CN216450636U - Direct insertion type LED packaging structure - Google Patents

Abstract

The utility model belongs to the field of semiconductor light emitting diodes, and particularly relates to a direct-insert LED packaging structure which comprises a conductive support, a luminous body arranged on the conductive support, and a packaging colloid used for packaging the conductive support and the luminous body, wherein the packaging colloid comprises a cap body part and a cap brim part arranged at the bottom of the cap body part, the cap brim part is a circular disc body, and is provided with a first gap and a second gap which are oppositely arranged, when the direct-insert LED is packaged, the cap body part is packaged by packaging glue firstly, then the cap brim part is packaged by packaging glue, when the cap brim part is packaged, two gaps which are oppositely arranged are reserved on the cap brim part, the gaps of two adjacent direct-insert LEDs are opposite, the space between the two adjacent conductive supports can be reduced, the two adjacent direct-insert LEDs can be closely arranged in parallel, and the products produced by materials with the same length are more, the production efficiency is improved, the material waste is reduced, the use amount of the packaging colloid required in packaging is reduced, and the cost is reduced.

Description

Direct insertion type LED packaging structure

[ technical field ] A

The utility model belongs to the field of semiconductor light emitting diodes, and particularly relates to a direct-insertion type LED packaging structure.

[ background ] A method for producing a semiconductor device

In recent years, the Light Emitting Diode (LED) packaging industry in China rises like spring shoots after rain, and generally, the LAMP-LED is suitable for the encapsulation method, wherein a plurality of LAMP holders are connected together during LAMP holder packaging, and are cut into single LED LAMP pieces after the packaging is finished.

Generally speaking, a conventional LAMP-LED structure, please refer to fig. 6 and 7, which mainly includes a conductive support 21, a light emitter 22 disposed on the conductive support 21, and an encapsulant 23 for encapsulating the conductive support 21 and the light emitter, wherein the encapsulant 23 includes a cap body 231 and a disc-shaped brim 232 disposed at the bottom of the cap body 231 for facilitating subsequent assembly, the disc-shaped brim 232 has a gap 24, the conventional LAMP support is encapsulated in a row at the same time, during the encapsulation process, the LAMP supports in the row are pressed down into the encapsulation molding strip, and then encapsulated, and the arrangement structure thereof refers to fig. 5, because the disc-shaped brim 232 with the gap 24 radially extends out of the cap body 231 along the cap body 231, and the gap 24 is usually oriented in the same direction, at least one arc edge thereof increases the distance between the individual LAMP supports, thereby reducing the number of products produced by materials with the same length, not only reduces the production efficiency, but also wastes materials.

[ Utility model ] content

The utility model provides a direct insertion type LED packaging structure which can improve the production efficiency, improve the material utilization rate and reduce the cost.

The utility model is realized by the following technical scheme:

the utility model provides a formula LED packaging structure cut straightly, includes electrically conductive support, locates the luminous body on the electrically conductive support and is used for the encapsulation colloid of the electrically conductive support of encapsulation and luminous body, the encapsulation colloid includes cap body portion and the brim of a hat portion of locating cap body portion bottom, brim of a hat portion is the disc body, set up relative first breach and the second breach that sets up in the brim of a hat portion.

According to the direct-insert LED packaging structure, the conductive support comprises the positive support, the negative support, the positive pin connected with the positive support and the negative pin connected with the negative support, the positive support, the negative support and the luminous body are packaged by the cap body, and the connecting end of the positive pin and the positive support and the connecting end of the negative pin and the negative support are wrapped by the cap brim.

According to the direct-insert LED packaging structure, the luminous body comprises the reflecting cup arranged on the anode support, the LED chip arranged in the reflecting cup and the metal lead used for connecting the LED chip and the cathode support.

According to the direct-insertion LED packaging structure, the cap body portion comprises the spherical section and the connecting section which are arranged up and down, the upper surface of the connecting section is connected with the lower surface of the spherical section, the lower surface of the connecting section is connected with the upper surface of the brim portion, and the spherical section and the connecting section are integrally formed.

In the above direct-insert LED package structure, a diameter R1 of an end surface of the connecting segment connected to the spherical segment is smaller than a diameter R2 of an end surface of the connecting segment connected to the brim.

According to the direct-insert LED packaging structure, the packaging colloid is a transparent epoxy resin colloid or a colloidal silica.

According to the direct-insertion LED packaging structure, the brim is a black epoxy resin colloid, and the brim is arranged below the luminous body.

