CN212648272U - High-brightness SMD LED device with full-color display screen - Google Patents
High-brightness SMD LED device with full-color display screen Download PDFInfo
- Publication number
- CN212648272U CN212648272U CN202021566694.2U CN202021566694U CN212648272U CN 212648272 U CN212648272 U CN 212648272U CN 202021566694 U CN202021566694 U CN 202021566694U CN 212648272 U CN212648272 U CN 212648272U
- Authority
- CN
- China
- Prior art keywords
- light
- led device
- emitting chip
- smd led
- display screen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a full-color display screen SMD LED device of hi-lite. The problem that the prior art is square in shape after packaging and molding and is not concentrated in light emitting is solved; the utility model comprises a bracket and a light emitting chip fixedly arranged on the bracket, wherein an LED device is packaged by packaging glue, and the packaging glue is molded to form a light-focusing convex lens; the convex lens comprises a light-gathering part and an auxiliary part which are integrated, the light-gathering part is arranged right above the light-emitting chip, the auxiliary part is arranged around the light-gathering part, and the auxiliary part is matched with the support in shape. The convex lens is formed on the surface of the light-emitting chip after the packaging glue is molded, so that the chip protection and light condensation effects are achieved, the light-emitting efficiency of the SMD LED device is effectively improved, the cost is effectively reduced, and the brightness is improved.
Description
Technical Field
The utility model relates to a LED display screen field especially relates to a full-color display screen SMD LED device of hi-lite.
Background
In a traditional Chip-type packaged full-color LED device, the colloid after molding is square, as shown in fig. 1, when the Chip emits light, the light is emitted through the colloid to the air, and explained by the refraction principle of the light, the light is diffused, so that the light intensity is not high when the light is observed at the best front viewing angle. The traditional full-color LED device packaged in a Chip form has the defects of non-centralized luminescence, and can only meet the requirement of high brightness by high-power input, thereby causing the waste of energy.
For example, a "flip SMD LED package structure" disclosed in chinese patent literature, publication No. CN209822681U includes an SMD holder cup and a flip LED chip, electrodes are disposed at two ends of the flip LED chip, the flip LED chip is mounted inside the SMD holder cup, solder paste is disposed at a connection portion of the inner side of the SMD holder cup and the electrode of the flip LED chip, the solder paste is bonded to the electrodes, and the SMD holder cup and the flip LED chip are bonded by an insulating paste at a position where the electrodes are not disposed. The LED packaging device obtained by the scheme is square in shape, and light emission is not concentrated.
SUMMERY OF THE UTILITY MODEL
The utility model mainly solves the problems that the shape of the packaged and molded product is square and the luminescence is not concentrated in the prior art; the utility model provides a full-color display screen SMD LED device of hi-lite forms convex lens on emitting chip surface after the encapsulation glue shaping, plays the spotlight effect, effectively improves the light-emitting efficiency of SMD LED device, and effective the cost is reduced has promoted luminance.
The above technical problem of the present invention can be solved by the following technical solutions:
a high-brightness SMD LED device of a full-color display screen comprises a support and a light-emitting chip fixedly arranged on the support, wherein the LED device is packaged by packaging glue, and the packaging glue is molded to form a light-gathering convex lens; the convex lens comprises a light-gathering part and an auxiliary part which are integrated, the light-gathering part is arranged right above the light-emitting chip, the auxiliary part is arranged around the light-gathering part, and the auxiliary part is matched with the support in shape.
The packaging glue of the scheme forms the condensing convex lens on the light-emitting chip, plays a role of condensing, effectively improves the light-emitting efficiency of the SMD LED device, effectively reduces the cost and improves the brightness.
Preferably, the support is a BT plate with a bowl-free cup chip structure; and the pins and the bonding pads on the BT board are plated with gold or silver. The structure is simpler due to the adoption of the structure without the bowl cup, the installation space of the luminous chip is enlarged, and the luminous chip is convenient to install.
