CN112259672A - Low-power LED lamp bead low-thermal-resistance packaging structure and packaging process - Google Patents
Low-power LED lamp bead low-thermal-resistance packaging structure and packaging process Download PDFInfo
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- CN112259672A CN112259672A CN202011139941.5A CN202011139941A CN112259672A CN 112259672 A CN112259672 A CN 112259672A CN 202011139941 A CN202011139941 A CN 202011139941A CN 112259672 A CN112259672 A CN 112259672A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses a low-power LED lamp bead low-thermal resistance packaging structure and a packaging process, and the technical scheme is as follows: the electrode assembly comprises a base, a supporting seat, a heat conduction device, a light-emitting assembly, an insulating sleeve and a protection assembly, wherein a first mounting groove is formed in the top of the base, the supporting seat is arranged on the inner wall of the first mounting groove, the supporting seat comprises a base plate, a second boss is fixedly mounted on the top of the base plate, a pad seat is fixedly mounted on the top of the second boss, a tangent plane is arranged on the top of the pad seat, first slots are formed in two sides of the pad seat, electrode pins are inserted into the inner walls of the first slots, and one ends of the electrode pins are fixedly mounted: the copper post bottom has been seted up the mounting groove four, and four inner wall fixed mounting in mounting groove have a heat pipe, and the mounting groove five has been seted up to the heat pipe inner wall, and five inner wall fixed mounting in mounting groove have a heat conduction post, and the fin I is evenly installed with heat conduction post outer wall to the heat pipe, and a fin gap department packs has heat dissipation silica gel, has the effect of the heat energy of release.
Description
Technical Field
The invention relates to the technical field of LED lamp bead packaging, in particular to a low-heat-resistance packaging structure and a low-heat-resistance packaging process for a low-power LED lamp bead.
Background
The LED has a series of advantages of small volume, all solid state, long service life, environmental protection, power saving and the like, is widely applied to light source modules such as automobile illumination, decorative illumination, mobile phone flash lamps, large and medium-sized NB (B-cell phone), LCD-TV (liquid crystal display-television) and the like, becomes one of the most promising high-technology fields in the 21 st century, has the advantages of energy conservation, long service life, maintenance-free, easy control, environmental protection and the like, is used as a new generation of green light source, and has the necessary characteristic of low-power LED (light emitting diode) in high light efficiency.
The prior art has the following defects: the electro-optic conversion efficiency of the existing LED is about 20% -30%, 70% -80% of energy is converted into heat energy which can not be released by radiation, and if packaging and heat dissipation are poor, the temperature of a chip is increased, so that uneven stress distribution, reduction of the luminous efficiency of the chip and reduction of the conversion efficiency of fluorescent powder are caused. When the temperature exceeds a certain value, the failure rate of the device will rise exponentially, so that how to adopt a proper packaging material and a packaging structure to realize optical control on the light emission of the LED is one of the important directions of research in the field of LED packaging at present.
The COB packaging process commonly used in the industry at present is as follows: the method comprises the steps of firstly using a dam adhesive box dam along the edge of a die bonding wire area on the surface of a substrate without die bonding wires, wherein the purpose of the box dam is to prevent fluorescent glue from flowing out in the subsequent glue sealing process to play a role of blocking glue, and finally sealing the fluorescent glue, wherein fluorescent powder has great influence on the attenuation of white light, cannot resist high temperature and is not suitable for being used for low-power LED lamp beads.
Therefore, the invention is necessary to provide a low-heat resistance packaging structure and a packaging process for a low-power LED lamp bead.
Disclosure of Invention
Therefore, the invention provides a low-power LED lamp bead low-thermal resistance packaging structure, which is characterized in that a fourth mounting groove is formed in the bottom of a copper column, a heat conducting pipe is fixedly mounted on the inner wall of the fourth mounting groove, a fifth mounting groove is formed in the inner wall of the heat conducting pipe, a heat conducting column is fixedly mounted on the inner wall of the fifth mounting groove, fins I are uniformly mounted on the outer walls of the heat conducting pipe and the heat conducting column, and a gap of the fins I is filled with heat-dissipating.
In order to achieve the above purpose, the invention provides the following technical scheme: a low-power LED lamp bead low-thermal resistance packaging structure comprises a base, a supporting seat, a heat conduction device, a light emitting component, an insulating sleeve and a protection component, wherein a first mounting groove is formed in the top of the base, the supporting seat is arranged on the inner wall of the first mounting groove, the supporting seat comprises a base plate, a second boss is fixedly mounted on the top of the base plate, a pad seat is fixedly mounted on the top of the second boss, a tangent plane is arranged at the top of the pad seat, a first slot is formed in each of two sides of the pad seat, an electrode pin is inserted into the inner wall of the first slot, one end of the electrode pin is fixedly mounted on the inner wall of the tangent plane, a second through hole is formed in the inner wall of the pad seat, the heat conduction device is inserted into the inner wall;
the heat conduction device comprises a bonding pad, the top of the bonding pad is provided with an angular cone groove, two sides of the bonding pad are provided with a second groove, two sides of the inner wall of the bonding pad seat are fixedly provided with a second bump, the bottom of the second bump is provided with a baffle ring, the baffle ring is fixedly arranged on the inner wall of the second through hole, the bonding pad is fixedly arranged on the top of the baffle ring, the second bump is inserted into the inner wall of the second groove, and the bottom of the bonding pad is fixedly provided with a;
the heat-conducting tube is characterized in that a fourth mounting groove is formed in the bottom of the copper column, a heat-conducting tube is fixedly mounted on the four inner walls of the mounting groove, a fifth mounting groove is formed in the inner wall of the heat-conducting tube, a heat-conducting column is fixedly mounted on the five inner walls of the mounting groove, a first rib is uniformly mounted on the outer wall of the heat-conducting column and the outer wall of the heat-conducting column.