According to the direct-insert LED packaging structure, the positive pin and the negative pin are respectively provided with the bulge.

Compared with the prior art, the utility model has the following advantages:

the utility model provides a direct-insert LED packaging structure, which comprises a conductive support, a luminous body arranged on the conductive support and a packaging colloid used for packaging the conductive support and the luminous body, wherein the packaging colloid comprises a cap body part and a cap brim part arranged at the bottom of the cap body part, the cap brim part is a circular disc body, and two oppositely arranged notches are formed in the cap brim part, the first notch and the second notch of two adjacent formula LEDs that cut straightly are relative, can reduce the interval between two adjacent electrically conductive supports, make adjacent formula LEDs that cut straightly can be side by side inseparable arranging together to the product quantity that the material that makes equal length produced is more, improves production efficiency, and it is extravagant to reduce the material, reduce cost, simultaneously, leaves the breach on brim of a hat portion, required encapsulant use amount when having reduced the encapsulation, and the cost is lower.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below.

Fig. 1 is a schematic layout diagram of a direct-insert LED package structure according to an embodiment of the present invention;

FIG. 2 is a partial enlarged view of a in FIG. 1;

FIG. 3 is a schematic top view of an embodiment of a direct-insert LED package according to the present invention;

FIG. 4 is a schematic diagram of a front view of a direct-insert LED package according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of an arrangement structure of a conventional direct-insertion LED package structure;

FIG. 6 is a partial enlarged view of b in FIG. 5;

fig. 7 is a schematic top view of a conventional in-line LED package encapsulant.

[ detailed description ] embodiments

In order to make the technical problems, technical solutions and advantageous effects solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.

When embodiments of the present invention refer to the ordinal numbers "first", "second", etc., it should be understood that the words are used for distinguishing between them unless the context clearly dictates otherwise.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In a specific embodiment, as shown in fig. 1 to 4, the direct-insert LED package structure includes a conductive bracket 11, an illuminant 12 disposed on the conductive bracket 11, and a package colloid 13 for packaging the conductive bracket 11 and the illuminant 12, where the package colloid 13 includes a cap body 131 and a brim 132 disposed at the bottom of the cap body 131, the brim 132 is a circular disk, and the brim 132 is provided with a first notch 14 and a second notch 15 which are disposed oppositely. When the in-line LED is packaged, the conductive bracket 11 is inserted into a mold particle filled with transparent silica gel or transparent epoxy resin glue, the lower part of the mold particle is matched with the shape of the cap body 131 of the utility model, the upper part of the mold particle is matched with the shape of the brim 132 of the utility model, the transparent silica gel or transparent epoxy resin glue is filled in the lower part of the mold particle, after high-temperature baking and curing treatment, the brim 132 of the packaged colloid of the utility model is packaged, the brim 132 is arranged to facilitate the subsequent assembly of the in-line LED, when the brim 132 is packaged, the brim 132 of the adjacent in-line LED is provided with a first gap 14 and a second gap 15 which are oppositely arranged, the first gap 14 and the second gap 15 of the adjacent two in-line LED are opposite, the distance between the two adjacent conductive brackets 11 can be reduced, and the adjacent in-line LED can be closely arranged in parallel, therefore, the number of products produced by materials with the same length is more, the production efficiency is improved, the material waste is reduced, the cost is reduced, meanwhile, the first notch 14 and the second notch 15 are reserved on the brim part 132, the usage amount of colloid required in packaging is reduced, and the cost is lower.

Specifically, the conductive support 11 includes a positive support 111, a negative support 112, a positive pin 113 connected to the positive support 111, and a negative pin 114 connected to the negative support 112, the cap portion 131 encapsulates the positive support 111, the negative support 112, and the light emitter 12, and the brim portion 132 covers a connection end of the positive pin 113 and the positive support 111 and a connection end of the negative pin 114 and the negative support 112. The brim portion 132 is arranged to facilitate the assembly of the direct-insertion LED in the follow-up scheme.

More specifically, the light emitter 12 includes a reflective cup 121 disposed on the positive electrode holder 111, an LED chip 122 disposed in the reflective cup 121, and a metal wire 123 for connecting the LED chip 122 and the negative electrode holder 112. Specifically, a phosphor layer is disposed on the LED chip 122, and the LED chip 122 is energized through the positive pin 113 and the negative pin 114, so that the LED chip 122 emits light and excites the phosphor in the phosphor layer 4 to emit light.

