CN212365987U

CN212365987U - LED packaging structure

Info

Publication number: CN212365987U
Application number: CN201922448732.8U
Authority: CN
Inventors: 申崇渝; 李德建; 孙国喜
Original assignee: Beijing Yimei New Technology Co ltd
Current assignee: Beijing Yimei New Technology Co ltd; Shineon Beijing Technology Co Ltd
Priority date: 2019-12-30
Filing date: 2019-12-30
Publication date: 2021-01-15
Anticipated expiration: 2029-12-30

Abstract

The utility model provides a LED packaging structure, include: the LED light source comprises a support, an LED chip, a fluorescent layer and a shading layer; the LED chip is fixed on the bracket and used for generating light; the fluorescent layer covers the side face of the LED chip; the shading layer is arranged on the light emitting surface of the LED chip and used for blocking the light emitted by the LED chip from the light emitting surface. Because the top does not emit light, the problem of uneven top and side light emission does not exist, the problem that light mixing processing is difficult to occur easily when the light mixing distance of display products such as televisions, computer monitors or mobile phones is small is solved, the light mixing effect is effectively improved, and the display effect of the display products is further improved.

Description

LED packaging structure

Technical Field

The patent of the utility model relates to a LED technical field especially relates to a LED packaging structure.

Background

As display products such as televisions, computer monitors, mobile phones, and the like are becoming thinner and thinner, the demand is becoming greater and greater, and thus the development of Light Emitting diodes (LEDs for short) is being promoted, wherein the packaging process of Chip Scale packages (CSP for short) LEDs is also being improved. Currently, the mainstream chip scale package structure mainly includes the following three types:

the first type is a five-sided light emitting type CSP, namely, the periphery of the LED chip and the surface of the LED chip are used for emitting light;

the second type is a single-sided light emitting type CSP, i.e. only the surface of an LED chip is used for emitting light;

the third type is a white LED chip.

The top of the packaging structure is mostly used as a main light emitting surface in the current CSP structure, so that the top of the packaging structure has high brightness, which may cause uneven brightness at the top of the packaging structure and at the side of the packaging structure.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a LED packaging structure adopts fluorescent material cladding LED chip side surface, and the light shield layer covers LED chip upper surface, forms a LED packaging structure.

In a first aspect, the present invention provides an LED package structure, which includes a support, an LED chip, a fluorescent layer and a light-shielding material layer;

the LED chip is fixed on the bracket and used for generating light;

the fluorescent layer covers the side face of the LED chip;

the shading layer is arranged on the light emitting surface of the LED chip and used for blocking the light emitted by the LED chip from the light emitting surface.

In one embodiment, the thickness of the fluorescent layer is 0 to 300 μm.

In one embodiment, the light shielding layer has a thickness of 10 μm to 500 μm.

In one embodiment, the LED chip includes: at least one of a blue chip, a green chip, a red chip and a white chip.

In one embodiment, the phosphor layer comprises: fluorescent material or quantum dot fluorescent layer.

In one embodiment, the fluorescent material includes at least one of green phosphor, yellow phosphor, and red phosphor.

In one embodiment, the light shielding layer includes: white glue, silica gel or epoxy resin.

In one embodiment, the fluorescent layer is further disposed between the light emitting surface of the LED chip and the light shielding layer.

In one embodiment, the LED chip is a face-up chip or a flip chip.

The utility model provides a LED packaging structure, through fluorescent layer cladding LED chip side surface, the play plain noodles of light shield layer cladding LED chip, and then form the luminous chip scale packaging structure of only side. The LED lamp is used as a luminous light source and has the characteristics of side luminescence and non-luminescence at the top. Because the top does not emit light, the problem of uneven top and side light emission does not exist, the problem that light mixing processing is difficult to occur easily when the light mixing distance of display products such as televisions, computer monitors or mobile phones is small is solved, the light mixing effect is effectively improved, and the display effect of the display products is further improved.

Further effects of the above-mentioned unconventional preferred modes will be described below in conjunction with specific embodiments.

Drawings

In order to more clearly illustrate the embodiments or prior art solutions of the present invention, the drawings needed to be used in the description of the embodiments or prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is a schematic structural diagram of a chip scale package according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a chip scale package according to another embodiment of the present invention;

fig. 3 is a flowchart of a packaging method of a chip scale package according to an embodiment of the present invention.