Preferably, a first boss is fixedly mounted on the top of the base, first lugs are fixedly mounted on two sides of the top of the first boss, a first groove is formed in the top of the first lug, a limiting groove is formed in the top of the chassis, three groups of limiting grooves are formed in the limiting groove, a third mounting groove is formed in the bottom of the chassis, second slots are formed in two sides of the bottom of the second boss, third lugs are fixedly mounted on the inner walls of the third slots, the chassis is inserted into the inner wall of the first mounting groove, the second boss is inserted into the top of the first boss through the third mounting groove, and the first lugs are inserted into the inner walls of the.
Preferably, the bottom of the base is provided with a second mounting groove, the inner wall of the base is provided with a first through hole, the copper column penetrates through the second through hole and is inserted into the inner wall of the first through hole, the bottom of the copper column is provided with a metal heat sinking piece, and the metal heat sinking piece is fixed on the inner wall of the second mounting groove and fixedly connected with the outer wall of the bottom of the copper column.
Preferably, the light emitting assembly comprises a die, the die is fixedly mounted on the inner wall of the pyramid groove, silver adhesive is hot-melted at the joint of the die and the pyramid groove, a first chip and a second chip are fixedly mounted on the top of the die, a first gold wire and a second gold wire are arranged on the top of the first chip and the second chip, and resin colloid is coated on the top of the pyramid groove.
Preferably, the first chip and the second chip are electrically connected through a second gold wire, and the electrode pin, the first chip and the second chip are electrically connected through a first gold wire.
Preferably, the insulating sleeve comprises a bottom ring, the bottom of the bottom ring is mounted at the top of the chassis, the bottom of the bottom ring is fixedly provided with three groups of inserting strips, the inserting strips are inserted into the inner wall of the limiting groove, the top of the bottom ring is fixedly provided with a third boss, the third inner wall of the boss is provided with a third through hole, the third bottom of the boss is mounted at the top of the second boss and the outer wall of the pad seat is wrapped by the third inner wall of the through hole, and the third boss is equal to the pad seat in height.
Preferably, the first clamping grooves are formed in two sides of the top of the base, the second clamping grooves are formed in two sides of the top of the base plate and the two sides of the top of the boss, and the bottoms of the electrode pins are inserted into the inner walls of the first clamping grooves and the second clamping grooves.
Preferably, the protection component comprises a lens, a convex ring is fixedly mounted on the outer wall of the bottom of the lens, the convex ring is mounted at the top of the insulating sleeve, a bent buckle is fixedly mounted at the top of the base, the top of the bent buckle is higher than the top of the insulating sleeve, and the top of the convex ring is inserted into the inner wall of the bent buckle.
Preferably, the bottom of the copper column is provided with a mounting groove IV, and the four inner walls of the mounting groove are fixedly provided with aluminum columns.
A low-power LED lamp bead low-thermal resistance packaging process comprises the following operation steps:
the method comprises the following steps: cleaning the base, the supporting seat, the heat conduction device and the insulating sleeve by adopting ultrasonic waves, and drying to remove water vapor;
step two: the chassis is inserted in the inner wall of the first mounting groove, the first lug and the first groove are clamped on the inner walls of the second slot and the third lug by rotating the support seat, the pad and the copper column are inserted in the inner walls of the second through hole, the pad is mounted at the top of the baffle ring, the position of the pad is adjusted to enable the second groove to be buckled with the second lug, one ends of two groups of electrode pins are inserted in the inner walls of the first slot and fixed at the joint of the tangent plane and the pad, and the bottom ends of the electrode pins are mounted in a;
step three: the insulating sleeve is arranged on the top of the supporting seat, the boss III is connected with the boss II, the inserting strip is inserted into the limiting groove, and the through hole III wraps the pad seat to enable the boss III and the pad seat to be kept flat;
step four: turning over the device, inserting the heat conduction pipe into the four inner walls of the mounting groove of the copper column, inserting the heat conduction column into the five inner walls of the mounting groove of the heat conduction pipe, filling heat dissipation silica gel in the gap of the first fin piece, and installing the metal heat sink piece on the second inner wall of the mounting groove of the base to be welded with the bottom of the copper column;
step five: turning over the device, dispensing silver glue at the bottom of the die bonding, uniformly coating die bonding silica gel on the top of the die bonding, mounting the die bonding coated with a silver glue surface in a pyramid groove, independently mounting a chip I and a chip II on the top of the die bonding, monitoring the sintering temperature according to the sintering requirement, controlling the sintering temperature of the die bonding silica gel to be 150 ℃, curing the die bonding silica gel within 2 hours, discharging bubbles at the bottom of the chip, adjusting the sintering temperature to be 170 ℃, and curing the silver glue 410 within 1 hour;
step six: a first point is welded on a right electrode of a chip I, the first gold wire is pulled to an electrode pin and then pulled apart after a second point is welded on the electrode pin, a first point is welded on a left electrode of a chip II, the first gold wire is pulled to the electrode pin and then pulled apart after the second point is welded on the electrode pin, a first point is welded on the left electrode of the chip I, and the second gold wire is pulled to the electrode pin and then pulled apart after the second point is welded on the right electrode of the chip II;
step seven: the space formed by the section is filled with resin colloid, and the positive electrode and the negative electrode are completely blocked by the resin colloid, so that short circuit caused by conduction of the positive electrode and the negative electrode is avoided;
step eight: and injecting liquid epoxy into the lens, inserting the lens into the bottom of the buckle, putting the lens into an oven to cure the epoxy, and then removing the LED from the die cavity to form the LED.