Preferably, the light emitting chip is an RGB three-primary-color light emitting chip, and the light emitting chip is connected to the circuit by bonding a gold wire or an alloy wire or a copper wire. The full-color display is completed through the RGB three-primary-color light-emitting chip.
Preferably, four pins are arranged on the back of the bracket, and the four pins are respectively a common anode, a color red cathode, a green cathode and a blue cathode of the RGB three-primary-color light-emitting chip; the four pins are either a common cathode, a red anode, a green anode and a blue anode of the RGB three-primary-color light-emitting chip. The three colors of the RGB three-primary-color light-emitting chip are respectively controlled through the four pins, so that the color of the light-emitting chip is adjusted, the structure is simple, and the setting is convenient.
Preferably, the LED device is packaged by means of MOLDING or vacuum glue brushing, and the material of the packaging glue includes solid or liquid epoxy resin, silicone resin or epoxy modified material. The light consistency is improved and the light quality is improved.
Preferably, the height of the auxiliary part from the edge to the light-gathering part is gradually reduced, and a groove is formed between the auxiliary part and the light-gathering part. The auxiliary portion forms an inclined plane or a curve, so that light rays of the light-gathering portion are further concentrated, the light-emitting efficiency of the SMD LED device is effectively improved, the cost is effectively reduced, and the brightness is improved.
Preferably, the top of the light-condensing part is provided with two grooves to form three continuous light-condensing domes, and the positions of the light-condensing domes are adapted to the RGB three-primary-color light-emitting chips. The three light-emitting chips of the RGB three-primary-color light-emitting chips are just concentrated, so that the brightness of the three colors is more balanced, and the problem that the brightness of the light-emitting chip of the middle color is brighter than that of the light-emitting chips of the surrounding colors is solved.
Preferably, the surface of the light-gathering part is a smooth surface or a frosted surface, and the surface of the auxiliary part is a frosted surface. And selecting the smooth surface or the frosted surface of the light-gathering part and the coarsening degree of the frosted surface according to actual requirements. The auxiliary surface is a frosted surface to enhance diffuse reflection.
The utility model has the advantages that:
the convex lens is formed on the surface of the light-emitting chip after the packaging glue is molded, so that the chip protection and light condensation effects are achieved, the light-emitting efficiency of the SMD LED device is effectively improved, the cost is effectively reduced, and the brightness is improved.
Drawings
Fig. 1 is a schematic diagram of prior art LED device package lighting.
Fig. 2 is a schematic view of light emission of an LED device according to a first embodiment of the present invention.
Fig. 3 is a schematic view of light emission of an LED device according to a second embodiment of the present invention.
In the figure, 1, a support, 2, a light emitting chip, 3, packaging glue, 31, a light gathering part, 32, an auxiliary part and 4, pins are arranged.
Detailed Description
The technical solution of the present invention is further specifically described below by way of examples and with reference to the accompanying drawings.
The first embodiment is as follows:
the high-brightness SMD LED device with full-color display screen of the embodiment is shown in FIG. 2, and comprises a support 1 and a light emitting chip 2 fixedly arranged on the support 1, wherein the LED device is packaged by packaging glue 3.
The light emitting chip 2 is an RGB three-primary-color light emitting chip, and the light emitting chip 2 is welded with a conduction loop through a gold wire or an alloy wire or a copper wire. The full-color display is completed through the RGB three-primary-color light-emitting chip.
The support 1 is a BT plate with a bowl-free chip structure, and pins 4 and bonding pads on the BT plate are plated with gold or silver. The back of the bracket 1 is provided with four pins 4, and the four pins 4 are respectively a common anode, a color red cathode, a green cathode and a blue cathode of the RGB three-primary-color light-emitting chip. The four pins 4 can also be respectively a common cathode, a red anode, a green anode and a blue anode of the RGB three-primary-color light-emitting chip.
