CN216354279U

CN216354279U - High-brightness RGB LED light source packaging structure

Info

Publication number: CN216354279U
Application number: CN202122319049.1U
Authority: CN
Inventors: 李玉蔻; 高璇; 孙峰强; 王思云; 张川; 陈豪
Original assignee: Shaanxi Electronic Information Group Photoelectric Technology Co ltd
Current assignee: Shaanxi Electronic Information Group Photoelectric Technology Co ltd
Priority date: 2021-09-24
Filing date: 2021-09-24
Publication date: 2022-04-19
Anticipated expiration: 2031-09-24

Abstract

The utility model discloses a high-brightness RGB LED light source packaging structure, which comprises a groove-shaped heat dissipation support, wherein positive and negative functional areas are arranged in a groove, a dam is arranged at the bottom of the groove in different positive and negative functional areas, RGB three-color chips are respectively arranged in the dam, and the positive and negative electrodes of the RGB three-color chips are respectively connected to the positive and negative functional areas through gold wires; a thin layer of white glue is arranged outside the upper surface dam of the positive and negative functional areas, and a transparent fluorescent glue layer is arranged at the top of the groove of the bracket. The reflectivity of the functional area in the support is improved, the light-emitting rate of the RGB chip is improved, the brightness and the uniformity of the RGB LED light source are increased, and the practicability is higher.

Description

High-brightness RGB LED light source packaging structure

Technical Field

The utility model belongs to the technical field of semiconductor illumination, and particularly relates to a high-brightness RGB LED light source packaging structure.

Background

China has become the largest global landscape brightening market at present; in addition, with the innovative and individual development of electronic products, the market demand for RGB LED light sources is increasing year by increasing the multi-element fusion. RGB LED light source, control the colour through three primary colors (ruddiness, green glow, blue light) allotment, can mix the light of various colours, the outward appearance colloid is the transparent color, conventional RGB LED light source, because the design of supporting structure, belong to the curve heat dissipation, the support bottom does not take the fin, can't use high-power chip, therefore, the chip that RGB LED light source used is the miniwatt, allow the biggest 20mA of electric current, chip size 3~8mil, and the RGB chip is also not high under transparent packaging adhesive's direct action luminous efficacy, two above-mentioned reasons lead to RGB LED light source luminance low.

Therefore, it is an urgent need to solve the problem of developing an RGB LED light source with high brightness and uniform light emission.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a high-brightness RGB LED light source packaging structure, which increases the brightness and uniformity of an RGB LED light source and has stronger practicability by improving the reflectivity of a functional area in a bracket and improving the light-emitting rate of an RGB chip.

In order to achieve the above purpose, the embodiment of the utility model adopts the following technical scheme:

according to an embodiment provided by the utility model, the utility model provides a high-brightness RGB LED light source packaging structure which is characterized by comprising a heat dissipation bracket, a dam, RGB three-color chips, gold wires, positive and negative functional regions, white glue, a fluorescent glue layer and a PPA insulating layer, wherein the heat dissipation bracket is arranged on the heat dissipation bracket; the heat dissipation support is groove-shaped, positive and negative functional areas are arranged in the groove, the dam is arranged at the bottom of the groove with different positive and negative functional areas, the RGB three-color chips are respectively arranged in the dam, and the positive and negative electrodes of the RGB three-color chips are respectively connected to the positive and negative functional areas through gold wires; a thin layer of white glue is arranged outside the upper surface dam of the positive and negative functional areas, and a transparent fluorescent glue layer is coated on the top of the groove of the bracket.

Preferably, the inside of the groove is divided into 6 positive and negative functional areas through the PPA insulating layer, and the positive and negative functional areas are symmetrically distributed along the transverse diameter direction of the groove.

Preferably, each 2 support pins of the RGB three-color chip are connected with a light-emitting chip of one color, and the three light-emitting chips are respectively independent.

Preferably, the connecting lines of the three light emitting chips are distributed in a triangular shape.

Preferably, the height of the box dam is higher than that of the outer white glue thin layer.

Preferably, the RGB three-color chip is fixed by a die bond paste.

Preferably, the thickness of the white glue coated outside the dam region on the upper surfaces of the positive and negative functional regions is 8-25 μm.

Preferably, the transparent fluorescent glue layer is flush with or slightly concave to the upper surface of the groove.

Compared with the prior art, the utility model has the beneficial effects that:

according to the utility model, the dam areas are respectively arranged outside the RGB three-color chips, and a layer of high-reflectivity white glue with fluidity is coated outside the dam areas, so that the dam can prevent the white glue from contacting the chips, and the white glue is prevented from shielding the light emitted by the chips.

Coating the high-reflectivity white glue, on one hand, the reflectivity of the silver coating in the functional area in the bracket is improved, so that light emitted by the RGB three-color chip is reflected through the high-reflectivity white glue layer to generate higher brightness, and the brightness of an RGB LED light source product is improved; on the other hand, the function of protecting the silver coating of the functional area of the bracket is achieved, the permeation path of external moisture or harmful gas entering the functional area in the LED light source bracket is increased, the stability of the product is improved, and the service life of the product is prolonged.

The above design changes, compares ordinary RGB LED light source and directly adopts the transparent adhesive tape encapsulation on the functional area, and the luminance, the stability of its light source all have very big promotion, have solved because of the little not enough problem of luminance of chip size on the basis that the cost does not increase.

Drawings

FIG. 1 is a schematic diagram of the present invention.