The invention has the beneficial effects that:
1. the bottom of the copper column is provided with a fourth mounting groove, the inner wall of the fourth mounting groove is fixedly provided with a heat conduction pipe, the inner wall of the heat conduction pipe is provided with a fifth mounting groove, the inner wall of the fifth mounting groove is fixedly provided with a heat conduction column, fins I are uniformly arranged on the outer wall of the heat conduction column and the heat conduction pipe, a gap of the fins I is filled with heat dissipation silica gel, the heat conduction pipe and the fins I of the heat conduction column are mutually perpendicular to achieve the purposes of strengthening heat transfer and adjusting the temperature of the wall surface, no gap is reserved in surface contact of an inner hot surface to reduce contact thermal resistance, the heat exchange;
2. the chassis at the bottom of the supporting seat is inserted into the inner wall of the first mounting groove, the supporting seat is rotated to enable the first lug and the first groove to be clamped on the inner walls of the second slot and the third lug, the pad and the copper column are inserted into the inner walls of the second through hole, the pad is mounted at the top of the baffle ring, the position of the pad is adjusted to enable the second groove and the second lug to be buckled, the insulating sleeve is mounted at the top of the supporting seat, the third boss and the pad seat are kept flat, and the riveting mounting is adopted;
3. solid brilliant bonds the wafer at pyramid inslot wall through the elargol promptly, form heat path or electric path, resin colloid has been paintd to pyramid inslot top, this device adopts yellow light chip and blue light chip to realize white light, it adopts the resin colloid to be the material to abandon traditional phosphor powder, phosphor powder influences the decay of white light very big and high temperature resistant not applicable with low-power LED lamp pearl, the resin colloid increases LED's luminous flux, viscosity is little, easily take off the bubble, be fit for embedment and compression molding, make LED have better durability and heat resistance, the effect that increases LED high refractive index and high luminousness has.
Drawings
FIG. 1 is a schematic structural view of example 1 of the present invention;
FIG. 2 is a schematic view of a base structure according to embodiment 1 of the present invention;
FIG. 3 is a schematic bottom structure of a base according to embodiment 1 of the present invention;
fig. 4 is a schematic view of a supporting seat structure in embodiment 1 of the present invention;
fig. 5 is a schematic view of a bottom structure of a support seat in embodiment 1 of the present invention;
fig. 6 is a schematic view of the installation of the base and the supporting seat in embodiment 1 of the present invention;
fig. 7 is a schematic view of a base and support seat mounting structure according to embodiment 1 of the present invention;
FIG. 8 is a schematic view showing the structure of a heat conduction device in accordance with embodiment 1 of the present invention;
FIG. 9 is an exploded perspective view of a heat conduction device in accordance with embodiment 1 of the present invention;
FIG. 10 is a schematic view showing the installation of a heat transfer device according to example 1 of the present invention;
FIG. 11 is a schematic view of a heat conduction device and a light emitting device according to embodiment 1 of the present invention;
FIG. 12 is a schematic view showing the structure of the anatomical surface of the insulating sheath according to embodiment 1 of the present invention;
fig. 13 is a schematic view of an insulating bush mounting structure according to embodiment 1 of the present invention;
FIG. 14 is a schematic view of a lens structure according to embodiment 1 of the present invention;
FIG. 15 is a schematic view of a lens mounting structure according to embodiment 1 of the present invention;
fig. 16 is a schematic view of an aluminum column mounting structure according to embodiment 2 of the present invention.