The support 1 adopts a structure without a bowl cup, the structure is simpler, the installation space of the luminous chip 2 is increased, and the luminous chip 2 is convenient to install. The three colors of the RGB tricolor light-emitting chip are respectively controlled by the four pins 4 on the bracket 1, so that the color of the light-emitting chip is adjusted, the structure is simple, and the setting is convenient.
The LED device is packaged in a MOLDING or vacuum glue brushing mode, and the material of the packaging glue 3 comprises solid or liquid epoxy resin, silicon resin or epoxy modified material and other traditional materials. The use of such materials improves the uniformity of the light and improves the quality of the light.
The packaging glue 3 is formed on the surface of the light-emitting chip 2 to form a light-gathering convex lens.
The convex lens includes a light-condensing portion 31 and an auxiliary portion 32 integrally; the light-condensing portion 31 is disposed directly above the light-emitting chip 2, the auxiliary portion 32 is disposed around the light-condensing portion 31, and the auxiliary portion 32 is adapted to the shape of the holder 1.
The shape of the bracket 1 is not fixed, and can be round or square, the auxiliary part 32 is adapted to the shape of the bracket 1, and can be round or square, in this embodiment, the bracket 1 is square, and the auxiliary part 32 is adapted to the square.
In the present embodiment, the light condensing portion 31 is a hemispherical lens, and the light emitting chip 2 is located at the center of the light condensing portion 31. The height of the light-gathering part 31 is set according to actual requirements. The surface of the light-condensing portion 31 is a smooth surface or a frosted surface, and is set according to the effect of light of actual needs.
The front bonding pad of the bracket 1 of the embodiment is fixed with RGB (red, green and blue) tricolor light-emitting chips and is connected into a conduction path through wires, when the pins 4 are connected with current and pass through the light-emitting chips 2, light rays emitted by the light-emitting chips 2 are converged after passing through the convex lens formed by molding the packaging glue 3, and therefore the brightness emitted by the device in the best viewing angle is higher.
The packaging glue 3 of the scheme forms a light-gathering convex lens on the light-emitting chip 2, plays a light-gathering role, effectively improves the light-emitting efficiency of the SMD LED device, effectively reduces the cost and improves the brightness.
Example two:
the high-brightness SMD LED device with full-color display screen of the embodiment is shown in FIG. 3, and comprises a support 1 and a light emitting chip 2 fixedly arranged on the support 1, wherein the LED device is packaged by packaging glue 3.
The packaging glue 3 is formed on the surface of the light-emitting chip 2 to form a light-gathering convex lens. The convex lens includes a light-condensing portion 31 and an auxiliary portion 32 integrally; the present embodiment optimizes the structure of the auxiliary portion 32.
The height of the auxiliary portion 32 gradually decreases from the edge toward the light-collecting portion 31, and a groove is formed between the auxiliary portion 32 and the light-collecting portion 31. The auxiliary portion 31 forms an inclined plane or a curve, so that light rays of the light-gathering portion are further concentrated, the light-emitting efficiency of the SMD LED device is effectively improved, the cost is effectively reduced, and the brightness is improved.
In the present embodiment, only the structure of the auxiliary portion 32 is optimized, and the other structures are provided as in the first embodiment.
It should be understood that the examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Furthermore, it should be understood that various changes and modifications of the present invention may be made by those skilled in the art after reading the teachings of the present invention, and these equivalents also fall within the scope of the appended claims.
Claims (7)
1. A high-brightness SMD LED device of a full-color display screen comprises a support (1) and a light-emitting chip (2) fixedly arranged on the support, and is characterized in that the LED device is packaged by packaging glue (3), and the packaging glue is molded to form a light-gathering convex lens; the convex lens comprises a light-gathering part (31) and an auxiliary part (32) which are integrated, the light-gathering part is arranged right above the light-emitting chip, the auxiliary part is arranged around the light-gathering part, and the auxiliary part is matched with the support in shape.
