CN208655694U - A kind of light-emitting diode chip for backlight unit optically focused encapsulating structure - Google Patents
A kind of light-emitting diode chip for backlight unit optically focused encapsulating structure Download PDFInfo
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- CN208655694U CN208655694U CN201821542944.1U CN201821542944U CN208655694U CN 208655694 U CN208655694 U CN 208655694U CN 201821542944 U CN201821542944 U CN 201821542944U CN 208655694 U CN208655694 U CN 208655694U
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- light
- diode chip
- backlight unit
- emitting diode
- carrier
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Abstract
The utility model discloses a kind of light-emitting diode chip for backlight unit optically focused encapsulating structure, including carrier and the light-emitting diode chip for backlight unit being set on carrier and luminous bowl, carrier is equipped with the electrical route being electrically connected with light-emitting diode chip for backlight unit, the bowl that shines is in isosceles trapezoid mesa-shaped, the top surface area for the bowl that shines is greater than base area, light-emitting diode chip for backlight unit is located at the bottom for the bowl that shines, the bowl that shines and the external plastic of carrier have the adhesive body made of light transmitting property with lower openings, carrier covers the lower openings of adhesive body, the top of adhesive body is light-emitting surface, light-emitting surface is year wheeled setting, the centre of light-emitting surface is convexly equipped with semicircular optically focused bulb, and the top of optically focused bulb is concordant with the edge of light-emitting surface, optically focused bulb is corresponding with luminous bowl, the light that light-emitting diode chip for backlight unit issues passes through equal after the bowl inner wall refraction that shines It is gathered in the top of optically focused bulb and exposes sending.The utility model makes the light emitting angle of light-emitting diode chip for backlight unit and light distribution become controllable.
Description
Technical field
The utility model relates to light-emitting diode chip for backlight unit technical fields more particularly to a kind of light-emitting diode chip for backlight unit optically focused to seal
Assembling structure.
Background technique
LED (Light Emitting Diode, light emitting diode) of the tradition containing fluorescent powder, light emitting angle and light point
Cloth is all uncontrollable, is unable to satisfy that existing market is smaller and smaller to light emitting angle and the more uniform requirement of distribution.Such as it is existing
95% monolithic white light is all to add to be made mixed with the transmission element of fluorescent powder with LED grain in the market, light emitting angle and
Light distribution all belongs to uncontrollable state.
Utility model content
The purpose of the utility model is to overcome the deficiencies in the prior art, provide a kind of light-emitting diode chip for backlight unit optically focused encapsulation
Structure.
The technical solution of the utility model is as follows:
A kind of light-emitting diode chip for backlight unit optically focused encapsulating structure, including carrier and the light emitting diode being set on the carrier
Chip and luminous bowl, the carrier is equipped with the electrical route being electrically connected with the light-emitting diode chip for backlight unit, described to shine
Bowl is in isosceles trapezoid mesa-shaped, and the top surface area of the luminous bowl is greater than its base area, the light-emitting diode chip for backlight unit
Positioned at the bottom of the luminous bowl, the external plastic of the luminous bowl and carrier has and has lower part made of light transmitting property
The adhesive body of opening, the carrier covers the lower openings of the adhesive body, and the inner sidewall at its both ends and the adhesive body
Connection, the top of the adhesive body are light-emitting surface, and the light-emitting surface is year wheeled setting, and the centre of the light-emitting surface is convexly equipped with half
Circular optically focused bulb, and the top of the optically focused bulb is concordant with the edge of the light-emitting surface, the optically focused bulb and institute
State that luminous bowl is corresponding, the light that the light-emitting diode chip for backlight unit issues is gathered in after reflecting by the luminous bowl inner wall
The top of the optically focused bulb and expose sending.
Further, the carrier be top have mounting groove plate structure, the light-emitting diode chip for backlight unit and shine
Bowl is mounted in the mounting groove, and the electrical property is routed through the carrier and protrudes into the mounting groove and shines with described
Diode chip for backlight unit is electrically connected.
Further, the light-emitting diode chip for backlight unit is electrically connected by the electrical route on crystal-bonding adhesive and the carrier.