Wherein, in the figures, the respective reference numerals:

1-an LED chip; 2-a fluorescent layer; and 3, shading layer.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments and the corresponding drawings. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1, the present invention provides a specific embodiment of an LED package structure, including: the LED lamp comprises a support, an LED chip 1, a fluorescent layer 2 and a shading layer 3; the LED chip 1 is fixed on the bracket and used for generating light; the fluorescent layer 2 is coated on the side surface of the LED chip 1; the light shielding layer 3 is disposed on the light emitting surface of the LED chip 1 and is used for blocking light emitted from the light emitting surface of the LED chip 1, so that an LED package unit emitting light only from the side surface can be formed. It should be noted that the bracket is not shown in the drawings. The LED lamp is used as a luminous light source and has the characteristics of side luminescence and non-luminescence at the top. Because the top does not emit light, the top and the side do not emit light unevenly, the problem that light mixing processing is difficult when the light mixing distance of display products such as televisions, computer monitors or mobile phones is small is solved, the display effect is improved, the small light mixing distance can be realized under the large pixel distance, and particularly the light mixing distance is smaller than 5.

In one possible implementation, as shown in fig. 1, the LED chip 1 is fixed on a support for generating light, and the LED chip 1 needs to be fixed on the support for subsequent processing. The fluorescent layer 2 is wrapped on the side surface of the LED chip 1, and the thickness of the fluorescent layer 2 is between 0 and 300 mu m as the case may be. It should be noted that there is no gap between the fluorescent layer 2 and the LED chip 1, so that it can be ensured that there is no unevenness in the emitted light, and the yield of the product can be improved. The light shielding layer 3 is arranged on the light emitting surface of the LED chip 1 and used for blocking light emitted from the light emitting surface of the LED chip 1, and the light shielding layer 3 covers the LED chip 1 and the fluorescent layer 2 and is consistent with the edge. The specific thickness of the light shielding layer 3 is 10-500 μm, and there is no gap, otherwise there is a problem of light leakage.

In another possible implementation manner, as shown in fig. 2, a fluorescent layer 2 is further disposed between the light emitting surface of the LED chip 1 and the light shielding layer 3. Therefore, the area of the side fluorescent layer of the LED chip 1 can be enlarged, and the light emitted by the LED chip 1 can be better utilized. Here, unlike fig. 1, fig. 1 merely provides the light shielding layer 3 on the side surface of the LED chip 1.

As shown in fig. 1, in the present embodiment, the LED chip 1 includes: at least one of a blue chip, a green chip, a red chip and a white chip.

In the above embodiments, the light emitting color is controlled by the wavelength of light, and different chips need to be selected according to the actual light emitting requirement. In addition, since white light needs to be emitted, the three primary colors of light, blue, green and red, are required to constitute white light, or a white chip is directly used.

As shown in fig. 1, in the present embodiment, the fluorescent layer 2 includes: phosphor materials or quantum dot materials.

In the embodiment, the fluorescent powder material has the characteristics of improving the luminous efficiency, accurately controlling the luminous wavelength of the LED, enabling the light color of the LED to be softer or more vivid and the like, and the luminous effect of the LED is guaranteed to a certain extent. The quantum dot material has the characteristics of narrow light-emitting spectrum, wide color gamut, good stability, long service life, low manufacturing cost and the like, and the two fluorescent layers 2 have respective advantages and can be used in different occasions.

As shown in fig. 1, in the present embodiment, the fluorescent material includes at least one of green phosphor, blue phosphor, and red phosphor.

In the above-described embodiment, if different colors are required to be emitted, the required colors can be combined using three primary colors of light, which are green, blue, and red. The green fluorescent powder and the red fluorescent powder can meet the requirement, and the reason of no blue color is that light emitted by the blue light chip is blue, and the blue light chip is just combined with green and red to form three primary colors of light. The reason for using the yellow fluorescent powder is that the three primary colors are yellow, red and blue, and the three primary colors can enrich the color and meet wider requirements.

As shown in fig. 1, in the present embodiment, the thickness range of the fluorescent layer 2 includes: 0-300 μm.

In the above embodiments, the thickness of the fluorescent layer 2 is 0 to 300 μm in order to ensure the luminous intensity of the chip scale package product. For example, the thickness of the fluorescent layer 2 may be 100 μm, 150 μm. If it exceeds 300. mu.m, the material cost increases. This range can satisfy most of the demands at the present stage.

As shown in fig. 1, in the present embodiment, the light shielding layer 3 includes: white glue, silica gel or epoxy resin.

In the embodiment, the white glue has the characteristics of good film forming property, high bonding strength, high curing speed, convenience in use, low price, no organic solvent and the like. The silica gel has the characteristics of strong tensile force, good hand feeling, high transparency, no odor, no yellowing, hard hardness, long service life and the like. The epoxy resin adhesive has the characteristics of good insulating property, good heat conductivity, high temperature resistance, low temperature resistance, aging resistance, good sealing property, simple filling process and the like. The three materials are respectively long, can adapt to different occasions and meet different requirements.