In the figure, 1, a bracket; 2. a box dam; 3. RGB three-color chip; 4. gold thread; 5. a positive and negative functional region; 6. white glue; 7. a fluorescent glue layer; 8. a PPA insulating layer; 9. a first positive electrode pin; 10. a second positive electrode pin; 11. a third positive electrode pin; 12. a first negative electrode pin; 13. a second negative electrode pin; 14. and a third negative terminal.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

As shown in fig. 1, a high-brightness RGB LED light source package structure includes a heat dissipation support 1, a dam 2, RGB three-color chips 3, gold wires 4, positive and negative functional regions 5, white glue 6, a fluorescent glue layer 7, and a PPA insulating layer 8; the heat dissipation bracket 1 is in a groove shape, the interior of the groove is divided into 6 positive and negative functional areas 5 through a PPA insulating layer 8, and the positive and negative functional areas 5 are symmetrically distributed along the transverse diameter direction of the groove; the box dam 2 is arranged at the bottom of the groove of the different positive and negative functional areas 5, the RGB three-color chips 3 are respectively arranged in the box dam 2, and the connecting lines of the three chips with different colors are distributed in a triangular shape; the positive and negative poles of RGB three-color chip 3 are connected with positive and negative functional zone 5 of support through gold thread 4 respectively. The positive and negative functional area 5 forms 3 control circuits for independently regulating and controlling the light emission of the RGB three-color chip, and has 6 support pins in total, wherein 2 support pins drive the light-emitting chip with one color, and three driving currents are respectively independent and do not interfere with each other.

Meanwhile, a thin layer of white glue 6 with high reflectivity and a transparent fluorescent glue layer 7 coated on the top of the groove of the support are arranged outside the area of the box dam 2 on the upper surfaces of the positive and negative functional regions 5.

The dams 2 on the bottom of the groove aim to prevent the high-reflectivity white glue 6 from contacting the chips after flowing and shielding the light emitted by the chips, the number of the dams is consistent with that of the chips, one dam surrounds one chip, the height of each dam 2 is 60-80 mu m, a dispensing and circling process is adopted, the chips are naturally dried at room temperature or baked in an oven, and the process steps are after the supports are preheated and before the chips are solidified.

RGB three-color chips 3 are fixed in the area of the dam 2 and are fixed through die bonding glue, wherein in one embodiment, the size of the RGB three-color chips is 3-8 mil. Wherein the wavelength of the red light (R) chip is 620-625nm, and the red light (R) chip is connected with the corresponding second anode pin 10 and the second cathode pin 13 through the gold wire 4; the green light (G) chip has a wavelength of 520-530nm and is connected with the corresponding first anode pin 9 and the first cathode pin 12 through the gold wire 4; the wavelength of the blue light (B) chip is 465-470nm, and the blue light (B) chip is connected with the corresponding third anode pin 11 and the third cathode pin 14 through the gold wire 4.

The high-reflectivity white glue 6 is coated outside the area of the box dam 2 on the upper surfaces of the positive and negative functional areas 5, the thickness of the white glue is 8-25 mu m, and the white glue is baked at high temperature and cured into a reflecting layer. The purpose is to increase the reflectivity of the bracket functional area, improve the light-emitting rate of the chip and further increase the brightness of an RGB LED light source.

And finally, filling the transparent fluorescent glue layer 7 in the groove of the bracket to achieve the effect of being parallel to or slightly concave with the groove, so that the light emitted by the RGB chip is more uniform.

The present invention is not limited to the above-mentioned embodiments, and based on the technical solutions disclosed in the present invention, those skilled in the art can make some substitutions and modifications to some technical features without creative efforts according to the disclosed technical contents, and these substitutions and modifications are all within the protection scope of the present invention.

Claims

1. A high-brightness RGB LED light source packaging structure is characterized by comprising a heat dissipation support, a dam, RGB three-color chips, gold wires, positive and negative functional regions, white glue, a fluorescent glue layer and a PPA insulating layer; the heat dissipation support is groove-shaped, positive and negative functional areas are arranged in the groove, the dam is arranged at the bottom of the groove with different positive and negative functional areas, the RGB three-color chips are respectively arranged in the dam, and the positive and negative electrodes of the RGB three-color chips are respectively connected to the positive and negative functional areas through gold wires; a thin layer of white glue is arranged outside the upper surface dam of the positive and negative functional areas, and a transparent fluorescent glue layer is coated on the top of the groove of the bracket.

2. The high-brightness RGB LED light source package structure of claim 1, wherein the recess is divided into 6 positive and negative functional regions by PPA insulating layer, and the positive and negative functional regions are symmetrically distributed along the transverse diameter direction of the recess.

3. The high brightness RGB LED light source package of claim 1, wherein each of 2 support pins of RGB three-color chips is connected to a light emitting chip of one color, and three light emitting chips are independent.

4. The RGB LED light source package of claim 3, wherein the connection lines of the three light emitting chips are distributed in a triangle.

5. The RGB LED light source package of claim 1, wherein the height of the dam is higher than the height of the outer white glue film.

6. The package structure of claim 1, wherein the RGB chips are fixed by a die attach adhesive.

7. The RGB LED light source package structure of claim 1, wherein the thickness of the white glue coated on the upper surface of the positive and negative functional regions outside the dam region is 8-25 μm.

8. The RGB LED light source package of claim 1, wherein the transparent fluorescent layer is substantially flush or slightly recessed with respect to the top surface of the recess.