CN211045476U - A solid chip LED lamp bead - Google Patents

Abstract

The utility model belongs to the technical field of L ED lamp, especially, L ED lamp pearl of solid brilliant paster, including the mounting panel, install the packaging body on the mounting panel and encapsulate luminous element inside the packaging body, the radiating piece is installed at the top of mounting panel, the radiating piece includes radiating disc and a plurality of fin, the radiating disc is ring shape, through setting up the radiating piece at the top of mounting panel, wherein the radiating piece includes annular radiating disc to and fix the fin of the inboard vertical distribution of a plurality of radiating disc, the top at the mounting panel is installed to the radiating disc, the fin inlays and establishes in the outer wall a week of packaging body, the radiating piece is the copper product, metallic copper's thermal conductivity will be good for epoxy, the heat that the radiating piece can send L ED lamp pearl when using derives, the radiating piece is bigger with the contact surface of air, can increase thermal exchange degree, thereby for current structure, can accelerate the heat dissipation of lamp pearl, improve the radiating efficiency of lamp pearl.

Description

A solid chip LED lamp bead

technical field

The utility model belongs to the technical field of LED lamps, in particular to an LED lamp bead with a die-bonding chip.

Background technique

The basic structure of the LED is an electroluminescent semiconductor material chip, which is cured on the bracket with silver glue or white glue, and then connects the chip and the circuit board with silver or gold wires, and then seals the surrounding with epoxy resin to protect the interior The role of the core wire, and finally the housing is installed, so the shock resistance of the LED lamp is good.

The existing LED lamp beads are basically encapsulated with epoxy resin on the outside of the LED chip, and the end of the epoxy resin is made into a lens shape, which can collect light, but when the light is concentrated, heat will also be collected in the package body. On the other hand, the heat is not easy to dissipate, which leads to the high temperature of the current LED lamp beads when emitting light.

Utility model content

The utility model provides an LED lamp bead with a die-bonding chip, so as to solve the problems raised in the above-mentioned background technology.

In order to achieve the above purpose, the present invention provides the following technical solutions: a die-bonded LED lamp bead, comprising a mounting board, a package body mounted on the mounting board, and a light-emitting assembly packaged inside the package body, the A heat sink is installed on the top of the mounting plate. The heat sink includes a heat sink and a number of heat sinks. The heat sink is annular, and the heat sink is rectangular. The inner side of the heat sink, and the heat sink is fixedly connected to the heat sink, the package body is a cylinder, the height of the heat sink is greater than the height of the package body, and the top of the heat sink is fixedly mounted with a lens There is a heat dissipation window between the lens and the package body, and two pins are arranged at the bottom of the mounting plate, and the pins are fixedly connected to the light-emitting component.

Preferably, the heat sink is embedded on the outer sidewall of the package body, and the heat sink is fixedly connected to the package body.

Preferably, the light-emitting assembly includes a first bracket and a second bracket, a chip mounting bracket is fixed on the top of the second bracket, an LED chip is installed in the chip mounting bracket, and both ends of the LED chip are provided with There is a gold wire, and the LED chip is fixedly connected to the first bracket and the second bracket through the gold wire.

Preferably, the inner side wall of the chip mounting frame is a pyramid-shaped reflective surface.

Preferably, a fluorescent package is provided on the top of the chip mount, and the LED chip is fixed in the chip mount through the fluorescent package.

Preferably, the lens is a convex lens, and the lens is made of colorless and transparent epoxy resin.

Preferably, the top surface of the package body is a flat surface or a convex arc surface.

Compared with the prior art, the beneficial effects of the present utility model are:

In the present invention, a heat sink is arranged on the top of the mounting plate, wherein the heat sink includes an annular heat sink, and a plurality of vertically distributed heat sinks fixed on the inner side of the heat sink. The chip is embedded around the outer wall of the package body. The heat sink is made of copper. The thermal conductivity of metal copper is better than that of epoxy resin. If it is larger, the degree of heat exchange will be increased, so compared with the existing structure, the heat dissipation of the lamp beads can be accelerated and the heat dissipation efficiency of the lamp beads can be improved.