As shown in fig. 1, in the present embodiment, the thickness range of the light shielding layer 3 includes: 10-500 μm.

In the above embodiment, the light-shielding layer 3 having a thickness smaller than 10 μm has a problem that the light transmittance is slightly lowered. Larger than 500 μm increases the material cost. This range can satisfy most of the demands at the present stage.

As shown in fig. 2, in the present embodiment, a fluorescent layer 2 is further disposed between the light-emitting surface of the LED chip 1 and the light-shielding layer 3.

In the above embodiment, the fluorescent layer 2 is present between the light-emitting surface of the LED chip 1 and the light-shielding layer 3, which is done to improve the utilization rate of light. Because the light on the front surface of the LED chip 1 is strongest, and the light shielding layer 3 blocks the light on the front surface of the LED chip 1, in order to improve the utilization rate of the light, fluorescent powder can be coated between the light-emitting surface of the LED chip 1 and the light shielding layer 3, so that the light can be utilized to the maximum, the light-emitting area of the LED package structure can be increased, and the wider use requirements can be met.

As shown in fig. 1, in the present embodiment, the LED chip 1 is a front-mounted chip or a flip chip.

In the above embodiment, the front-mounted chip has the characteristics of low cost, mature technology and the like. The flip chip has the characteristics of capability of being used by passing large current, smaller size, easiness in optical matching, good heat dissipation, long service life, strong antistatic capability and the like. The two chips are respectively long, can adapt to different occasions and meet different requirements.

As shown in fig. 3, the present invention relates to an embodiment of a method for processing an LED package structure. The processing method of the present embodiment is the processing process of the chip scale package structure described in the embodiments shown in fig. 1 to 3. The description related to the above embodiment is also applicable to the present embodiment.

Step 31, fixing the LED chip 1 on a support;

step 32, coating the fluorescent layer 2 on the side surface of the LED chip 1;

step 33, coating the light shielding layer 3 on the surface of the light emitting surface of the LED chip 1 to obtain a semi-finished product of the LED packaging structure;

and step 34, baking and curing the semi-finished product of the LED packaging structure to form the LED packaging structure.

As shown in fig. 1, in the present embodiment, the fixing of the LED chip 1 on the support includes: the LED chip 1 is fixed on the bracket in a die bonding mode.

In the above embodiments, die bonding refers to a process of bonding a die to a designated area of a support via a glue to form a thermal or electrical path, which provides conditions for subsequent wire bonding. The die bonding has the characteristics of simpler process difficulty, colloid saving, high efficiency and the like, improves the production efficiency, reduces the colloid cost and reduces the production difficulty.

As shown in fig. 2, in the present embodiment, between the step of applying the fluorescent layer 2 to the side surface of the LED chip 1 and the step of applying the light shielding layer 3 to the surface of the light emitting surface of the LED chip 1, the method further includes: the surface of the light-emitting surface of the LED chip 1 is coated with a fluorescent layer 2.

In the above embodiment, the surface of the light emitting surface of the LED chip 1 is coated with the fluorescent layer 2, which has been described above, and will not be described repeatedly.

The embodiments of the present invention are described in a progressive manner, and the same and similar parts among the embodiments can be referred to each other, and each embodiment is mainly described as different from the other embodiments.

It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims

1. An LED packaging structure is characterized by comprising a support, an LED chip, a fluorescent layer and a shading layer;

the LED chip is fixed on the bracket and used for generating light;

the fluorescent layer covers the side face of the LED chip;

2. The LED package structure of claim 1, wherein the thickness of the phosphor layer is 0-300 μm.

3. The LED package structure of claim 1, wherein the light shielding layer has a thickness of 10 μm to 500 μm.

4. The LED package structure of claim 1, wherein the LED chip comprises: at least one of a blue chip, a green chip, a red chip and a white chip.

5. The LED package structure of claim 1, wherein the phosphor layer is a phosphor material or a quantum dot phosphor layer.

6. The LED package structure of claim 5, wherein the phosphor is green, yellow, or red phosphor.

7. The LED package structure of claim 1, wherein the light shielding layer is white glue, silica gel or epoxy resin.

8. The LED package structure according to any one of claims 1 to 7, wherein the fluorescent layer is further disposed between the light-emitting surface of the LED chip and the light-shielding layer.

9. The LED package structure of claim 8, wherein the LED chip is a face-up chip or a flip chip.