CN210535689U

CN210535689U - High light efficiency LED packaging structure

Info

Publication number: CN210535689U
Application number: CN201921776344.6U
Authority: CN
Inventors: 李福忠; 岳建平; 刘江涛; 刘志顺
Original assignee: Shandong Sanjing Lighting Science & Technology Co ltd
Current assignee: Shandong Sanjing Lighting Science & Technology Co ltd
Priority date: 2019-10-22
Filing date: 2019-10-22
Publication date: 2020-05-15
Anticipated expiration: 2029-10-22

Abstract

The utility model relates to a high light efficiency LED packaging structure, which comprises a base, an LED chip, a pole foot, a sealing structure and a heat dissipation structure, wherein the center of the base is provided with a partition layer, the center of the partition layer is provided with a chip groove, the periphery of the chip groove is provided with a sealing groove, and the center of the chip groove is provided with a clamping hole which is communicated with the lower part of the partition layer; the LED chip is arranged in the chip groove, and the pole foot penetrates through the outer wall of the base and is clamped in the material sealing groove; the sealing structure comprises a lens and a sealing material, the lens is embedded in the sealing material groove, and the sealing material is filled between the partition layer and the lens; the heat dissipation structure comprises a copper heat conduction column, an aluminum heat dissipation thin plate and a heat dissipation sheet, wherein the heat conduction column is clamped in the clamping hole, and the heat dissipation thin plate is adhered to the bottom of the heat conduction column through heat conduction glue. The packaging structure above the high-luminous-efficiency LED packaging structure is tightly combined, the polar feet are firmly fixed, the stay wire welding spots are stable, the luminous efficiency and the heat dissipation efficiency are obviously improved, and the packaging structure is widely applied to packaging various LED semiconductor light-emitting chips.

Description

High light efficiency LED packaging structure

Technical Field

The utility model belongs to the technical field of the LED encapsulation, in particular to high light efficiency LED packaging structure.

Background

The current LED lamp packaging structure generally directly buckles an LED chip coated with epoxy resin sealing material with a lens coated with fluorescent powder, when the packaging structure works, the fluorescent powder is suspended after an air gap between the lens and the sealing material is heated, so that the light efficiency is reduced and the emergent light is uneven, and in addition, the defects of low heat sink heat dissipation efficiency of a metal block, easy looseness of a polar foot, wire pulling, desoldering and the like exist in the prior packaging technology.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is how to overcome prior art's above-mentioned defect, a high light efficiency LED packaging structure is provided.

In order to solve the technical problem, the high-luminous-efficiency LED packaging structure comprises a base, an LED chip, a pole foot, a sealing structure and a heat dissipation structure, wherein the LED chip, the pole foot, the sealing structure and the heat dissipation structure are arranged on the base, the base is a short plastic cylinder with a partition layer integrally formed in the center, a bowl-shaped chip groove is arranged in the center above the partition layer, an annular sealing material groove is arranged at the periphery of the chip groove, and a clamping hole communicated to the lower part of the partition layer is formed in the center of the chip groove; the LED chip is arranged in the chip groove, and the pole foot penetrates through the outer wall of the base and is clamped in the material sealing groove; the sealing structure comprises a lens and a sealing material, the lens is embedded in the sealing material groove, and the sealing material is filled between the partition layer and the lens; the heat dissipation structure comprises a copper heat conduction column, an aluminum heat dissipation thin plate and a heat dissipation sheet, the heat conduction column is clamped in the clamping hole, and the heat dissipation thin plate is adhered to the bottom of the heat conduction column through heat conduction glue.

Furthermore, the lower end of the base is provided with a sealing bottom plate, the center of the sealing bottom plate is provided with an air inlet leading to the outside, and the base is provided with a plurality of long groove-shaped exhaust holes in the circumferential direction on the outer wall below the partition layer.

Furthermore, the radiating fins are annularly and sequentially arranged on the lower surface of the radiating sheet, and the radial lengths of the radiating fins from inside to outside are sequentially shortened.