In the figure: the heat-conducting chip comprises a base 100, a bent buckle 110, a first mounting groove 120, a first boss 130, a first bump 140, a first groove 141, a first through hole 150, a second mounting groove 160, a first clamping groove 170, a supporting seat 200, a chassis 210, a limiting groove 211, a second boss 220, a third mounting groove 221, a pad seat 230, a first slot 231, a section 232, a second through hole 240, a baffle ring 241, a second bump 242, a second slot 250, a third bump 251, an electrode pin 260, a second clamping groove 270, a heat-conducting device 300, a pad 310, a pyramid groove 311, a second groove 312, a copper column 320, a fourth mounting groove 321, a metal heat sink 330, a heat-conducting pipe 340, a first fin 341, a fifth mounting groove 342, a heat-conducting column 350, heat-radiating silica gel 360, an aluminum column 370, a light-emitting component 400, silver gel 410, a die-bonding 420, a first chip 430, a second chip 440, a first gold thread 450, a second gold thread 460, an insulating sleeve 500, a bottom ring 510, lens 620, convex ring 621.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
Embodiment 1, referring to fig. 1 to 15, the low thermal resistance package structure of a low power LED lamp bead provided by the present invention includes a base 100, a supporting seat 200, a heat conduction device 300, a light emitting device 400, an insulating sleeve 500, and a protection device 600, wherein the top of the base 100 is provided with a first mounting groove 120, specifically, the inner wall of the first mounting groove 120 is provided with the supporting seat 200, the supporting seat 200 includes a base plate 210, the top of the base plate 210 is fixedly provided with a second boss 220, the top of the second boss 220 is fixedly provided with a pad seat 230, the top of the pad seat 230 is provided with a cut surface 232, two sides of the pad seat 230 are provided with a first slot 231, the inner wall of the first slot 231 is inserted with an electrode pin 260, one end of the electrode pin 260 is fixedly installed on the inner wall of the cut surface 232, the inner wall of the pad seat 230 is provided with a second, the top of the insulating sleeve 500 is provided with a protection component 600, the first mounting groove 120 has a limiting effect on the chassis 210, the chassis 210 has a supporting effect on the second boss 220, the second boss 220 has a supporting effect on the soldering pan base 230, the tangent plane 232 has an effect of preventing overflow and deformation during dispensing on the resin colloid 610, the first slot 231 has a mounting effect on one end of the electrode pin 260, the electrode pin 260 has an effect of undertaking circuit leading-out of the first chip 430 and the second chip 440 and wiring with a peripheral circuit, the heat conduction device 300 has an effect of controlling and releasing heat energy of the first chip 430 and the second chip 440, the light-emitting component 400 is a component element of LED lamp bead electro-optic conversion and has an effect of improving luminous efficiency, the insulating sleeve 500 is made of ceramic and has the effects of corrosion resistance and high temperature resistance, and the, the thermal resistance and the electrode pins 260 are prevented from being oxidized, and the protection assembly 600 has a protection effect on the inner structure of the LED lamp bead;
the heat conduction device 300 comprises a bonding pad 310, wherein the top of the bonding pad 310 is provided with a pyramid groove 311, the two sides of the bonding pad 310 are provided with a second groove 312, the two sides of the inner wall of the bonding pad 230 are fixedly provided with a second bump 242, the bottom of the second bump 242 is provided with a baffle ring 241, the baffle ring 241 is fixedly arranged on the inner wall of the second through hole 240, the bonding pad 310 is fixedly arranged on the top of the baffle ring 241, the second bump 242 is inserted into the inner wall of the second groove 312, the bottom of the bonding pad 310 is welded with a copper column 320, the bonding pad 310 has a supporting effect on the light-emitting component 400, the pyramid groove 311 adopts a radioactive structure and has an effect of greatly improving the extraction rate of light in the LED, the second groove 312 has a limiting effect on the second bump 241, the baffle ring has a supporting effect on the bonding pad 310, the;
the bottom of the copper column 320 is provided with a mounting groove four 321, the inner wall of the mounting groove four 321 is fixedly provided with a heat conducting pipe 340, the inner wall of the heat conducting pipe 340 is provided with a mounting groove five 342, the inner wall of the mounting groove five 342 is fixedly provided with a heat conducting column 350, the outer walls of the heat conducting pipe 340 and the heat conducting column 350 are uniformly provided with a fin one 341, and the gap of the fin one 341 is filled with heat-radiating silica gel 360. concretely, the mounting groove four 321 has a mounting effect on the heat conducting pipe 340, the mounting groove five 342 has a mounting effect on the heat conducting column 350, the fin one 341 has the optimal fin thickness which enables the heat resistance to be minimum, the total heat resistance of the heat conducting pipe 340 and the heat conducting column 350 is reduced, the heat conducting pipe 340 and the fin one 341 of the heat conducting column 350 are mutually vertical to achieve the effects of strengthening heat transfer and adjusting the temperature of the wall surface, the fin one, the surface heat exchange thermal resistance is reduced, and the heat-radiating silica gel 360 is a heat-conducting gap filling material with low thermal resistance, high heat-conducting performance and high flexibility, and has the functions of filling gaps of the first fins 341, increasing the heat-conducting efficiency and dispersing heat;