Further, the cap body 131 includes a spherical section 1311 and a connecting section 1312 disposed above and below, an upper surface of the connecting section 1312 is connected to a lower surface of the spherical section 1311, a lower surface of the connecting section 1312 is connected to an upper surface of the cap brim 132, and the spherical section 1311 and the connecting section 1312 are integrally formed. The surface of the lower surface of the connecting section 1312 connected to the upper surface of the brim 132 is a flat surface or a convex arc surface or a concave arc surface.

More specifically, the diameter R1 of the end face of the connecting section 1312 connected to the spherical section 1311 is smaller than the diameter R2 of the end face connected to the visor 132. Preferably, the connecting section 1312 is a truncated cone shape, which facilitates package drawing.

Further, the encapsulant 13 is a transparent epoxy resin encapsulant or a colloidal silica.

Still further, brim of a hat portion 132 is black epoxy colloid, just brim of a hat portion 132 is located luminophor 12 below. The conductive bracket 11 is inserted into a mold particle filled with transparent silica gel or transparent epoxy resin glue, the lower part of the mold particle is matched with the shape of the cap body part 131 of the utility model, the upper part of the mold particle is matched with the shape of the brim part 132 of the utility model, the lower part of the mold particle is filled with the transparent silica gel or transparent epoxy resin glue, after high-temperature baking and curing treatment, the brim part 132 of the encapsulation colloid of the utility model is encapsulated, and the bottom of the direct-insert LED encapsulation colloid is encapsulated by using black epoxy resin colloid which is arranged below the luminous body 12 through twice encapsulation, thereby preventing the leakage of bottom light.

Specifically, the positive electrode pin 113 and the negative electrode pin 114 are both provided with protrusions 16. For subsequent mounting alignment, after the positive pin 113 and the negative pin 114 are inserted into the mounting frame, the protrusion 16 touches the mounting frame to indicate that the mounting frame is mounted in place.

The above description is provided for one embodiment of the present invention, and the embodiments of the present invention are not limited to these descriptions, and the present invention is not limited to the above nomenclature and the English nomenclature since the trade nomenclature is different. Similar or identical methods, structures and the like as those of the present invention or several technical deductions or substitutions made on the premise of the conception of the present invention should be considered as the protection scope of the present invention.

Claims (8)

1. The utility model provides a cut straightly formula LED packaging structure, its characterized in that, including electrically conductive support (11), locate luminous body (12) on electrically conductive support (11) and be used for encapsulating electrically conductive support (11) and luminous body (12) encapsulant (13), encapsulant (13) include cap body portion (131) and locate cap brim portion (132) of cap body portion (131) bottom, cap brim portion (132) are the disc body, set up relative first breach (14) and second breach (15) that set up on cap brim portion (132).

2. An in-line LED packaging structure according to claim 1, wherein the conductive support (11) comprises a positive support (111), a negative support (112), a positive pin (113) connected to the positive support (111), and a negative pin (114) connected to the negative support (112), the positive support (111), the negative support (112), and the light-emitting body (12) are packaged by the cap portion (131), and the cap brim portion (132) covers the connecting end of the positive pin (113) and the positive support (111) and the connecting end of the negative pin (114) and the negative support (112).

3. An in-line LED package structure according to claim 2, wherein the light emitter (12) comprises a reflective cup (121) disposed on the positive support (111), an LED chip (122) disposed in the reflective cup (121), and a metal wire (123) for connecting the LED chip (122) and the negative support (112).

4. An in-line LED packaging structure according to claim 1, wherein the cap body (131) comprises a spherical section (1311) and a connecting section (1312), the spherical section (1311) and the connecting section (1312) are arranged above and below each other, the upper surface of the connecting section (1312) is connected with the lower surface of the spherical section (1311), the lower surface of the connecting section (1312) is connected with the upper surface of the brim (132), and the spherical section (1311) and the connecting section (1312) are integrally formed.

5. An in-line LED package structure according to claim 4, wherein the diameter R1 of the end face of the connecting section (1312) connected to the spherical section (1311) is smaller than the diameter R2 of the end face of the connecting section connected to the brim (132).

6. An in-line LED package according to claim 1, wherein the encapsulant (13) is a transparent epoxy encapsulant or a silicone gel.

7. An in-line LED package according to claim 6, wherein the brim (132) is a black epoxy gel and the brim (132) is disposed under the light emitter (12).

8. An in-line LED package structure according to claim 2, wherein the positive pin (113) and the negative pin (114) are both provided with a protrusion (16).

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