Furthermore, a short column is arranged in the material sealing groove, and a frustum-shaped stop head is arranged at the top end of the short column.

Furthermore, the inner side end of the pole foot is provided with a fixed arc-shaped inner sealing sheet, and the upper surface of the inner sealing sheet is provided with a sunken lead welding groove.

The sealing material comprises a dispensing material filled between the LED chip and the chip groove, a fluorescent powder sizing material covered above the LED chip and an epoxy resin curing agent filled between the lens and the fluorescent powder sizing material.

The utility model relates to a high light efficiency LED packaging structure top packaging structure combines closely, utmost point foot is fixed firm, the solder joint of acting as go-between is stable, and is showing improvement light efficiency and radiating efficiency, extensively is applicable to the encapsulation of all kinds of LED semiconductor light emitting chip.

Drawings

The utility model discloses high light efficiency LED packaging structure is explained further below with the attached drawing:

FIG. 1 is a schematic structural view of a main plane of the high luminous efficiency LED package structure;

FIG. 2 is a schematic top plan view of the high light efficiency LED package structure;

FIG. 3 is a schematic bottom plan view of the high luminous efficiency LED package structure;

FIG. 4 is a schematic view of a side-up view pin of the high luminous efficiency LED package structure;

FIG. 5 is a schematic view of a side-down view pin of the high luminous efficiency LED package structure;

FIG. 6 is a sectional view taken along line A-A of FIG. 4;

FIG. 7 is a partial structural schematic view of the high luminous efficacy LED package structure (without lens);

fig. 8 is a partial structural schematic view of the high luminous efficacy LED package structure (without the bottom plate).

In the figure:

1-a base; 11-partition layer, 12-chip groove, 13-sealing groove, 14-sealing bottom plate, 15-air inlet hole, 16-air outlet hole, 17-short column and 18-baffle head;

2-LED chip;

3-pole foot; 31-inner sealing sheet, 32-lead welding groove;

4-a sealing structure; 41-lens, 42-sealing material; 421-point sizing material, 422-fluorescent powder sizing material and 423-epoxy resin curing agent;

5-a heat dissipation structure; 51-heat conduction columns, 52-radiating thin plates and 53-radiating fins.

Detailed Description

As shown in fig. 1 to 8, the high light efficiency LED package structure includes a base 1, and an LED chip 2, a pole foot 3, a sealing structure 4 and a heat dissipation structure 5 which are arranged on the base 1, wherein the base 1 is a short plastic cylinder with a partition layer 11 integrally formed at the center, a bowl-shaped chip slot 12 is arranged at the center above the partition layer 11, an annular sealing material slot 13 is arranged at the periphery of the chip slot 12, and a clamping hole which leads to the lower part of the partition layer 11 is arranged at the center of the chip slot 12; the LED chip 2 is arranged in the chip groove 12, and the pole foot 3 penetrates through the outer wall of the base 1 and is clamped in the material sealing groove 13; the sealing structure 4 comprises a lens 41 and a sealing material 42, the lens 41 is embedded in the sealing material groove 13, and the sealing material 42 is filled between the partition layer 11 and the lens 41; the heat dissipation structure 5 comprises a copper heat conduction column 51, an aluminum heat dissipation sheet 52 and a heat dissipation fin 53, wherein the heat conduction column 51 is clamped in the clamping hole, and the heat dissipation sheet 52 is adhered to the bottom of the heat conduction column 51 through a heat conduction adhesive.

The lower end of the base 1 is provided with a sealing bottom plate 14, the center of the sealing bottom plate 14 is provided with an air inlet 15 leading to the outside, and the outer wall of the base 1 below the partition layer 11 is provided with a plurality of air outlets 16 in the shape of a long groove in the circumferential direction. The heat dissipation fins 53 are sequentially arranged on the lower surface of the heat dissipation sheet 52 in an annular shape, and the radial lengths of the heat dissipation fins 53 from the inside to the outside are sequentially shortened. The heat is diffused from inside to outside, from bottom to top and finally is dissipated through the exhaust hole, and meanwhile, the air is introduced through the air inlet hole to form heat dissipation airflow, so that the heat dissipation is facilitated.