Description of drawings

The accompanying drawings are used to provide a further understanding of the present invention, and constitute a part of the specification, and are used to explain the present invention together with the embodiments of the present invention, and do not constitute a limitation to the present invention. In the attached image:

Fig. 1 is the structural representation of the utility model;

Fig. 2 is the three-dimensional structure schematic diagram of the utility model;

Fig. 3 is the sectional structure schematic diagram of the utility model;

FIG. 4 is a schematic structural diagram of the utility model.

In the figure: 1, mounting plate; 11, pin; 2, package body; 201, heat dissipation window; 3, heat sink; 31, heat dissipation plate; 32, heat sink; 4, lens; 5, light-emitting component; A bracket; 52, a second bracket; 53, a chip mounting frame; 54, a fluorescent package; 55, an LED chip; 56, a gold wire.

Detailed ways

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the implementations. example. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.

Please refer to FIGS. 1-4 , the present invention provides the following technical solutions: an LED lamp bead with die-bonding chip, comprising a mounting board 1 , a package body 2 mounted on the mounting board 1 , and a light-emitting device packaged inside the package body 2 Component 5, a heat sink 3 is mounted on the top of the mounting plate 1, and the heat sink 3 includes a heat sink 31 and a plurality of heat sinks 32, the heat sink 31 is annular, the heat sink 32 is a rectangular sheet, and the plurality of heat sinks 32 are evenly distributed On the inner side of the heat dissipation plate 31, and the heat dissipation fins 32 are fixedly connected to the heat dissipation plate 31, a heat dissipation member 3 is provided on the top of the mounting plate 1, wherein the heat dissipation member 3 includes an annular heat dissipation plate 31, and a plurality of heat dissipation plates fixed inside the heat dissipation plate 31. There are vertically distributed heat sinks 32. The heat sink 31 is installed on the top of the mounting board 1. The heat sink 32 is embedded around the outer wall of the package body 2. The heat sink 3 is made of copper, and the thermal conductivity of metal copper is higher than that of epoxy resin. It is better that the heat sink 3 will dissipate the heat emitted by the LED lamp bead during use, and the contact surface between the heat sink 3 and the air will be larger, which will increase the degree of heat exchange, thereby speeding up the heat dissipation of the lamp bead compared to the existing structure. , to improve the heat dissipation efficiency of the lamp beads;

The package body 2 is a cylinder, the height of the heat sink 32 is greater than the height of the package body 2, the lens 4 is fixedly mounted on the top of the heat sink 32, and there is a heat dissipation window 201 between the lens 4 and the package body 2, so that the package body 2 and the lens 4 There is a certain distance between them, and the heat sink 32 plays a supporting role between them, so as to increase the contact area between the lens 4, the package body 2, the heat sink 32 and the air, so that the heat dissipation capability can be improved.

Specifically, the bottom of the mounting board 1 is provided with two pins 11, and the pins 11 are fixedly connected to the light-emitting component 5. By setting the two pins 11, the pins 11 can be used to connect with the circuit board, so that the lamp beads can be powered on.

Specifically, the heat sink 32 is embedded on the outer sidewall of the package body 2 , the heat sink 32 is fixedly connected to the package body 2 , the heat sink 3 is made of copper, and the thermal conductivity of metal copper is better than that of epoxy resin, so it dissipates heat during use. The part 3 will dissipate the heat emitted by the LED lamp beads, and the contact surface of the heat dissipation part 3 with the air will be larger, which will increase the degree of heat exchange, so that compared with the existing structure, the heat dissipation of the lamp beads can be accelerated and the heat dissipation of the lamp beads can be improved. efficiency.

Specifically, the light-emitting assembly 5 includes a first bracket 51 and a second bracket 52 , the top of the second bracket 52 is fixed with a chip mounting frame 53 , the chip mounting frame 53 is mounted with an LED chip 55 , and both ends of the LED chip 55 are provided with There is a gold wire 56, and the LED chip 55 is fixedly connected to the first bracket 51 and the second bracket 52 through the gold wire 56. When in use, the current on the pin 11 is introduced to the LED chip 55 by the two gold wires 56, so that the The LED chip 55 is energized to emit light, so as to achieve the effect of converting electrical energy into light energy.