further, a first boss 130 is fixedly installed on the top of the base 100, first bosses 140 are fixedly installed on two sides of the top of the first boss 130, first grooves 141 are formed in the top of the first bosses 140, limiting grooves 211 are formed in the top of the base plate 210, three sets of limiting grooves 211 are formed in the bottom of the base plate 210, second slots 250 are formed in two sides of the bottom of the second bosses 220, third bosses 251 are fixedly installed on the inner walls of the second slots 250, the base plate 210 is inserted into the inner walls of the first mounting grooves 120, the second bosses 220 are inserted into the top of the first bosses 130 through the third mounting grooves 221, the first bosses 140 are inserted into the inner walls of the second slots 250, and the first bosses 140 are inserted into the third bosses 251, specifically, the base 100 has the function of bearing internal elements, the first bosses 130 have a supporting function on the first bosses 140, the limiting grooves 211 have a limiting function on the inserting strips 520, the third mounting grooves, the first groove 141 has a limiting effect on the third bump 251, the first mounting groove 120 has a limiting effect on the chassis 210, the second boss 220 has a limiting effect on the first boss 130, and the base 100 and the support seat 200 are riveted to be convenient to detach and reutilize;
further, the bottom of the base 100 is provided with a second mounting groove 160, the inner wall of the base 100 is provided with a first through hole 150, the copper column 320 penetrates through the second through hole 240 and is inserted into the inner wall of the first through hole 150, the bottom of the copper column 320 is provided with a metal heat sink 330, the metal heat sink 330 is fixed on the inner wall of the second mounting groove 160 and is fixedly welded with the outer wall of the bottom of the copper column 320, specifically, the second through hole 240 and the first through hole 150 have a limiting effect on the copper column 320, the second mounting groove 160 has a limiting effect on the metal heat sink 330, the first through hole 150 and the second through hole 240 have a limiting effect on the copper column 320, the copper column 320 has a supporting effect on the metal heat sink 330, and the metal heat sink 330 has an effect of transferring;
further, the light emitting assembly 400 includes a die bond 420, the die bond 420 is fixedly installed on the inner wall of the pyramid groove 311, a silver adhesive 410 is hot-melted at the joint of the die bond 420 and the pyramid groove 311, a first chip 430 and a second chip 440 are fixedly installed on the top of the die bond 420, a first gold wire 450 and a second gold wire 460 are arranged on the tops of the first chip 430 and the second chip 440, a resin colloid 610 is coated on the top of the pyramid groove 311, specifically, the die bond 420 bonds the wafer on the inner wall of the pyramid groove 311 through the silver adhesive 410 to form a thermal path or an electrical path, which has the function of providing conditions for the connection of the first chip 430 and the second chip 440 in the subsequent sequence, the silver adhesive 410 is composed of 75-80% of silver powder, 10-15% of epoxy resin and 5-10% of additives, the silver adhesive 410 has the functions of fixing the die bond 420 and conducting electricity, the first chip 430 is a yellow chip, the second chip is a blue chip, the device realizes white light by, the traditional fluorescent powder adopts resin colloid 610 as a material, the fluorescent powder has great influence on the attenuation of white light, is not high temperature resistant and is not applicable to low-power LED lamp beads, the resin colloid 610 has high refractive index and high light transmittance, can increase the luminous flux of an LED, has small viscosity, is easy to bubble, is suitable for encapsulation and compression molding, and has the effects of ensuring that the LED has better durability and heat resistance;
further, the first chip 430 and the second chip 440 are electrically connected through the second gold wire 460, the electrode pin 260, the first chip 430 and the second chip 440 are electrically connected through the first gold wire 450, specifically, the first gold wire 450 has an effect of conducting the current of the electrode pin 260 to the first chip 430 and the second chip 440, the second gold wire 460 has an effect of connecting the first chip 430 and the second chip 440 in series, the purity of the first gold wire 450 and the second gold wire 460 is 99.99% of Au, the elongation is 2-6%, and the conductivity of the first gold wire 450 and the second gold wire 460 is stronger and is not oxidized, so that the first gold wire 450 and the second gold wire 460 can be recycled for a second time;
further, the insulating sleeve 500 comprises a bottom ring 510, the bottom of the bottom ring 510 is installed at the top of the chassis 210, the bottom of the bottom ring 510 is fixedly provided with three groups of inserting strips 520, the inserting strips 520 are inserted into the inner wall of the limiting groove 211, the top of the bottom ring 510 is fixedly provided with a third boss 530, the inner wall of the third boss 530 is provided with a third through hole 540, the bottom of the third boss 530 is installed at the top of the second boss 220, the inner wall of the third through hole 540 wraps the outer wall of the pad seat 230, the height of the third boss 530 is equal to that of the pad seat 230, specifically, the chassis 210 has supporting and limiting effects on the bottom ring 510, the inserting strips 520 have limiting effects on the limiting groove 211, the second boss 220 has supporting and limiting effects on the third boss 530, and the third through;
furthermore, the first clamping groove 170 is formed in two sides of the top of the base 100, the second clamping groove 270 is formed in two sides of the top of the base plate 210 and the second boss 220, the bottom of the electrode pin 260 is inserted into the inner walls of the first clamping groove 170 and the second clamping groove 270, specifically, the first clamping groove 170 and the second clamping groove 270 have a limiting effect on the electrode pin 260, and the first clamping groove 170 and the second clamping groove 270 have an insulating property;
further, protection component 600 includes lens 620, lens 620 bottom outer wall fixed mounting has bulge loop 621, bulge loop 621 installs at insulating cover 500 top, base 100 top fixed mounting has curved the knot 110, curved knot 110 top is higher than insulating cover 500 top, the grafting is detained 110 inner wall at the curve at bulge loop 621 top, concretely, lens 620 adopts epoxy to have the effect of the availability factor and the luminous efficiency of intensifying light for the material, bulge loop 621 detains 110 with curved the cooperation of detaining 110 and uses the effect that has fixed lens 620, curved knot 110 has spacing and clamping action to base 100, supporting seat 200, insulating cover 500 and protection component 600.
