support (52), a L ED chip (55) is mounted in the chip mounting bracket (53), gold wires (56) are arranged at both ends of the L ED chip (55), and the L ED chip (55) is fixedly connected with the first support (51) and the second support (52) through the gold wires (56).

4. The L ED lamp bead of die attach patch according to claim 3, wherein the inner side wall of the chip mounting bracket (53) is a pyramid-shaped light-reflecting surface.

5. The L ED lamp bead of die attach patch according to claim 3, wherein a fluorescent package (54) is disposed on the top of the chip mounting bracket (53), and the L ED chip (55) is fixed in the chip mounting bracket (53) through the fluorescent package (54).

6. The L ED lamp bead of die attach patch according to claim 1, wherein the lens (4) is a convex lens, and the lens (4) is made of colorless transparent epoxy resin.

7. The L ED lamp bead of die attach patch according to claim 1, wherein the top surface of the package body (2) is a flat surface or a convex cambered surface.