Specifically, the inner side wall of the chip mounting frame 53 is a pyramid-shaped reflective surface, which can refract the light emitted by the LED chip 55 through the package body 2 to the lens 4 to concentrate the light.

Specifically, the top of the chip mount 53 is provided with a fluorescent package 54 , and the LED chip 55 is fixed in the chip mount 53 through the fluorescent package 54 , which can enhance the brightness of the LED chip 55 when it is powered on and emits light.

Specifically, the lens 4 is a convex lens, the lens 4 is made of colorless and transparent epoxy resin material, and the convex lens of colorless and transparent material can collect light and reduce the loss of light.

Specifically, the top surface of the package body 2 is a flat surface or a convex arc surface, which can guide the light to the lens 4 and collect the light.

The working principle and use process of the utility model: when in use, the current on the pin 11 is introduced to the LED chip 55 by the two gold wires 56, so that the LED chip 55 is energized to emit light, so as to convert the electrical energy into light energy. The heat sink 3 is set on the top of the mounting board 1, and the heat sink 32 is embedded around the outer wall of the package body 2. The heat sink 3 is made of copper, and the thermal conductivity of metal copper is better than that of epoxy resin. The heat sink 3 will conduct the heat emitted by the LED lamp beads, and the contact surface between the heat sink 3 and the air is larger, which will increase the degree of heat exchange, so that compared with the existing structure, the heat dissipation of the lamp beads can be accelerated, and the efficiency of the lamp beads can be improved. cooling efficiency.

In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "vertical", "upper", "lower", "horizontal", etc. is based on the orientation or positional relationship shown in the accompanying drawings, only It is for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

In the description of the present invention, it should also be noted that, unless otherwise expressly specified and limited, the terms "arrangement", "installation", "connection" and "connection" should be understood in a broad sense, for example, it may be a fixed connection It can also be a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or the internal communication between the two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

Finally, it should be noted that the above are only the preferred embodiments of the present invention, and are not intended to limit the present invention. , it is still possible to modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements to some of the technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims (7)

1. The utility model provides a L ED lamp pearl of solid brilliant paster, its characterized in that includes mounting panel (1), installs packaging body (2) and encapsulation on mounting panel (1) the inside light emitting component (5) of packaging body (2), radiating piece (3) are installed at the top of mounting panel (1), radiating piece (3) are including heat dissipation dish (31) and a plurality of fin (32), heat dissipation dish (31) are the ring shape, fin (32) are the rectangle piece, and are a plurality of fin (32) evenly distributed is in the inboard of heat dissipation dish (31), just fin (32) with heat dissipation dish (31) fixed connection, packaging body (2) are the cylinder, the height of fin (32) is greater than the height of packaging body (2), the top fixed mounting of fin (32) has lens (4), lens (4) with heat dissipation window (201) have between packaging body (2), the bottom of mounting panel (1) is equipped with two pins (11), pin (11) with light emitting component (5) fixed connection.

2. The L ED lamp bead of die attach patch according to claim 1, wherein the heat sink (32) is embedded on an outer sidewall of the package body (2), and the heat sink (32) is fixedly connected with the package body (2).

3. The L ED lamp bead of die attach patch according to claim 1, wherein the light emitting component (5) comprises a first support (51) and a second support (52), a chip mounting bracket (53) is fixedly arranged at the top of the second support (52), a L ED chip (55) is mounted in the chip mounting bracket (53), gold wires (56) are arranged at both ends of the L ED chip (55), and the L ED chip (55) is fixedly connected with the first support (51) and the second support (52) through the gold wires (56).

4. The L ED lamp bead of die attach patch according to claim 3, wherein the inner side wall of the chip mounting bracket (53) is a pyramid-shaped light-reflecting surface.

5. The L ED lamp bead of die attach patch according to claim 3, wherein a fluorescent package (54) is disposed on the top of the chip mounting bracket (53), and the L ED chip (55) is fixed in the chip mounting bracket (53) through the fluorescent package (54).

6. The L ED lamp bead of die attach patch according to claim 1, wherein the lens (4) is a convex lens, and the lens (4) is made of colorless transparent epoxy resin.

7. The L ED lamp bead of die attach patch according to claim 1, wherein the top surface of the package body (2) is a flat surface or a convex cambered surface.

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