The working principle is as follows: when the invention is used, workers in the field need to insert the chassis 210 at the bottom of the support base 200 into the inner wall of the first mounting groove 120, rotate the support base 200 to enable the first bump 140 and the first groove 141 to be clamped on the inner walls of the second slot 250 and the third bump 251, insert the pad 310 and the copper column 320 into the inner wall of the second through hole 240, install the pad 310 on the top of the baffle ring 241, adjust the position of the pad 310 to enable the second groove 312 to be buckled with the second bump 242, insert one end of two groups of electrode pins 260 into the inner wall of the first slot 231 to be fixed at the joint of the tangent plane 232 and the pad 310, install the bottom ends of the electrode pins 260 into the second through hole 270 and the first slot 170, install the insulating sleeve 500 on the top of the support base 200 after the completion, connect the third boss 530 with the second boss 220, insert the insert strip 520 into the limiting groove 211, wrap the pad 230 by the third through hole 540, keep the third boss 530 and the pad, the heat conducting column 350 is inserted into the inner wall of the fifth mounting groove 342 of the heat conducting pipe 340, the gap of the first fin 341 is filled with heat radiating silica gel 360, the metal heat sink sheet 330 is mounted on the inner wall of the second mounting groove 160 of the base 100 and welded with the bottom of the copper column 320, after the process is finished, the device is turned over, the silver paste 410 is coated in the pyramid slot 311 of the bonding pad 310 to be adhered to the die bonding 420, the first chip 430 and the second chip 440 are mounted on the surface of the die bonding 420, the second gold thread 460 is connected with the first chip 430 and the second chip in a spot welding manner, the two ends of the first chip 430 and the second chip 440 are respectively connected with the electrode pins 260 in a spot welding manner through the first gold thread 450, then resin colloid 610 is coated in the tangent plane 232 to form a sealed cavity, the light emitting component 400 is coated in, the convex ring.
Example 2:
a low-power LED lamp bead low-thermal resistance packaging process comprises the following operation steps:
the method comprises the following steps: cleaning the base 100, the supporting seat 200, the heat conduction device 300 and the insulating sleeve 500 by using ultrasonic waves, and drying to remove water vapor;
step two: the chassis 210 is inserted into the inner wall of the first mounting groove 120, the support seat 200 is rotated to enable the first bump 140 and the first groove 141 to be clamped on the inner walls of the second slot 250 and the third bump 251, the bonding pad 310 and the copper column 320 are inserted into the inner wall of the second through hole 240, the bonding pad 310 is installed at the top of the baffle ring 241, the position of the bonding pad 310 is adjusted to enable the second groove 312 to be buckled with the second bump 242, one ends of two groups of electrode pins 260 are inserted into the inner wall of the first slot 231 and fixed at the connection part of the tangent plane 232 and the bonding pad 310, and the bottom ends of the electrode;
step three: the insulating sleeve 500 is installed at the top of the supporting seat 200, the third boss 530 is connected with the second boss 220, the inserting strip 520 is inserted into the limiting groove 211, and the third through hole 540 wraps the pad seat 230, so that the third boss 530 and the pad seat 230 are kept flat;
step four: turning over the device, inserting the heat conducting pipe 340 into the inner wall of the fourth mounting groove 321 of the copper column 320, inserting the heat conducting column 350 into the inner wall of the fifth mounting groove 342 of the heat conducting pipe 340, filling heat-dissipating silica gel 360 in the gap of the first fin 341, and installing the metal heat sink 330 in the inner wall of the second mounting groove 160 of the base 100 to be welded with the bottom of the copper column 320;
step five: turning over the device, dispensing silver glue 410 at the bottom of the die bond 420, uniformly coating die bond silica gel on the top of the die bond 420, installing the die bond 420 coated with the surface of the silver glue 410 in the pyramid groove 311, independently installing a chip I430 and a chip II 440 on the top of the die bond 420, monitoring the sintering temperature according to the sintering requirement, controlling the sintering temperature of the silver glue to be generally 150 ℃, enabling the die bond silica gel to be solidified within 2 hours of sintering time, discharging bubbles at the bottom of the chip, then adjusting the temperature to 170 ℃ and enabling the silver glue 410 to be solidified within 1 hour;
step six: bonding a first point on the electrode on the right side of the first chip 430, pulling the first gold wire 450 to the electrode pin 260, bonding a second point on the electrode on the left side of the second chip 440, and then tearing off the first gold wire 450, pulling the first gold wire 450 to the electrode pin 260, bonding a second point on the electrode on the left side of the first chip 430, bonding a first point on the electrode on the left side of the second chip 440, pulling the second gold wire 460 to the electrode on the right side of the second chip 440, bonding a second point on the electrode on the right side of the second chip 440, and then tearing off the first gold wire 450;
step seven: the space formed by the section 232 is filled with the resin colloid 610, and the positive electrode and the negative electrode are completely blocked by the resin colloid 610, so that short circuit caused by conduction of the positive electrode and the negative electrode is avoided;
step eight: liquid epoxy is injected into the lens 620, the lens is inserted into the bottom of the buckle 110, and the lens is placed into an oven to cure the epoxy, and then the LED is separated from the die cavity to be molded.