A short column 17 is arranged in the material sealing groove 13, and a frustum-shaped stop head 18 is arranged at the top end of the short column 17. The short column and the stop head fix the pole foot on one side and attach the sealing material on the other side, so that the packaging firmness is improved.

The inner side end of the pole leg 3 is provided with a fixed arc-shaped inner sealing sheet 31, and the upper surface of the inner sealing sheet 31 is provided with a sunken lead welding groove 32. The inner sealing sheet is used for connecting the short column and is internally sealed in the base by the curing agent, and the lead welding groove is used for leading out spot welding from the pole pin on the chip.

The sealing material 42 includes a dispensing material 421 filled between the LED chip 2 and the chip slot 12, a phosphor glue 422 covering the LED chip 2, and an epoxy resin curing agent 423 filled between the lens 41 and the phosphor glue 422. The inner and outer optical structures formed by the lens 41 and the fluorescent powder are used for improving the luminous efficiency of emergent light of the LED chip.

The above embodiments are intended to be illustrative of the manner in which the invention may be made and used by persons skilled in the art, and modifications to the above embodiments will be apparent to those skilled in the art, and it is therefore intended that the invention, including but not limited to the above embodiments, be limited to any methods, processes and products consistent with the principles and novel and inventive features disclosed herein, and which are to be interpreted as illustrative and not in a limiting sense.

Claims

1. A high light efficiency LED packaging structure is characterized in that: comprises a base (1), an LED chip (2) arranged on the base (1), a pole foot (3), a sealing structure (4) and a heat dissipation structure (5), wherein,

the base (1) is a short plastic cylinder with a partition layer (11) integrally formed in the center, a bowl-shaped chip groove (12) is formed in the center above the partition layer (11), an annular sealing groove (13) is formed in the periphery of the chip groove (12), and a clamping hole which is communicated with the lower portion of the partition layer (11) is formed in the center of the chip groove (12);

the LED chip (2) is arranged in the chip groove (12), and the pole foot (3) penetrates through the outer wall of the base (1) and is clamped in the material sealing groove (13);

the sealing structure (4) comprises a lens (41) and a sealing material (42), the lens (41) is embedded in the sealing material groove (13), and the sealing material (42) is filled between the partition layer (11) and the lens (41);

the heat dissipation structure (5) comprises a copper heat conduction column (51), an aluminum heat dissipation sheet (52) and a heat dissipation sheet (53), the heat conduction column (51) is clamped in the clamping hole, and the heat dissipation sheet (52) is adhered to the bottom of the heat conduction column (51) through heat conduction glue.

2. The high light efficiency LED package structure of claim 1, wherein: the lower end of the base (1) is provided with a sealing bottom plate (14), the center of the sealing bottom plate (14) is provided with an air inlet (15) leading to the outside, and the base (1) is provided with a plurality of long groove-shaped exhaust holes (16) in the circumferential direction on the outer wall below the partition layer (11).

3. The high light efficiency LED package structure of claim 2, wherein: the radiating fins (53) are sequentially arranged on the lower surface of the radiating thin plate (52) in an annular shape, and the radial length of the radiating fins (53) from inside to outside is sequentially shortened.

4. The high light efficiency LED package structure of claim 3, wherein: a short column (17) is arranged in the material sealing groove (13), and a frustum-shaped stop head (18) is arranged at the top end of the short column (17).

5. The high light efficiency LED package structure of claim 4, wherein: the inner side end of the pole foot (3) is provided with a fixed arc-shaped inner sealing sheet (31), and the upper surface of the inner sealing sheet (31) is provided with a sunken lead welding groove (32).

6. The high light efficiency LED package structure of any one of claims 1 to 5, wherein: the sealing material (42) comprises a spot sizing material (421) filled between the LED chip (2) and the chip groove (12), a fluorescent powder sizing material (422) covered above the LED chip (2) and an epoxy resin curing agent (423) filled between the lens (41) and the fluorescent powder sizing material (422).