Further, the electrical route is flexible circuit board.
Further, the carrier includes the insulating layer and protective layer set gradually, and the light-emitting diode chip for backlight unit shines
Bowl is arranged in the insulating layer upper surface.
Compared with the existing technology, the utility model has the beneficial effects that:
1, the utility model is by installing a luminous bowl additional on the led chips, then in bowl and the carrier of shining
External plastic has the adhesive body made of light transmitting property with lower openings, and the top of adhesive body is the light out of year wheeled setting
Face, the centre of light-emitting surface is convexly equipped with semicircular optically focused bulb, and the top of optically focused bulb is concordant with the edge of light-emitting surface, gathers
Photosphere head is corresponding with luminous bowl, and the light that light-emitting diode chip for backlight unit issues is poly- by being gathered in after the bowl inner wall refraction that shines
The top of photosphere head and expose sending.Achieve the effect that increase light intensity, and shines uniformly, in this way, making light-emitting diode chip for backlight unit
Light emitting angle and light distribution become controllable；
2, by the light-emitting diode chip for backlight unit after sealing processing, there is preferable antihunt action, greatly improve core
The service life of piece is readily transported and carries；
3, the carrier of light-emitting diode chip for backlight unit bottom is made of insulating layer and protective layer, and the setting of protective layer can be protected further
Chip is protected, in addition, can disassemble by removing carrier when needing to dismantle chip and encapsulate intact taking-up chip, reach
The purpose of chip recycling, can recycle reduces cost, while also avoiding the waste of resource.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of light-emitting diode chip for backlight unit optically focused encapsulating structure of the utility model；
Fig. 2 is a kind of top view of light-emitting diode chip for backlight unit optically focused encapsulating structure of the utility model；
Fig. 3 is the structural schematic diagram of carrier described in the utility model.
Specific embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail.
Fig. 1, Fig. 2 are please referred to, the utility model provides a kind of light-emitting diode chip for backlight unit optically focused encapsulating structure, including carrier 1
With the light-emitting diode chip for backlight unit 2 and luminous bowl 3 being set on carrier 1, carrier 1 is equipped with light-emitting diode chip for backlight unit 2 electrically
The electrical route 4 of connection, the bowl 3 that shines are in isosceles trapezoid mesa-shaped, and the top surface area for the bowl 3 that shines is greater than its base area,
Positioned at the bottom for the bowl 3 that shines, the external plastic of the bowl 3 that shines and carrier 1 has to be made light-emitting diode chip for backlight unit 2 of light transmitting property
The adhesive body 5 with lower openings, when production, manufactured by injection molding or model technique, carrier 1 opens the lower part of adhesive body 5
Mouth covers, and its both ends is connect with the inner sidewall of adhesive body 5, and the top of adhesive body 5 is light-emitting surface 51, and light-emitting surface 51 is that year is wheeled
Setting, the centre of light-emitting surface 51 are convexly equipped with semicircular optically focused bulb 52, and the top of optically focused bulb 52 and light-emitting surface 51
Edge is concordant, and optically focused bulb 52 is corresponding with luminous bowl 3, and the light that light-emitting diode chip for backlight unit 2 issues passes through 3 inner wall of bowl that shines
It is gathered in the top of optically focused bulb 52 after refraction and exposes sending.To achieve the effect that increase light intensity, and shine uniformly, such as
This, so that the light emitting angle of light-emitting diode chip for backlight unit 2 and light distribution become controllable.
In addition, there is preferable antihunt action, greatly improve by the light-emitting diode chip for backlight unit 2 after sealing processing
The service life of chip, is readily transported and carries.
As shown in figure 3, carrier 1 is the plate structure that top has mounting groove comprising the insulating layer 11 that sets gradually and
Protective layer 12, light-emitting diode chip for backlight unit 2, the bowl 3 that shines setting light-emitting diode chip for backlight unit 2 and shine in 11 upper surface of insulating layer
Bowl 3 is mounted in mounting groove, and electrical route 4 passes through carrier 1 and protrudes into mounting groove electrically to be connected with light-emitting diode chip for backlight unit 2
It connects.
The setting of protective layer 12 can further protect chip, in addition, when needing to dismantle chip, it can be by removing carrier
Intact taking-up chip is encapsulated to disassemble, reaches the purpose of chip recycling, can recycle reduces cost, while
Avoid the waste of resource.
In the present embodiment, light-emitting diode chip for backlight unit 2 is electrically connected by the electrical route 4 on crystal-bonding adhesive 6 and carrier 1, institute
Stating electrical route 4 is flexible circuit board.Herein, the crystal-bonding adhesive 6 preferably conductive silver glue or tin cream or aeolotropic conductive,
In this way, also just eliminating the gold thread of tradition electric connection, material is not only saved, process is also reduced, improves production efficiency.
Certainly, according to the actual situation and specific requirements, in the other embodiments of the utility model, above-mentioned light-emitting diode chip for backlight unit 2 with
Electrical route 4 can be also electrically connected by other means, not limited uniquely herein.
The above is only the preferred embodiments of the present utility model only, is not intended to limit the utility model, all practical at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the guarantor of the utility model within novel spirit and principle
Within the scope of shield.
Claims (5)
1. a kind of light-emitting diode chip for backlight unit optically focused encapsulating structure, it is characterised in that: including carrier and be set on the carrier
Light-emitting diode chip for backlight unit and luminous bowl, the carrier are equipped with the electrical line being electrically connected with the light-emitting diode chip for backlight unit
Road, the luminous bowl is in isosceles trapezoid mesa-shaped, and the top surface area of the luminous bowl is greater than its base area, described to shine
Diode chip for backlight unit is located at the bottom of the luminous bowl, and the external plastic of the luminous bowl and carrier has to be made of light transmitting property
The adhesive body with lower openings, the carrier covers the lower openings of the adhesive body, and its both ends and the sealing
The inner sidewall of body connects, and the top of the adhesive body is light-emitting surface, and the light-emitting surface is year wheeled setting, in the light-emitting surface
Between be convexly equipped with semicircular optically focused bulb, and the top of the optically focused bulb is concordant with the edge of the light-emitting surface, described poly-
Photosphere head is corresponding with the luminous bowl, and the light that the light-emitting diode chip for backlight unit issues is reflected by the luminous bowl inner wall
It is gathered in the top of the optically focused bulb afterwards and exposes sending.
2. a kind of light-emitting diode chip for backlight unit optically focused encapsulating structure according to claim 1, it is characterised in that: the carrier is
Top has the plate structure of mounting groove, and the light-emitting diode chip for backlight unit and luminous bowl are mounted in the mounting groove, institute
It states electrically to be routed through the carrier and protrude into the mounting groove and be electrically connected with the light-emitting diode chip for backlight unit.
3. a kind of light-emitting diode chip for backlight unit optically focused encapsulating structure according to claim 1 or 2, it is characterised in that: the hair
Luminous diode chip is electrically connected by the electrical route on crystal-bonding adhesive and the carrier.
4. a kind of light-emitting diode chip for backlight unit optically focused encapsulating structure according to claim 3, it is characterised in that: the electrical property line
Road is flexible circuit board.
5. a kind of light-emitting diode chip for backlight unit optically focused encapsulating structure according to claim 1, it is characterised in that: the carrier packet
The insulating layer and protective layer set gradually is included, the light-emitting diode chip for backlight unit, the bowl that shines are arranged in the insulating layer upper surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821542944.1U CN208655694U (en) | 2018-09-20 | 2018-09-20 | A kind of light-emitting diode chip for backlight unit optically focused encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821542944.1U CN208655694U (en) | 2018-09-20 | 2018-09-20 | A kind of light-emitting diode chip for backlight unit optically focused encapsulating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208655694U true CN208655694U (en) | 2019-03-26 |
Family
ID=65793255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821542944.1U Active CN208655694U (en) | 2018-09-20 | 2018-09-20 | A kind of light-emitting diode chip for backlight unit optically focused encapsulating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208655694U (en) |
-
2018
- 2018-09-20 CN CN201821542944.1U patent/CN208655694U/en active Active
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