Example 3:
referring to fig. 16 in the specification, the low-power LED lamp bead low thermal resistance package structure of the embodiment further includes an aluminum pillar 370;
further, four 321 of mounting groove have been seted up to copper post 320 bottom, and four 321 inner wall fixed mounting of mounting groove have aluminium post 370, and is concrete, and four 321 of mounting groove have limiting displacement to aluminium post 370, and aluminium post 370 has conduction thermal efficiency and the thermal effect of dispersion to copper post 320, and aluminium post 370 has good heat conductivity and is difficult for the corrosion and reduce manufacturing cost's effect.
The implementation scenario is specifically as follows: workers in the art need to replace the aluminum pillars 370 with copper pillars 320 when using the present invention.
Although the invention has been described in detail above with reference to a general description and specific examples, it will be apparent to one skilled in the art that modifications or improvements may be made thereto based on the invention. Accordingly, such modifications and improvements are intended to be within the scope of the invention as claimed.
Claims (10)
1. The utility model provides a low power LED lamp pearl low thermal resistance packaging structure, includes, its characterized in that: the LED lamp comprises a base (100), a supporting seat (200), a heat conduction device (300), a light-emitting component (400), an insulating sleeve (500) and a protection component (600), wherein a first installation groove (120) is formed in the top of the base (100), the supporting seat (200) is arranged on the inner wall of the first installation groove (120), the supporting seat (200) comprises a chassis (210), a second boss (220) is fixedly installed on the top of the chassis (210), a pad seat (230) is fixedly installed on the top of the second boss (220), a section (232) is arranged on the top of the pad seat (230), first slots (231) are formed in two sides of the pad seat (230), electrode pins (260) are inserted into the inner walls of the first slots (231), one ends of the electrode pins (260) are fixedly installed on the inner wall of the section (232), a second through hole (240) is formed in the inner wall of the pad seat, the top of the heat conduction device (300) is provided with a light-emitting component (400), the top of the support seat (200) is inserted with an insulating sleeve (500), and the top of the insulating sleeve (500) is provided with a protection component (600);
the heat conduction device (300) comprises a bonding pad (310), the top of the bonding pad (310) is provided with an angular cone groove (311), two sides of the bonding pad (310) are provided with a second groove (312), two sides of the inner wall of the bonding pad seat (230) are fixedly provided with a second bump (242), the bottom of the second bump (242) is provided with a baffle ring (241), the baffle ring (241) is fixedly arranged on the inner wall of the second through hole (240), the bonding pad (310) is fixedly arranged on the top of the baffle ring (241) while the second bump (242) is inserted into the inner wall of the second groove (312), and the bottom of the bonding pad (310) is fixedly provided with a copper column (320;
copper post (320) bottom has been seted up mounting groove four (321), mounting groove four (321) inner wall fixed mounting has heat pipe (340), mounting groove five (342) have been seted up to heat pipe (340) inner wall, mounting groove five (342) inner wall fixed mounting has heat conduction post (350), fin one (341) are evenly installed with heat conduction post (350) outer wall in heat pipe (340), fin one (341) gap department packs has heat dissipation silica gel (360).
2. The low-power LED lamp bead low-thermal resistance packaging structure of claim 1, characterized in that: the base is characterized in that a first boss (130) is fixedly mounted at the top of the base (100), first bosses (140) are fixedly mounted on two sides of the top of the first boss (130), a first groove (141) is formed in the top of the first boss (140), a limiting groove (211) is formed in the top of the base plate (210), three groups of limiting grooves (211) are formed, a third mounting groove (221) is formed in the bottom of the base plate (210), a second slot (250) is formed in two sides of the bottom of the second boss (220), a third boss (251) is fixedly mounted on the inner wall of the second slot (250), the base plate (210) is inserted into the inner wall of the first mounting groove (120), the second boss (220) is inserted into the top of the first boss (130) through the third mounting groove (221), and the first bosses (140) are inserted into the inner wall of the second.
3. The low-power LED lamp bead low-thermal resistance packaging structure of claim 1, characterized in that: the bottom of the base (100) is provided with a second mounting groove (160), the inner wall of the base (100) is provided with a first through hole (150), the copper column (320) penetrates through the second through hole (240) and is inserted into the inner wall of the first through hole (150), the bottom of the copper column (320) is provided with a metal heat sinking sheet (330), and the metal heat sinking sheet (330) is fixed on the inner wall of the second mounting groove (160) and fixedly connected with the outer wall of the bottom of the copper column (320).
4. The low-power LED lamp bead low-thermal resistance packaging structure of claim 1, characterized in that: the light-emitting component (400) comprises a die bonding (420), the die bonding (420) is fixedly installed on the inner wall of the pyramid groove (311), silver adhesive (410) is hot-melted at the joint of the die bonding (420) and the pyramid groove (311), a first chip (430) and a second chip (440) are fixedly installed at the top of the die bonding (420), a first gold thread (450) and a second gold thread (460) are arranged at the tops of the first chip (430) and the second chip (440), and resin colloid (610) is coated at the top of the pyramid groove (311).
5. The low-power LED lamp bead low-thermal resistance packaging structure of claim 4, characterized in that: the first chip (430) is electrically connected with the second chip (440) through a second gold wire (460), and the electrode pin (260), the first chip (430) and the second chip (440) are electrically connected through a first gold wire (450).
6. The low-power LED lamp bead low-thermal resistance packaging structure of claim 1, characterized in that: insulating cover (500) include end ring (510), install at chassis (210) top bottom end ring (510), end ring (510) bottom fixed mounting has cutting (520), cutting (520) are equipped with three groups, cutting (520) are pegged graft at spacing groove (211) inner wall, end ring (510) top fixed mounting has boss three (530), through-hole three (540) have been seted up to boss three (530) inner wall, boss three (530) bottom is installed at boss two (220) top and through-hole three (540) inner wall parcel pad seat (230) outer wall, boss three (530) and pad seat (230) height phase are equal.
7. The low-power LED lamp bead low-thermal resistance packaging structure of claim 1, characterized in that: the electrode structure is characterized in that a first clamping groove (170) is formed in two sides of the top of the base (100), a second clamping groove (270) is formed in two sides of the tops of the base plate (210) and the second boss (220), and the bottoms of the electrode pins (260) are inserted into the inner walls of the first clamping groove (170) and the second clamping groove (270).
8. The low-power LED lamp bead low-thermal resistance packaging structure of claim 1, characterized in that: the protection component (600) comprises a lens (620), a convex ring (621) is fixedly mounted on the outer wall of the bottom of the lens (620), the convex ring (621) is mounted at the top of the insulating sleeve (500), a bent buckle (110) is fixedly mounted at the top of the base (100), the top of the bent buckle (110) is higher than the top of the insulating sleeve (500), and the top of the convex ring (621) is inserted into the inner wall of the bent buckle (110).
9. The low-power LED lamp bead low-thermal resistance packaging structure of claim 1, characterized in that: and a fourth mounting groove (321) is formed in the bottom of the copper column (320), and an aluminum column (370) is fixedly mounted on the inner wall of the fourth mounting groove (321).
10. A low-power LED lamp bead low-thermal resistance packaging process is characterized by comprising the following operation steps:
the method comprises the following steps: cleaning the base (100), the supporting seat (200), the heat conduction device (300) and the insulating sleeve (500) by adopting ultrasonic waves, and drying to remove water vapor;
step two: the chassis (210) is inserted into the inner wall of the first mounting groove (120), the first bump (140) and the first groove (141) are clamped on the inner walls of the second slot (250) and the third bump (251) by rotating the support seat (200), the pad (310) and the copper column (320) are inserted into the inner wall of the second through hole (240), the pad (310) is mounted at the top of the baffle ring (241), the position of the pad (310) is adjusted to enable the second groove (312) to be buckled with the second bump (242), one ends of two groups of electrode pins (260) are inserted into the inner wall of the first slot (231) and fixed at the joint of the tangent plane (232) and the pad (310), and the bottom ends of the electrode pins (260) are mounted in the second slot (270) and the first slot (170);
step three: the insulating sleeve (500) is arranged at the top of the supporting seat (200), the boss III (530) is connected with the boss II (220), the inserting strip (520) is inserted into the limiting groove (211), and the through hole III (540) wraps the pad seat (230), so that the boss III (530) and the pad seat (230) are kept flat;
step four: turning over the device, inserting the heat conducting pipe (340) into the inner wall of the fourth mounting groove (321) of the copper column (320), inserting the heat conducting column (350) into the inner wall of the fifth mounting groove (342) of the heat conducting pipe (340), filling heat-dissipating silica gel (360) in the gap of the first fin (341), and installing the metal heat sink sheet (330) on the inner wall of the second mounting groove (160) of the base (100) to be welded with the bottom of the copper column (320);
step five: turning over the device, dispensing silver colloid (410) at the bottom of a solid crystal (420), uniformly coating solid crystal silica gel on the top of the solid crystal (420), installing the solid crystal (420) coated with the silver colloid (410) in a pyramid groove (311), independently installing a chip I (430) and a chip II (440) on the top of the solid crystal (420), monitoring the sintering temperature according to the sintering requirement, controlling the sintering temperature of the solid crystal silica gel to be generally 150 ℃, solidifying the solid crystal silica gel within 2 hours of sintering time, discharging bubbles at the bottom of the chip, then adjusting the temperature to 170 ℃, and solidifying the silver colloid (410) within 1 hour of sintering time;
step six: a first point is welded on the electrode on the right side of the chip I (430), the gold wire I (450) is pulled to the electrode pin (260) and is pulled apart after a second point is welded on the electrode, a first point is welded on the electrode on the left side of the chip II (440), the gold wire I (450) is pulled to the electrode pin (260) and is pulled apart after the second point is welded on the electrode, the first point is welded on the electrode on the left side of the chip I (430), and the gold wire II (460) is pulled to the electrode on the right side of the chip II (440) and is pulled apart after the second point is welded on the electrode on the right side of the chip I (440);
step seven: the space formed by the section (232) is filled with the resin colloid (610), and the positive electrode and the negative electrode are completely blocked by the resin colloid (610), so that short circuit caused by conduction of the positive electrode and the negative electrode is avoided;
step eight: and injecting liquid epoxy into the lens (620), inserting the lens into the bottom of the bent buckle (110), placing the lens into an oven to cure the epoxy, and then removing the LED from the die cavity to form the LED.
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| CN113380479A (en) * | 2021-06-09 | 2021-09-10 | 深圳市科敏传感器有限公司 | High-temperature-resistant waterproof chip type high-molecular NTC thermistor |
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