2. The SMD LED device with high brightness and full color display screen of claim 1, wherein said support is a BT plate with a bowl-free chip structure; and the pins (4) and the bonding pads on the BT board are plated with gold or silver.
3. The SMD LED device with high brightness and full color display screen according to claim 1 or 2, wherein said light emitting chip is RGB three primary color light emitting chip, and said light emitting chip is connected to the circuit by gold wire or alloy wire or copper wire.
4. The SMD LED device with high brightness and full color as claimed in claim 3, wherein said support has four pins on its back, said four pins are respectively the common anode, red cathode, green cathode and blue cathode of RGB three primary color light emitting chip; the four pins are either a common cathode, a red anode, a green anode and a blue anode of the RGB three-primary-color light-emitting chip.
5. The SMD LED device as claimed in claim 1, wherein said LED device is packaged by MOLDING or vacuum brushing, and the material of the packaging glue comprises solid or liquid epoxy resin, silicone resin or epoxy modified material.
6. The SMD LED device for high brightness full color display screen according to claim 1, wherein said auxiliary portion is gradually lowered from the edge to the height of the light-gathering portion, and a groove is formed between the auxiliary portion and the light-gathering portion.
7. The SMD LED device with high brightness and full color display screen according to claim 1 or 6, wherein said light-condensing portion surface is smooth or frosted, and said auxiliary portion surface is frosted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021566694.2U CN212648272U (en) | 2020-07-31 | 2020-07-31 | High-brightness SMD LED device with full-color display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021566694.2U CN212648272U (en) | 2020-07-31 | 2020-07-31 | High-brightness SMD LED device with full-color display screen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212648272U true CN212648272U (en) | 2021-03-02 |
Family
ID=74785685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021566694.2U Active CN212648272U (en) | 2020-07-31 | 2020-07-31 | High-brightness SMD LED device with full-color display screen |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212648272U (en) |
-
2020
- 2020-07-31 CN CN202021566694.2U patent/CN212648272U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2005223216A (en) | Light emitting light source, illuminator, and display unit | |
| CN106058020A (en) | Bowl-shaped structure chip-scale package luminescence apparatus and manufacturing method thereof | |
| CN101621107A (en) | Light-emitting diode with high light efficiency and encapsulation method thereof | |
| US20080087900A1 (en) | Integrated-Type Led And Manufacturing Method Thereof | |
| WO2021134748A1 (en) | Light-emitting apparatus and light-emitting device | |
| CN212648272U (en) | High-brightness SMD LED device with full-color display screen | |
| CN104241502B (en) | LED packaging structure | |
| CN215342582U (en) | White light LED packaging structure with high light color quality | |
| CN211045476U (en) | L ED lamp bead of die bond paster | |
| CN210398448U (en) | Four-side light-emitting light source with large light-emitting angle and backlight module | |
| CN210325853U (en) | DCAM lamp pearl | |
| CN209026542U (en) | A kind of dual wavelength white LED lamp | |
| CN111627895A (en) | LED light-emitting device with double-color temperature structure | |
| CN202384336U (en) | Light-emitting diode (LED) light source module | |
| KR20080059858A (en) | Light emitting diode | |
| CN216354279U (en) | High-brightness RGB LED light source packaging structure | |
| CN213150805U (en) | LED light source packaging structure and LED light source | |
| CN215869379U (en) | LED light source, lighting device and display device | |
| CN219979593U (en) | Flip-chip SMD package | |
| CN217086563U (en) | LED lamp bead, LED display module and LED display screen | |
| CN212161805U (en) | High-contrast full-color LED packaging light source | |
| CN216528887U (en) | Light type centralized LED lamp | |
| CN212062434U (en) | LED light-emitting device with double-color temperature structure | |
| CN216015411U (en) | Light-emitting element and COB light source | |
| CN216648307U (en) | TOP type RGB packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |